Ceramic adapter plate used for mounting large-size ceramic tube shell

A ceramic tube-shell, large-scale technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems affecting device reliability, fatigue, solder joint failure, etc., to reduce thermal expansion coefficient mismatch, reduce loss, The effect of reducing the installation area

Pending Publication Date: 2017-07-14
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, this thermal expansion mismatch will generate cyclic stress on the solder joints and lead to fatigue. The accumulation of fatigue damage in cycles will eventually lead to the failure of the solder joints and affect the reliability of the device.

Method used

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  • Ceramic adapter plate used for mounting large-size ceramic tube shell
  • Ceramic adapter plate used for mounting large-size ceramic tube shell
  • Ceramic adapter plate used for mounting large-size ceramic tube shell

Examples

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Embodiment Construction

[0017] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0018] The present invention provides a Figure 1 to Figure 3 The shown ceramic adapter plate for installation of large-size ceramic tube shells includes a ceramic substrate 1, a metal conduction layer is arranged on the front of the ceramic substrate 1, and the back of the ceramic substrate 1 is provided with such figure 1 As shown in the metal pin lead 2, the metal pin lead 2 communicates with the metal conduction layer. Its installation structure is as Figure 4 As shown, through the ceramic substrate 1 with pin grid array pin leads, the pin leads are used as a buffer structure for stress buffering to release the stress between the ceramic package 5 and the PCB board 4, which can effectively reduce the thermal expansion coefficient mismatch. At the same time, the lead-out method of pins and wires can effectively shorten the signa...

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Abstract

The invention discloses a ceramic adapter plate used for mounting a large-size ceramic tube shell, and relates to the ceramic packaging technology field. The ceramic adapter plate comprises a ceramic substrate. The front side of the ceramic substrate is provided with a metal conduction layer, and the back side of the ceramic substrate is provided with metal pin leads. The metal pin leads are communicated with the metal conduction layer. Reliability hidden troubles caused by a situation that the thermal expansion coefficient of a large-size ceramic tube shell and the thermal expansion coefficient of a PCB are mismatched can be effectively reduced, a signal transmission path can be shortened while the contour size of a large-size ceramic lead-free carrier is guaranteed, the loss is reduced, and the usage reliability is improved.

Description

technical field [0001] The invention relates to the technical field of ceramic packaging, in particular to a ceramic adapter plate used for installing large-size ceramic tube shells. Background technique [0002] Ceramic leadless chip carriers are suitable for surface mounting and feature high mounting density. Usually the ceramic shell is welded on the PCB board (printed circuit board) by lead-tin solder. Since the thermal expansion coefficient of alumina ceramics is about 7ppm / ℃, and the PCB board is about 16ppm / ℃, the thermal expansion coefficients of the two are quite different. That is, the thermal expansion of the two does not match. When the temperature environment changes, positional deformation will occur at the weld and mechanical stress will be generated, and the stress will be directly transmitted to the shell body. At the same time, this thermal expansion mismatch will generate cyclic stress on the solder joints and cause fatigue, and the accumulation of fatigu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498
CPCH01L23/49811
Inventor 于斐彭博
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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