Packaging structure of MEMS (Micro Electro Mechanical Systems) chip integration

Abstract

The invention discloses a packaging structure of MEMS (Micro Electro Mechanical Systems) chip integration. On an ASIC (Application Specific Integrated Circuit) chip, a silicon through hole is manufactured to lead signal output on the front side of the ASIC chip to the back surface of the ASIC chip, and the electrical interconnection of the ASIC chip and a base plate is realized through a metal re-wiring layer and solder bumps on the back surface. According to the way, a signal transmission path is reduced, meanwhile, a phenomenon that a lead bonding connection way requires an overlarge base plate area is avoided, and the size of the packaging structure is reduced. The front side of the MEMS chip and the front side of the ASIC chip are electrically connected directly through a metal lead to guarantee the minimum path of signal transmission and avoid introducing stray capacitance. Or a silicon through hole technology is used for leading the signal output on the front side of the MEMS chip to the back surface of the MEMS chip, then the electric interconnection of the MEMS chip and the ASIC chip is realized through the metal re-wiring layer and the solder bumps, furthermore, the signal transmission path is reduced, and the connection way of lead bonding is completely avoided so as to further reduce the size of the packaging structure of the chip.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a packaging structure for MEMS chip integration. Background technique [0002] Micro Electro Mechanical Systems (MEMS) refers to micro electromechanical systems that integrate micro sensors, actuators, signal processors, control circuits, interface circuits, communications and power supplies. To realize specific functions of the MEMS chip, an application specific integrated circuit (Application Specific Integrated Circuits, ASIC) chip is needed, and the ASIC chip processes the collected signals output by the MEMS. In MEMS packaging in the prior art, a single MEMS chip and ASIC chip are usually packaged based on a substrate to achieve corresponding functions, such as capacitive pressure sensors, capacitive temperature sensors, capacitive humidity sensors, MEMS microphones, and the like. [0003] Generally speaking, in order to obtain a larger capacitance output signal, red...

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Problems solved by technology

[0006] In view of the above problems, the present invention provides a package structure for MEMS chip integration, to solve the problem that the package size of existing MEMS chip integration is too large, and the signal input path is too long to introduce parasitic effects, which leads to the degradation of product performance.

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