Low dielectric glass composition, fibers, and article

A technology of glass composition and glass fiber, applied in glass manufacturing equipment, manufacturing tools, printed circuits, etc., can solve problems such as poor processability, mechanical properties and water resistance, inability to bond, and unsuitability for circuit boards

Pending Publication Date: 2019-08-16
AGY HOLDIG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, D glass has a higher melting temperature and poorer processability, mechanical properties and water resistance
Also, D-glass may not bond well to epoxy and often has streaks and bubble-like defects
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Method used

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  • Low dielectric glass composition, fibers, and article
  • Low dielectric glass composition, fibers, and article
  • Low dielectric glass composition, fibers, and article

Examples

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Embodiment

[0056] Example glass compositions prepared according to the invention are described below. The particular components and amounts thereof recited in these examples, as well as other conditions and details, should not be construed to unduly limit this invention. In these examples and throughout this specification, all percentages, proportions and ratios are by weight (mass) unless otherwise indicated.

[0057] Exemplary glass compositions of the present invention are shown in Tables 1-12 below. The liquidus temperature of the glass compositions of the embodiments is expressed as "T liq ", and the temperature at which the viscosity of the glass composition is 1000P is expressed as "T 3 " (also referred to as "T log 3" viscosity temperature). The liquidus temperature and T of the example glass compositions were measured for some glass compositions. 3 temperature, and calculations have been performed for other glass compositions. Glass fibers were formed using the example compo...

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Abstract

Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers andcompositions of the present invention may include between 45.0 to 58.0 weight percent SiO2; greater than 18.0 weight percent B2O3 and no more than 26.0 weight percent B2O3; greater than 16.0 weight percent AI2O3 and no more than 23.0 weight percent AI2O3; between 0.25 to 12.0 weight percent P2O5; greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO; less than 4.50 weight percent MgO; greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO; less than 0.80 weight percent Fe2O3; and less than 0.50 weight percent TiO2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius.

Description

Background technique [0001] This invention relates to glass compositions and fibers. More specifically, the present invention relates to glass compositions and fibers having low dielectric constants and low dissipation factors. In addition, the glass fiber of the present invention is preferably suitable for uses related to electronics-related equipment (for example, for reinforcing printed circuit board laminates, etc.). [0002] Modern electronic devices often include printed circuit boards reinforced with fiberglass. Many modern electronic devices, such as mobile or fixed wireless phones, computers, smartphones, tablets, etc., have electronic systems operating at high processing speeds and high or very high frequencies. When glass is exposed to such a high or ultra-high frequency electromagnetic field, the glass absorbs at least some energy and converts the absorbed energy into heat. The energy converted by glass into heat is called dielectric loss energy. The dielectric...

Claims

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Application Information

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IPC IPC(8): C03C13/00C03C3/118C03C4/16C03C3/091
CPCC03C3/091C03C3/097C03C4/14C03C13/003C03C4/00C03C13/00C03B37/01H05K1/0366C03C3/087C03C4/16C03C2203/10H05K1/0306H05K2201/01
Inventor 罗伯特·卢里·豪斯拉思安东尼·文森特·隆戈巴多布莱恩·吉恩·卢坡
Owner AGY HOLDIG CORP
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