Low dielectric glass composition, fibers, and article

Abstract

Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers andcompositions of the present invention may include between 45.0 to 58.0 weight percent SiO2; greater than 18.0 weight percent B2O3 and no more than 26.0 weight percent B2O3; greater than 16.0 weight percent AI2O3 and no more than 23.0 weight percent AI2O3; between 0.25 to 12.0 weight percent P2O5; greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO; less than 4.50 weight percent MgO; greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO; less than 0.80 weight percent Fe2O3; and less than 0.50 weight percent TiO2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius.

Description

Background technique [0001] This invention relates to glass compositions and fibers. More specifically, the present invention relates to glass compositions and fibers having low dielectric constants and low dissipation factors. In addition, the glass fiber of the present invention is preferably suitable for uses related to electronics-related equipment (for example, for reinforcing printed circuit board laminates, etc.). [0002] Modern electronic devices often include printed circuit boards reinforced with fiberglass. Many modern electronic devices, such as mobile or fixed wireless phones, computers, smartphones, tablets, etc., have electronic systems operating at high processing speeds and high or very high frequencies. When glass is exposed to such a high or ultra-high frequency electromagnetic field, the glass absorbs at least some energy and converts the absorbed energy into heat. The energy converted by glass into heat is called dielectric loss energy. The dielectric...

AI Technical Summary

Problems solved by technology

However, D glass has a higher melting temperature and poorer processability, mechanical properties and water resistance

Also, D-glass may not bond well to epoxy and often has streaks and bubble-like defects

Therefore, neither E-glass nor D-glass are suitable for use as reinforcing fibers in high-speed printed circuit boards, nor for boards operating at high or very high frequencies from about 100MHz to about 18GHz

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