A two-path
signal connection on a
printed circuit board, PCB, (210, 300, 320, 500), comprising: A first
signal track (212, 302, 322, 502, 504) for the transmission of high-speed electrical signals; a first solder pad (214, 304, 324, 402, 506, 510) of a first size, which is arranged above and connected to the first
signal track; a second solder pad (216, 306, 326, 404, 508, 512) of a second size, arranged above and connected to the first signal track, the second solder pad being separated from the first solder pad by a first gap; and a third solder pad (218, 308, 328, 406, 518, 520) of a third size, wherein the third solder pad is separated from the second solder pad by a second gap and connected to a second signal track (220, 310, 330, 514, 516); wherein the first and second solder pads serve to enable the simultaneous
soldering of a pin (312, 400) of an external connector to the first and second solder pads, so that when the pin of the external connector is soldered, the high-speed electrical signals are routed to the external connector; and wherein the second and third solder pads serve to enable the simultaneous
soldering of a conductor to the second and third solder pads, so that when the conductor is soldered, the high-speed electrical signals are routed to the second signal track.