233results about "Programmable/customizable/modifiable circuits" patented technology

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

A soldering board arrangement has a base board, which has a holding section that has a plurality of more than 100 soldering connection points for electrical contacting for a soldering board module. The holding section has soldering connection strips that differ from the soldering connection points. The strips extend outward from the direction of a center of the holding section, and allow soldering to corners of soldering board modules of different sizes.

Disclosed is a circuit substrate structure for protecting an area from being damaged. The structure includes a circuit substrate, wherein at least one of a top breakage-proof envelope and a bottom breakage-proof envelope covers components in a protected area of the circuit substrate. The top breakage-resistant encapsulation and the bottom breakage-resistant encapsulation are adhesively bonded to a surface of the circuit substrate, and a tear start point is added to a side of a periphery of the circuit substrate bordering a protection region including the at least one breakage-resistant encapsulation, the tear start point is positioned and configured to enable propagation of layering of the at least one inner layer of the circuit substrate and severing of the safety circuit when a removal force is applied to at least one of the top and bottom breakage-proof envelopes, and the tear start point is positioned and configured to enable propagation of layering of the at least one inner layer of the circuit substrate and severing of the safety circuit when a removal force is applied to at least one of the top and bottom breakage-proof envelopes.

The invention relates to an electrical connector (1, 10) comprising a flexible printed circuit board (2) comprising at least two electrical conductor tracks (3). The electrical connector according to the invention is characterized in that the electrical conductor tracks (3) each have at least two through-openings (4) designed to electrically conductively receive an electrical connecting element (7).

The device for applying a material to a substrate comprises a source substrate with at least one recess for receiving the material and at least one heating element. The heating element at least partially covers at least a bottom region and / or side surfaces of the recess. The heating element is electrically conductively connected to an electrical power supply. Each recess is assigned exactly one heating element. Using the device, a structure for a micro-LED can be printed.

The present invention relates to a Harness PCB that replaces the traditional wiring harness used in a pinball machine. The Harness PCB comprises circuit traces, connectors for all playfield components, LED assemblies, and connectors for device boards. The Harness PCB is attached to the bottom of the playfield and may comprise a single PCB or multiple interconnected PCBs. All playfield components, cabinet components, device boards, and LEDs are connected to the Harness PCB in such a manner that all components that may fail during normal operation are both modular and replaceable. The Harness PCB can be replicated by connecting the device boards directly to breakout boards to create an identical software and hardware environment as the full Harness PCB.

The description relates to prototyping systems, including hubs for electrically connecting devices. One example can include an electrically insulative substrate and at least two connector tabs defined by the substrate, each connector tab including a data contact, a power contact, and a ground contact positioned over the substrate. A data bus can be positioned relative to the substrate and electrically connect all of the data contacts, a power bus can be positioned relative to the substrate and electrically connect all of the power contacts, and a ground bus can be positioned relative to the substrate and electrically connect all of the ground contacts.

To provide a printed circuit board capable of maintaining normal functioning even when any defect occurs.SOLUTION: A printed circuit board includes a first wiring section including a plurality of first distribution lines, a first integrated circuit chip connected to one side of the first wiring section, the first integrated circuit chip configured to convert N signals (N is a natural number) into one signal, a second integrated circuit chip connected to the other side of the first wiring section, the second integrated circuit chip configured to convert one signal into N signals (N is a natural number), a wiring section 2-1 connected to the first integrated circuit chip and including a plurality of distribution lines 2-1, and a wiring section 2-2 connected to the second integrated circuit chip and including a plurality of distribution lines 2-2. When the number of the plurality of first distribution lines is X and the number of the plurality of distribution lines 2-1 is Y1, X, Y1 satisfy Y1 / N<X.SELECTED DRAWING: Figure 4

A device for replacing at least one chip or electronic element of an electronic component, in particular an LED package or an LED display, includes at least two standard electrical contacts to which a chip comprising at least two electrical contacts is electrically connectable. The device also includes an electronic switch electrically connecting the first standard electrical contact to an electrical power supply source, and least three electrical repair contacts to which a repair chip identical in construction to the chip is electrically connectable. The first electrical repair contact is electrically connected to the electrical power supply source. The second electrical repair contact is electrically connected to the electronic switch. The third electrical repair contact is electrically connected to the second electrical standard contact.

A method for providing an electrical connection comprises connecting a first cable to a first conductive structure on a printed circuit board, connecting a second cable to a second conductive structure on the printed circuit board, comparing the following two items: a propagation delay of a first signal path including the first cable and the first conductive structure on the printed circuit board, and a propagation delay of a second signal path including the second cable and the second conductive structure on the printed circuit board; and depending on the result of the comparison, removing conductive material of the first conductive structure and / or the second conductive structure so as to modify the electrical length of the first conductive structure and / or the second conductive structure to obtain a first conductive path and a second conductive path, thereby reducing the difference in propagation delay between the first signal path and the second signal path.

The present application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate of the present application includes an insulating layer, and electronic components and conductive connectors embedded inside the insulating layer. The conductive connectors are electrically connected to the electronic components; the conductive connectors include at least one fuse unit, and the fuse unit includes a fusible structure and two electrical connection ends. The fusible structure is connected between the two electrical connection ends along the electrical path direction of the conductive connector. The fusible structure is configured to fuse when the passing current exceeds a preset current threshold to disconnect the electrical connection between the electronic component and the external connection end. The present application has lower maintenance and replacement costs when preventing current burnout, and at the same time has a relatively compact volume.

Embodiments of the invention include a microelectronic device including a plurality of organic dielectric layers, a cavity formed in at least one of the plurality of organic dielectric layers, and a modular structure having first and second ports and a conductive member formed within the cavity. The conductive member provides modularity by being capable of connecting the first and second ports and also being capable of disconnecting the first and second ports.

A printed circuit board (PCB) pad pad for a three-pin metal oxide semiconductor field effect transistor (MOSFET) component includes four pads, wherein a split pad is used for a drain terminal of the MOSFET component. The PCB pad pad includes: a first pad to connect a gate terminal of the MOSFET component to a PCB; a second pad to connect a source terminal of the MOSFET component to the PCB; a third pad corresponding to connecting a drain terminal of the MOSFET component to the PCB; and a fourth pad to connect the drain terminal of the MOSFET component to the PCB (printed circuit board).

An electronic device according to one embodiment of the present disclosure comprises: a housing including a front plate providing the front surface of the electronic device, a rear plate providing the rear surface of the electronic device, and a side surface portion providing the side surface of the electronic device; a first support positioned between the front plate and the rear plate and connected to the side surface portion; a display which is positioned between the front plate and the first support, and which is visible through the front plate; a wireless communication circuit for transmitting or receiving a signal of a selected or designated frequency band through an antenna radiator; a camera module positioned between the first support and the rear plate; and a conductive pattern, which is positioned between the first support and the rear plate, at least partially overlaps with the camera module when viewed from above the rear plate, and is electrically connected to a ground of the electronic device, wherein some electromagnetic waves radiated from the antenna radiator toward the camera module can flow into the ground through the conductive pattern.

The invention relates to a method for creating a bus-type-independent electronics platform for a control electronics (1) of an electric drive, in particular a fluid pump, wherein the control electronics (1) for a plurality of variants of the fluid pump has a control electronics board (2) with a uniform board layout (3) and the board layout (3) has a connection pin pattern (4) with a plurality of connection pins (5), the fluid pump has a connector module (6) as an interface from the connection pin pattern (4) of the control electronics (1) to a pin pattern of a customer's vehicle electrical system, comprising the steps: - Providing all necessary connection pins (5) for all bus types to be covered in the connection pin pattern (4) of the PCB layout (3); - Arranging input pins (8) of the connector module (6) in an input pin pattern (9) corresponding to a connection pin pattern (5) of the control electronics board (2), in particular corresponding to a bus type to be contacted; - Arranging output pins (10) in an output pin pattern (11) of the connector module (6) corresponding to the pin pattern of a mating connector module of the customer's vehicle electrical system; - Transferring the input pin pattern (9) of the connector module (6) into the output pin pattern (11) of the connector module (6) within a connector module housing (13), wherein several conductor sections (14), each forming an input pin (8) of the connector module (6) at one end and an output pin (10) of the connector module (6) at the other end, are formed as stamped and bent parts, and the conductor sections (14) are overmolded or overmolded at least in an area between the input pins (8) and the output pins (10) to form a conductor section bundle (14).

The application discloses a detachable modular test platform, which comprises a gantry, a control box and a jig box, the jig box is installed at the bottom of the gantry, the control box is installed on one side of the gantry, the jig box is provided with a test area, the gantry is provided with a cylinder opposite to the test area, the control box is provided with a control assembly, and the jig box is provided with a test assembly; the control box is connected with an upper computer through the control assembly, the control assembly is connected with the test assembly to realize signal transmission, during testing, a sample to be tested is placed on the test area of the jig box, the upper computer sends a command to control the cylinder to extend a driving rod to the sample to be tested; the upper computer sends a command to the control assembly in the control box, different test conditions are provided, the test of the sample is completed, test data are output and uploaded to a server and saved. The application adopts a modular structure, reduces the volume, is convenient for detection and is suitable for various applications.

An electronic component carrier board includes a plurality of carrier plates, a plurality of insulating layers and a plurality of conductive members. The carrier plates are formed with a plurality of slots. The insulating layers are disposed between the carrier plates. The conductive members are made of conductive material and each is disposed in one of the slots. Each of the conductive members includes a tubular body that is inserted in a corresponding one of the slots and that defines a conductive space, and a pin body that is inserted in the conductive space and that is electrically connected with the tubular body. For each of the conductive members, at least one of the tubular body and the pin body is detachably disposed in the corresponding one of the slots.

A printed circuit board which can be used as an identical part embodied in different exterior lighting devices of a motor vehicle. The printed circuit board includes a first connecting interface and a second connecting interface, each for accommodating a plug for establishing an electrical connection between the printed circuit board and at least one component that is otherwise separate from the printed circuit board, this connection being used for the power supply and / or control of at least one component that is arrangeable on the printed circuit board, and the second connecting interface of the printed circuit board being arranged on the printed circuit board in a manner offset both translationally and rotationally relative to the first connecting interface of the printed circuit board.

A printed circuit board comprises a substrate as well as resistors and electrical connections disposed on the substrate. The substrate couples to a video graphics array connector that has pins, including video pins and return pins. A video pin transmits a video signal, and a return pin provides a ground for a corresponding video pin. The substrate has openings, where each opening can receive a pin. The resistors and the electrical connections couple to a subset of the pins to mimic an external video graphics array monitor. The resistors comprise: a red connection resistor that can couple a red video pin with a red return pin; a green connection resistor that can couple a green video pin with a green return pin; and a blue connection resistor that can couple a blue video pin with a blue return pin.

The invention provides a circuit board, a circuit board assembly and electronic equipment. The circuit board is used for arranging a first device or a second device, and is characterized by comprising a main board, a first type of bonding pad and a second type of bonding pad. And the first type of bonding pads and the second type of bonding pads are formed on the surface of the mainboard and are electrically connected with the mainboard. The first type of bonding pad comprises a first bonding pad and a first common bonding pad, and the second type of bonding pad comprises a second bonding pad and the first common bonding pad. The first common bonding pad comprises a first side and a second side, the first bonding pad and the second bonding pad are located on the first side and the second side respectively, and the first bonding pad and the first common bonding pad are arranged at intervals. The first bonding pad and the first common bonding pad are used for simultaneously connecting a first device, and the second bonding pad and the first common bonding pad are used for simultaneously connecting a second device. The circuit board provided by the invention can be adapted to different electronic devices, and the technical problem of low utilization rate of the circuit board in the prior art can be solved.

A body control device comprises a first circuit board, a plurality of first connectors, a communication control circuit, a second circuit board, a plurality of second connectors and a body control circuit. A size of the second circuit board is consistent with a size of the first circuit board. The communication control circuit is arranged on the first area of the first circuit board. The body control circuit is arranged on the second area of the second circuit board. The body control device can realize shell sharing of the communication control circuit and the body control circuit by setting the second circuit board and the first circuit board the same size and the communication control circuit and the body control circuit the same place. A vehicle is also provided.

A printed circuit board (PCB) having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, whereby the side landing pad comprises at least two landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in at least two different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, and an optoelectronic module based on such a printed circuit board and an according time of flight camera.

Systems and methods are disclosed for routing differential communication lines to different integrated circuits based on printed circuit board (PCB) unit variants. In one example, a system for routing signals comprises a location for mounting either a first resistor or a second resistor and another location for mounting either a third resistor or fourth resistor, the location for receiving either the first resistor or the second resistor being shaped such that, when populated with the first resistor, the first resistor is in a first orientation, and when populated with the second resistor, the second resistor is in a second orientation perpendicular to the first orientation.

A flexible interconnect circuit assembly and a method for manufacturing the same are provided. In some examples, the flexible interconnect circuit includes a plurality of integrally integrated circuit portions. During manufacturing, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected so that smaller sheets can be used for circuit manufacturing. The portions are then unfolded into the final design configuration. In some examples, the assembly also includes an adhesive film and a temporary support film attached to the adhesive film, such that two circuit portions at least partially overlap with the adhesive film and are located between the adhesive film and the temporary support film. In some examples, at least some of the circuit portions extend past the boundary of the adhesive film and are coupled to a connector.

The present invention relates to a pattern fuse including a flame retardant coating layer and an opening, the pattern fuse being configured to prevent fire outbreak due to overcurrent generated when a circuit pattern is operated and to designate a breakage position, a flexible printed circuit board including the same, and a battery module including the same, wherein it is possible to prevent fire outbreak even when the pattern fuse is heated to a high temperature as the result of operation of the pattern fuse, and the pattern fuse is broken by fusing at a specific position thereof.

There is provided a method (400) for implementing an electronic card (102). The method (400) can include providing the electronic card (102) with a printed circuit board. The method (400) further includes selecting one of a first side (101) and a second side (201) as a specified side on which only connection hardware is to be mounted. The first side is located at a first x-y plane and the second side (201) is located at a second x-y plane, the first and second x-y planes being separated by a length equal to a thickness of the PCB (301). The first and second x-y planes are parallel.

To provide a fuse element capable of shutting down an electric current while suppressing formation of carbide when an abnormal current occurs.SOLUTION: A fuse element 10 includes an insulative base material 3; a conductor layer 1 provided on a surface of the base material 3; and an insulative protective layer 4 provided on a surface of the conductive layer 1. The protective layer 4 has a specific heat of 1.1 J g-1 K-1 or more and a specific gravity of 1.0 g cm-3 or more.SELECTED DRAWING: Figure 1