The invention discloses a mixed packaging structure of an
integrated circuit chip, and relates to the technical field of
semiconductor chip packaging, the mixed packaging structure comprises an outer packaging layer, the outer packaging layer comprises a bottom fixing plate layer, the inner wall of the bottom fixing plate layer is sleeved with a
chip assembly, the chip
assembly comprises a chip main body, and the chip main body is provided with a plurality of through holes. The bottom end of the chip main body is electrically connected with a plurality of groups of pins, the outer walls of the plurality of groups of pins are sleeved with buffer pads, and the outer wall of the chip main body is sleeved with a sealing sleeve located below the buffer pads. When the radiator is installed on the mainboard, the
metal base of the radiator is attached to the outer wall of the upper
metal gland, and the upper
metal gland is pushed to slide on the inner wall of the bottom fixing plate layer, so that heat-conducting
silicone grease in the
material storage bag flows to the position between the
copper foil layer and the protruding strips; therefore, heat generated by the chip main body can be efficiently transmitted to the radiator.