Improved crimping type IGBT device

A press-fit, device technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of inconsistent driving voltage of a single chip, large stray inductance value of the driving circuit, and reducing the overall reliability of the device, etc. Achieve compact structure, improve work reliability, and small pressure difference

Inactive Publication Date: 2016-04-06
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2
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  • Abstract
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  • Application Information

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Problems solved by technology

Westcode's existing crimp-type IGBT devices lead out the auxiliary emitter at the bottom of the emitter metal plate of the device, which makes the stray inductance value of each drive circuit large and has a large difference, which causes a single chip drive Voltage inconsistency; in addition, due to the coupling capacitance between the gate PCB board and the bottom emitter copper board, it will also cause current oscillation between chips, thereby reducing the overall reliability of the device

Method used

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  • Improved crimping type IGBT device
  • Improved crimping type IGBT device
  • Improved crimping type IGBT device

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Embodiment Construction

[0030] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0031] In order to thoroughly understand the embodiments of the present invention, the detailed structure will be set forth in the following description. Obviously, the practice of the embodiments of the invention is not limited to specific details familiar to those skilled in the art. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments besides these detailed descriptions.

[0032] The outside of the high-power crimping type IGBT module provided by the present invention is composed of a tube case and two metal electrode plates arranged at the upper and lower ends of the tube case, and the inside is a power sub-module and corresponding bosses.

[0033] Such as Figure 4 As shown, the power sub-module includes an IGBT power sub-module and...

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Abstract

The invention provides an improved crimping type IGBT device. The improved crimping type IGBT device comprises a tube, and plate-shaped metal electrodes that are coaxially arranged at the upper and lower ends of the tube; a lug boss is fixed on the inner side face of the lower end metal electrode; IGBT power sub modules are crimped between the lug boss and the upper end metal electrode; each IGBT power sub module comprises a grid electrode signal input end and a gird electrode signal output end; the grid electrode signal input end is electrically connected with a grid electrode PCB that is parallel with the lower end metal electrode; and the grid electrode signal output end is electrically connected with an auxiliary emitting electrode PCB that is parallel with the lower end metal electrode. According to the technical scheme provided by the improved crimping type IGBT device, the stray inductance and stray capacitance of the auxiliary emitting electrode circuit are reduced, the consistency of the parameters of each IGBT power sub module driving circuit of the crimping type IGBT device is improved, and the risk of current oscillation among the IGBT power sub modules is reduced.

Description

technical field [0001] The invention relates to an IGBT device, in particular to a crimping type IGBT device which can reduce the stray inductance and stray capacitance of the auxiliary emitter loop. Background technique [0002] In the fields of electric power, transportation, metallurgy and other fields, the power electronic device IGBT has been widely used. In the field of flexible direct current transmission, the pressure-connected IGBT has the advantages of high power, short-circuit failure and easier series connection. [0003] Compared with the traditional welding IGBT module, the press-connect IGBT module has a small stray inductance, especially the emitter inductance has been greatly reduced. Westcode's existing crimp-type IGBT devices lead out the auxiliary emitter at the bottom of the emitter metal plate of the device, which makes the stray inductance value of each drive circuit large and has a large difference, which causes a single chip drive Inconsistency in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/739H01L21/331
CPCH01L29/7393H01L29/66325
Inventor 张朋李金元温家良唐新灵崔翔赵志斌
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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