Integrated semiconductor power assembly and pressing gauge thereof

Abstract

The invention discloses an integrated semiconductor power assembly, which comprises a bottom plate, a top plate and multiple twin-thread screws connected with the bottom plate and the top plate, wherein a first lower buckling piece and a second lower buckling piece are sequentially arranged above the bottom plate; a first upper buckling piece and a second upper buckling piece are sequentially arranged below the top plate; both the first upper buckling piece and the second lower buckling piece are provided with insulators; multiple water-cooled heat radiators are arranged between the two insulators; a power device is clamped between adjacent two water-cooled heat radiators; the adjacent two power devices are connected in series. The integrated semiconductor power assembly has the advantages of compact structure, little stray inductance, strong heat radiation ability and easy maintenance. The invention also discloses a pressing gauge for the integrated semiconductor power assembly, power assemblies with various ordinary sizes can be pressed, the precision of the pressed power assembly is high, and the rejection rate is low.

Description

technical field [0001] The invention belongs to the technical field of semiconductor installation, and in particular relates to an integrated semiconductor high-power component and a press-fit fixture thereof. Background technique [0002] Semiconductor high-power devices will generate a lot of heat when they are working, and generally need to install a radiator. [0003] When the existing high-power components are installed, a single set of power devices and radiators are mostly used for press-fitting, and then connected by busbars, which are realized through the combination of series and parallel. Such a scattered arrangement increases the stray inductance of the circuit, affects the function of the power device, and also increases the volume of the circuit, and the structure is complicated, which is not conducive to future maintenance. [0004] Integrating high-power components and heat sinks can solve this problem, but special equipment is required to position and clamp...

AI Technical Summary

Problems solved by technology

Such a dispersed arrangement increases the stray inductance of the circuit, affects the function of the power device, and also increases the volume of the circuit, and the structure is complicated, which is not conducive to future maintenance.

[0004] Integrating high-power components and heat sinks can solve this problem, but special equipment is required to position and clamp multiple sets of power devices, and to ensure that each set of power devices is fully attached to the water-cooled heat sink will undoubtedly increase Difficulty of pressing

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