Integrated semiconductor power assembly and pressing gauge thereof

A semiconductor and high-power technology, applied in the field of integrated semiconductor high-power components and their press-fit fixtures, can solve the problems of increasing circuit stray inductance, affecting the function of power devices, increasing the difficulty of press-fitting, etc., and achieving a compact structure , Easy maintenance, strong heat dissipation effect

Active Publication Date: 2015-03-04
中国船舶重工集团公司第七一二研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a dispersed arrangement increases the stray inductance of the circuit, affects the function of the power device, and also increases the volume of the circuit, and the structure is complicated, which is not conducive to future maintenance.
[0004] Integrating high-power components and heat sinks can solve this problem, but special equipment is required to position and clamp multiple sets of power devices, and to ensure that each set of power devices is fully attached to the water-cooled heat sink will undoubtedly increase Difficulty of pressing

Method used

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  • Integrated semiconductor power assembly and pressing gauge thereof
  • Integrated semiconductor power assembly and pressing gauge thereof
  • Integrated semiconductor power assembly and pressing gauge thereof

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Embodiment Construction

[0021] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0022] refer to figure 1 , figure 2 As shown, the present invention discloses an integrated semiconductor high-power assembly, including a bottom plate 11, a top plate 1, and four double-ended screws 12 connecting the bottom plate 11 and the top plate 1, and the top of the bottom plate 11 is sequentially provided with a first buckle. 9 and the second lower fastener 10, the bottom of the top plate 1 is provided with the first upper fastener 2 and the second upper fastener 3 in turn, and the first upper fastener 2 and the second lower fastener 10 are equipped with insulators 5 A plurality of water-cooled radiators 6 are installed between the two insulators 5, and a power device 7 is sandwiched between two adjacent water-cooled radiators 6, and the power device 7 is an integrated gate commutation Thyristor (IGCT), two adjacent 7 are connected in series, the f...

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Abstract

The invention discloses an integrated semiconductor power assembly, which comprises a bottom plate, a top plate and multiple twin-thread screws connected with the bottom plate and the top plate, wherein a first lower buckling piece and a second lower buckling piece are sequentially arranged above the bottom plate; a first upper buckling piece and a second upper buckling piece are sequentially arranged below the top plate; both the first upper buckling piece and the second lower buckling piece are provided with insulators; multiple water-cooled heat radiators are arranged between the two insulators; a power device is clamped between adjacent two water-cooled heat radiators; the adjacent two power devices are connected in series. The integrated semiconductor power assembly has the advantages of compact structure, little stray inductance, strong heat radiation ability and easy maintenance. The invention also discloses a pressing gauge for the integrated semiconductor power assembly, power assemblies with various ordinary sizes can be pressed, the precision of the pressed power assembly is high, and the rejection rate is low.

Description

technical field [0001] The invention belongs to the technical field of semiconductor installation, and in particular relates to an integrated semiconductor high-power component and a press-fit fixture thereof. Background technique [0002] Semiconductor high-power devices will generate a lot of heat when they are working, and generally need to install a radiator. [0003] When the existing high-power components are installed, a single set of power devices and radiators are mostly used for press-fitting, and then connected by busbars, which are realized through the combination of series and parallel. Such a scattered arrangement increases the stray inductance of the circuit, affects the function of the power device, and also increases the volume of the circuit, and the structure is complicated, which is not conducive to future maintenance. [0004] Integrating high-power components and heat sinks can solve this problem, but special equipment is required to position and clamp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/32
Inventor 李帆杨涛彭俊荣杨华李俊
Owner 中国船舶重工集团公司第七一二研究所
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