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248results about How to "Big image" patented technology

Displacement sensor

A displacement sensor comprising an imaging unit and an image processing unit. The imaging unit comprises a two dimensional imaging device and a drive control unit. The two dimensional imaging device includes a group of light receiving pixels arranged in a matrix so as to correspond to a field of view of a standard imaging unit, a plurality of vertical shift registers corresponding to different columns of the pixels, and a horizontal register for receiving the outputs of the vertical shift registers from top stages thereof, a photosensitive pixel region being defined in a prescribed horizontal band having a sufficiently narrower width than that would be provided by the total number of horizontal lines and interposed between a front optically black pixel region and a back optically black pixel region. The drive control unit controls, according to a commanded electric charge transfer protocol, a feeding of signal electric charges from each light receiving pixel to the vertical shift register of a corresponding column, a vertical transfer of signal electric charges in the vertical shift register of each column, and a horizontal transfer of signal electric charges in the horizontal shift register. The image processing unit comprises electric charge transfer protocol command means for giving an electric charge transfer protocol to the drive control unit of the imaging unit in dependence of a content of the image process.
Owner:ORMON CORPORATION

Radiation imaging device and system

An x-ray and gamma-ray radiation energy imaging device has its semiconductor detector substrate and semiconductor readout/processing substrate both mounted on opposite sides of, and electrically communicating through, an intermediate substrate. The substrates are all substantially planar with the top plan perimeter of the semiconductor readout/processing substrate falling within the top plan shadow perimeter of the corresponding semiconductor detector substrate with which it electrically communicates. Additionally, all of the readout/processing circuitry contacts of the semiconductor readout/processing substrate are disposed on the surface of the semiconductor readout/processing substrate that electrically communicates with the intermediate substrate. Substantially all electrical communication to and from the semiconductor readout/processing substrate is routed through the intermediate substrate. The intermediate substrate is a printed circuit board or similar construct. The electrical contacts between the semiconductor substrates and the intermediate substrate are accomplished using bump-bonds, conductive adhesive bonds, conductive adhesive films or a combination thereof. One or two dimensional planar arrays of semiconductor readout/processing substrates and corresponding semiconductor detector substrates can be mounted on a single intermediate substrate using “tiling” techniques known in the art to form a mosaic radiation imaging device of increased active imaging area and reduced/minimized imaging dead area.
Owner:OY AJAT LTD
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