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157 results about "Vertical transfer" patented technology

Vertical Transfer is actually transfer from a lower degree to higher degree i.e Undergrad to Postgrad or Postgrad to Doctorate. It is given to a select few exceptionally meritorious students on the basis of their performance over the course of their degree on recommendation of a Professor.

Method for making a five square vertical DRAM cell

Five square dynamic random access memory (DRAM) cell is prepared with a vertical transfer device with long channel length. In this construction, channel length is not affected by cell size scaling requirements.
Owner:IBM CORP

Charge transfer device and a driving method thereof and a driving method for solid-state image sensing device

A driving method for a solid-state image sensing device having a plurality of sensor portions being disposed two-dimensionally in a horizontal and a vertical directions, and a vertical charge transfer portion being disposed between said plurality of sensor portions and being provided with transfer electrodes of a plurality of systems disposed along its disposed direction, including the steps of; selectively applying high level driving pulses to the transfer electrodes of said plurality of systems in respective sectional periods in a vertical transfer period, and transferring the signal charges read out from said plurality of sensor portions in the vertical direction, wherein a sectional period in a vertical transfer period, in which the number of systems of the transfer electrodes to be applied with high level driving pulses becomes minimum is set longer than that of the other sectional periods. It is thus made possible to increase the handling charge quantity in the vertical charge transfer portion without changing time for transfer in the vertical transfer period.
Owner:SONY CORP

Image sensor with vertical transfer gate

An image sensor including a first pixel positioned between second and third pixels, each of the first, second and third pixels comprising a photodiode region surrounded by an isolation trench; a first charge transfer gate comprising a first column electrode surrounded by an insulating layer and positioned in an opening of the isolation trench between the first and second pixels, the first column electrode being configured to receive a first transfer voltage signal; and a second charge transfer gate including a second column electrode surrounded by an insulating layer and positioned in an opening of the isolation trench between the first and third pixels, the second column electrode being configured to receive a second transfer voltage signal.
Owner:STMICROELECTRONICS SRL

Image sensor with vertical transfer gate

An image sensor including a first pixel positioned between second and third pixels, each of the first, second and third pixels comprising a photodiode region surrounded by an isolation trench; a first charge transfer gate comprising a first column electrode surrounded by an insulating layer and positioned in an opening of the isolation trench between the first and second pixels, the first column electrode being configured to receive a first transfer voltage signal; and a second charge transfer gate including a second column electrode surrounded by an insulating layer and positioned in an opening of the isolation trench between the first and third pixels, the second column electrode being configured to receive a second transfer voltage signal.
Owner:STMICROELECTRONICS SRL

Solid state imaging device, driving method therefor, and imaging apparatus

A solid-state imaging device includes sensor areas, in each of the sensor areas, a plurality of pixel sensors are disposed in the vertical direction and in the horizontal direction. Two vertical transfer portions are formed across each pixel column including the plurality of pixel sensors in the vertical direction. A controller controls electric charges stored in the pixel sensors vertically adjacent to each other in each pixel column to be simultaneously read in different directions by the two vertical transfer portions, and also controls each of the two vertical transfer portions to add and transfer electric charges for the plurality of pixel sensors. With this configuration, the time required for a vertical transfer operation can be decreased, and the frame rate of the solid-state imaging device can be improved.
Owner:SONY CORP

Method for driving semiconductor device having capacitive load, method and apparatus for driving load, and electronic apparatus

When a signal is read from a CCD solid-state image pickup element, the CCD solid-state image pickup element is driven with at least two driving voltages so that high-speed reading is performed with generation of noise due to interference between the driving voltages reduced. The CCD solid-state image includes a charge storage section between a vertical transfer register and a horizontal transfer register. By performing the transfer of charge in the direction of columns during an effective transfer period of the transfer in the direction of rows, signal charge of one row generated by a light receiving sensor is transferred to the charge storage section, and by performing the transfer outside the effective transfer period in the transfer in the direction of the row, the signal charge of one row transferred to the charge storage section is transferred to the horizontal transfer register.
Owner:SONY CORP

Timing signal generating device and method of generating timing signals

A timing signal generating device to drive a solid-state image pickup device including a large number of photoelectric converter elements arranged in a matrix shape, a vertical transfer path arranged for each photoelectric converter element column in the vicinity thereof, and a horizontal transfer path connected to an end section of each vertical transfer path includes at least one rewritable storage in which stored information can be rewritten by an external controller and a timing signal generating section which can generate a sequence of a plurality of kinds of timing signals corresponding to an operation mode of the solid-state image pickup device according to data stored in the storage. Therefore, generating points of time, signal waveforms, and the like of various kinds of timing signals to drive a solid-state image pickup device can be easily changed according to specifications of devices using the solid-state image pickup device as an area image sensor.
Owner:FUJIFILM CORP

Image-pickup apparatus and method for reading accumulated signal changes through transfer lines

The present invention concerns an image-pickup apparatus and a method for driving the same, adapted for reading signal charges accumulated in a plurality of photodetection portions provided on a predetermined plane through vertical transfer lines and a horizontal transfer line. The image-pickup apparatus has the structure for establishing potential wells having a length not smaller than a vertical width of a horizontal line, in the vertical transfer lines, thereby permitting the horizontal width of the vertical transfer lines to be decreased. Since the image-pickup apparatus has the structure for establishing the plurality of potential wells having signal charges in the vertical transfer lines at a predetermined time, the signal charges can be transferred efficiently with keeping low driving speed of the vertical transfer lines.
Owner:NIKON CORP

Pixel arranging apparatus, solid-state image sensing apparatus,and camera

A solid-state image sensing apparatus including a solid-state image sensing device and a signal processing circuit. The solid-state image sensing device includes: a vertical transfer unit, composed of transfer columns corresponding to columns of the light-to-electric conversion elements, operable to transfer, in a vertical direction, signal charges read out from the light-to-electric conversion elements; a horizontal transfer unit operable to receive the signal charges from the vertical transfer unit and transfer them in a horizontal direction. The signal processing circuit converts the signal charges from the horizontal transfer unit into pixel data, and rearranges it into a two-dimensional array. In the rearrangement, the signal processing circuit, per transfer of one piece of pixel data, cyclically selects a line memory out of three line memories, writes a piece of pixel data into the selected line memory, or reads a row of pixel data from the selected line memory.
Owner:PANASONIC SEMICON SOLUTIONS CO LTD

Solid-state imaging device and manufacturing method thereof, driving method of solid-state imaging device, and electronic equipment

A solid-state imaging device includes multiple pixels formed of photoelectric converters and pixel transistors; a floating diffusion portion that exists within a region of each of the photoelectric converters when viewed from above; and a vertical transfer gate electrode of a transfer transistor that surrounds at least a portion of each photoelectric converter and is formed in the depth direction of a substrate and makes up the pixel transistor.
Owner:SONY CORP

Photoelectric converting film stack type solid-state image pickup device

A solid-state image pickup device comprises: a semiconductor substrate; at least one photoelectric converting film that generates signal charges corresponding to an amount of incident light; at least one set of pixel electrode films arranged in row and column directions and attached to said at least one photoelectric converting film; vertical transfer paths in the semiconductor substrate, extended in the column direction; and charge accumulating portions in the surface portion of the semiconductor substrate that accumulate signal charges from the pixel electrode films, wherein the charge accumulating portions comprise a plurality of sets, each comprising a subset of the charge accumulating portions arranged in the column direction, and wherein the subset reads out the accumulated signal charges to the corresponding one of the vertical transfer paths, and wherein the two adjacent subsets of the charge accumulating portions are shifted to each other in a direction along the vertical transfer paths.
Owner:FUJIFILM CORP

Solid-state image sensor efficiently utilizing its dynamic range and image pickup apparatus using the same

A solid-state image sensor includes photodiodes, which constitute pixels, shifted in position from each other and red (R), green (G) and blue (B) filter segments fitted on the photodiodes in a preselected pattern. R transfer gates, G transfer gates and B transfer gates each are connected to a particular vertical transfer electrode. Particular vertical drive pulses are fed to the electrodes to drive the transfer R, G and B transfer gates. Photodiode read pulses are applied to each of the electrodes at a particular timing on the basis of image signals output from the image sensor. Consequently, a signal charge generated in each photodiode is shifted to a particular vertical transfer path via the R, G or B transfer gate in accordance with color-by-color exposure time.
Owner:FUJIFILM CORP

Solid-state imaging apparatus for controlling a sweep transfer period in dependence upon the amount of unnecessary charges to be swept out

A solid-state image pickup apparatus includes a solid-state image sensor having photosensitive cells and vertical transfer paths. The cells are bidimensionally arranged for converting light incident from a subject via optics to electric charges corresponding to the light to store signal charges. The vertical transfer paths each adjoins the photosensitive cells arranged on a particular column for vertically transferring the signal charges. Before the signal charges are transferred from the cells to the vertical transfer paths, a sweep controller causes unnecessary charges on the vertical transfer paths to be swept out. The sweep controller controls a sweep transfer period necessary for the sweep transfer in dependence upon the amount of the unnecessary charges.
Owner:FUJIFILM CORP

Solid state image pickup device and its manufacture method

A solid state image pickup device is provided which includes: charge accumulation regions disposed in a semiconductor substrate in a matrix shape; a plurality of vertical transfer channels formed in the semiconductor substrate each in a close proximity to each column of the charge accumulation regions; vertical transfer electrodes formed above the vertical transfer channels; a channel protective impurity layer formed just under the vertical transfer channel and surrounding the charge accumulation region; one or more pixel separation impurity layers formed under the channel protective impurity layer and at a position facing the channel protective impurity layer; an overflow barrier region having a peak position of an impurity concentration at a position deeper than the pixel separation impurity layer, the peak position of the impurity concentration being at a depth of 3 μm or deeper from a surface of the semiconductor substrate; and a horizontal CCD for transferring signal charges transferred from the vertical transfer channels in a horizontal direction.
Owner:FUJIFILM CORP

Apparatus for transferring a stick with a strand of sausage or the like suspended therefrom

An apparatus for transferring a stick with a strand of sausage or the like suspended therefrom includes a transversely transferring device for transferring a stick from a first position to a second position by stick transverse transfer members; and a vertically transferring device having stick vertical transfer members which receive the stick from the stick transverse transfer members at the second position and deliver the stick to a conveyor device. The transversely transferring device has a stick transfer body having the stick transverse transfer members provided thereon, a rail body for supporting the stick transfer body and guiding its linear movement, and a transverse wrapping connector traveling body wound around and trained between transverse transfer wheels. A stick transfer body is adapted to be reciprocatingly moved by a transverse transfer electric motor.
Owner:HITEC

Solid-state image pickup element and image pickup apparatus using the same

A solid-state image pickup element has: a photoelectric converting film which is stacked above a semiconductor substrate; plural photoelectric converting elements which are arranged in the row direction and the column direction on the semiconductor substrate, and signal charge accumulating portions in which signal charges generated in the photoelectric converting film are accumulated; vertical transfer paths which are formed in the semiconductor substrate, and which transfer signal charges accumulated in the photoelectric converting elements and the signal charge accumulating portions, in the column direction; a horizontal transfer path which transfers the signal charges transferred from the vertical transfer paths, in the row direction; and an output section which outputs color signals corresponding to the signal charges transferred from the horizontal transfer path. The vertical transfer paths are formed so that two of them are disposed between the photoelectric converting elements adjacent to each other in the row direction, and between the signal charge accumulating portions, and they are formed so as to meander in the column direction between the columns.
Owner:FUJIFILM HLDG CORP +1

Imaging apparatus, adjustment method of black level, and program

An imaging apparatus according to the present invention is arranged with an OB level difference correcting unit for performing a process by sectionalizing a vertical pre-stage OB unit to a first region positioned on a side opposite to an effective pixel unit along a vertical transfer direction and a second region positioned on the effective pixel unit side and read out after the first region, and calculating a correction amount for correcting the OB level difference using a signal corresponding to a dark current obtained from the first region, and a correction table described with a relationship of a signal corresponding to the dark current generated in the vertical pre-stage OB unit and an OB level difference which is a difference between a black level in the vertical pre-stage OB unit and a black level of an image signal.
Owner:SONY CORP

Method for driving charge-transfer type solid-state image pick-up device and image pick-up method and apparatus using the same

A method for driving a charge-transfer type solid-state image pick-up device, wherein the charge-transfer type solid-state image pick-up device comprises: high sensitivity photoelectric conversion elements for executing photoelectric conversion with relatively high sensitivity; low sensitivity photoelectric conversion elements for executing photoelectric conversion with relatively low sensitivity; and vertical transfer channels for transferring signal charges from said high sensitivity photoelectric conversion elements and said low sensitivity photoelectric conversion elements, the method comprising a charge transfer step of individually reading / transferring first signal charges from said high sensitivity photoelectric conversion elements and second signal charges from said low sensitivity photoelectric conversion elements onto said vertical transfer channels, without executing a high speed charge transfer operation for the vertical transfer channels after exposure of said solid-state image pick-up device.
Owner:FUJIFILM CORP

Image sensor with boosted photodiodes for time of flight measurements

An image sensor including a photodiode, a first doped region, a second doped region, a first storage node, a second storage node, a first vertical transfer gate, and a second vertical transfer gate is presented. The photodiode is disposed in a semiconductor material to convert image light to an electric signal. The first doped region and the second doped region are disposed in the semiconductor material between a first side of the semiconductor material and the photodiode. The first doped region is positioned between the first storage node and the second storage node while the second doped region is positioned between the second storage node and the first doped region. The vertical transfer gates are coupled between the photodiode to transfer the electric signal from the photodiode to a respective one of the storage nodes in response to a signal.
Owner:OMNIVISION TECH INC

Equipment for identifying working height of device conveying system and its method

The invention discloses a device and method for identifying the working height of a device conveying system in a semiconductor device test handler, which uses a device with a simple structure to quickly and accurately measure and reset the working height of the semiconductor device conveying system . A device conveying system for picking up and conveying semiconductor devices is installed on a processor body and can move horizontally and vertically, and has a plurality of pickers for picking up semiconductor devices. A moving lifting block, a contact probe installed perpendicular to the lifting block and moving up and down according to the contact with the target below, a detection device for detecting the contact probe rising, and a driving device for driving the lifting block to move up and down .
Owner:MIRAE CORPORATION

Solid-state imaging device, method for manufacturing the same, method for driving the same, and electronic apparatus

A solid-state imaging device including: a substrate; a substrate voltage supply that applies a first potential to the substrate during a light receiving period and applies a second potential to the substrate during a no-light receiving period; and a plurality of pixels including a light receiving portion that generates signal charges in response to received light, a storage capacitor that stores and holds the signal charges, a dark current suppressing portion, an electronic shutter adjusting layer that adjusts potential distribution in a substrate so that the signal charges are swept to the rear surface side of the substrate, a readout gate portion that reads out the signal charges stored in the storage capacitor, and a vertical transfer register that transfers the signal charges read out by the readout gate portion in a vertical direction.
Owner:SONY SEMICON SOLUTIONS CORP

Solid state imaging device

A solid state imaging device includes: a plurality of photoelectric conversion elements which are arranged in a two-dimensional matrix on a semiconductor chip; vertical transfer registers including a vertical transfer channel and vertical transfer electrodes, respectively, for transferring signal charge read out of the photoelectric conversion elements in the vertical direction; a horizontal transfer register including a horizontal transfer channel and horizontal transfer electrodes for transferring the signal charge transferred from the vertical transfer registers in the horizontal direction; bus interconnects which are electrically connected to the vertical transfer electrodes and the horizontal transfer electrodes; and pads for external connection which are electrically connected to the bus interconnects. The pads are formed above the bus interconnects and the horizontal transfer electrodes.
Owner:COLLABO INNOVATIONS INC

Image capture apparatus

An image capture apparatus includes an image sensor, a determination unit which determines one image capturing mode, a driving unit which drives the image sensor by different driving methods in the respective image capturing modes, and a control unit which controls the operation of the driving unit. The image sensor includes a plurality of two-dimensionally arrayed pixels, a predetermined number of vertical output lines arranged for each array of pixels, and a holding memory which holds pixel signals from pixels on rows. The control unit drives the image sensor in the first power save mode when a horizontal transfer period is not less than twice a vertical transfer period, and drives the image sensor in the second power save mode when the vertical transfer period is not less than twice the horizontal transfer period.
Owner:CANON KK

Stacked image sensor pixel cell with in-pixel vertical channel transfer transistor

A pixel cell has a photodiode, a readout circuit, and a vertical transfer transistor. The photodiode is disposed within a first substrate of a first semiconductor chip for accumulating an image charge in response to light incident upon the photodiode. The readout circuit is disposed within a second substrate of a second semiconductor chip. The vertical transfer transistor is coupled between the photodiode and the readout circuitry to transfer the image charge from the photodiode to the readout circuitry.
Owner:SMARTSENS TECH (HK) CO LTD
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