Method for producing sheet type thermosensitive resistor

A technology of thermistor and manufacturing method, applied in resistance manufacturing, resistors, non-adjustable metal resistors, etc., can solve the problems of complex manufacturing process and high manufacturing cost, and achieve the advantages of simple manufacturing process, easy operation and shortening of manufacturing process. Effect

Inactive Publication Date: 2007-11-07
GUANGDONG FENGHUA ADVANCED TECH HLDG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, a method of manufacturing such a thermistor is described, which also has the disadvan

Method used

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  • Method for producing sheet type thermosensitive resistor
  • Method for producing sheet type thermosensitive resistor
  • Method for producing sheet type thermosensitive resistor

Examples

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Comparison scheme
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Example Embodiment

[0028] Example 1

[0029] As shown in Figures 2, 4, 5, 6, 8, and 9, the chip thermistor derived by the method disclosed in the present invention includes an insulating ceramic substrate 200, a back electrode 201, a surface electrode 202, and a thermistor The implementation methods of the layer 203, the protective layer 204, the terminal electrode 205, the middle electrode 206, and the outer electrode 207 are as follows:

[0030] (1) The surface of an insulating ceramic substrate 200 is grooved vertically and horizontally at a set interval to form a grooved surface with a continuous square grid. Set the longitudinal groove L2, the horizontal groove L3 and the groove surface as the front side , The back side of the grooved surface is the reverse side; (It should be noted that the overall characteristics of the same insulating ceramic substrate are the same, and the marking on which side is random. The setting of the grooved surface and the front and back here ...

Example Embodiment

[0043] Example 2

[0044] As shown in Figures 3, 4, 5, 7, 8, and 9, another chip thermistor derived from the method disclosed in the present invention includes an insulating ceramic substrate 200, a back electrode 201, a surface electrode 202, and a thermistor The layer 203, the protective layer 204, the end electrode 204, the middle electrode 206, and the outer electrode 207 are implemented as follows:

[0045] (1) The surface of an insulating ceramic substrate 200 is grooved vertically and horizontally at a set interval to form a grooved surface with a continuous square grid, and a vertical groove L2 and a horizontal groove L3 are set;

[0046] (2) Use the thick film screen printing method to print the conductive paste on the reverse side of the insulating ceramic substrate 200 with each unit grid as the reference, and form the layered back electrode 201 attached to both ends of the grid step by step. After conventional drying and sintering , To form a s...

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Abstract

This invention discloses a manufacturing method for slice thermal resistors, which prints a back electrode on the back of a marked slot side of an insulated ceramic chip, prints a face electrode on the slot side, then prints a thermal resisting layer and a protection layer with a thick film silk screen, which can reduce the processing time of slice thermal resistors effectively.

Description

technical field [0001] The invention relates to a method for manufacturing a thermistor of an electronic component, in particular to a method for manufacturing a chip thermistor. Background technique [0002] At present, there are many designs of chip thermistors disclosed in various forms. The main structure of these chip thermistors is (see attached drawing 1), a rectangular resistor body, coated with terminal electrodes and electroplated at both ends, and coated or not coated with a protective layer on the resistor body, which includes: resistor body 101 , glass encapsulation layer 102 , end electrode 205 , intermediate electrode 206 , and external electrode 207 . The manufacturing method of this type of chip thermistor includes the following steps: A: making a resistor body, the material is the oxides of transition metals Mn, Co, Cu, Ni, Fe, they are first mixed in a certain proportion and ground with a ball mill, and dried , and then pressed into tablets, sintered, an...

Claims

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Application Information

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IPC IPC(8): H01C7/00H01C7/02H01C7/04H01C17/065H01C17/00
Inventor 张瑞彬李志坚杨晓张远生杨星宇杨晓平李松肖平程华才
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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