The present invention discloses a
chip heater and its manufacturing process, including a carrier layer, a heating layer and a
copper foil
welding layer, the carrier layer has a plurality of carrier substrates arranged in sequence, each carrier substrate is composed of a high temperature resistant
glass fiber cloth and a
colloid layer positioned on the front of the high temperature resistant
glass fiber cloth; the heating layer is positioned on the front of the carrier layer, the
copper foil
welding layer is positioned on the back of the carrier layer, and the heating layer is also connected with the
copper foil
welding layer; a heating layer pattern is etched on the front of the heating layer, a welding layer pattern is etched on the back of the
copper foil welding layer, and a photosensitive
epoxy resin packaging layer is respectively encapsulated in the middle of the heating layer pattern and the middle of the welding layer pattern, and a
tin-plated layer is electroplated on the remaining parts of the heating layer pattern and the welding layer pattern. The
chip heater prepared by the present invention is not only novel and reasonable in structure, but also has low
power consumption,
high resistance value accuracy, high power stability, is not easily damaged by external forces, and has a long product service life.