Method for embedding capacitors in printed-circuit board and printed-circuit board adopted by method

A technology of printed circuit board and embedded capacitor

Active Publication Date: 2015-07-15
BOMIN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The embedded capacitor prepared by lamination technology has a simple process, but the process is limited by the material, and the capacitance density of the prepared embedded capacitor is low, and the material is currently expensive, and the cost of the prepared planar capacitor is higher than that of the surface mount. Capacitive components, and the capacitance accuracy is poor, it is difficult to control to within 15%; the process of embedding capacitors prepared by silk screen printing technology is more complicated than lamination technology, and the size and thickness uniformity of the screen printing plane are poorly controlled, so the production The accuracy of the capacitance value of the embedded capacitor is much lower than that of the lamination technology, and it cannot be applied to actual products at present

Method used

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  • Method for embedding capacitors in printed-circuit board and printed-circuit board adopted by method
  • Method for embedding capacitors in printed-circuit board and printed-circuit board adopted by method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] (1) Substrate production:

[0044] (a) Production of matrix 1: 1) The insulation material is cut, the resin in the insulation material is not fully cured, and is in a semi-cured state. The resin in the insulation material can be epoxy resin, phenolic resin or BT resin, etc., and the insulation material can contain Inorganic filler, reinforcement layer, etc., the reinforcement layer is preferably glass fiber cloth; 2) Paste the protective film, the bonding temperature is between 60°C and 150°C, the bonding temperature must be below the glass transition temperature of the insulating material, the protective film can It is polyester film, polyimide film, etc., and its thickness is between 5 μm and 100 μm; 3) Drilling, the drilling is a through hole, that is, the through hole runs through the upper and lower sides of the board, and the drilling can be done by mechanical drilling, It can be realized by laser drilling or punching. Laser drilling can be realized by infrared la...

Embodiment 2

[0051] A method for embedding capacitors in a printed circuit board of the present invention, its process is basically the same as that of Embodiment 1, the difference is that the preparation method of the base body 2 and the base body 3 and the way of stacking the plates during pressing are different in this embodiment .

[0052] The preparation method of the substrate 2 is specifically as follows: 1) Cutting the printed circuit board. The printed circuit board can be an insulating substrate, single-layer, double-layer or multi-layer board. The printed circuit board includes an insulating material and a metal layer. The resin has been completely cured. The resin in the insulating material can be epoxy resin, phenolic resin or BT resin. The insulating material can contain inorganic fillers, reinforcing layers, etc. The reinforcing layer is preferably glass fiber cloth. The metal layer can be made of copper, silver, etc. layer, gold layer, etc., preferably copper layer; 2) dril...

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Abstract

The invention discloses a method for embedding capacitors in a printed-circuit board and the printed-circuit board adopted by the method and belongs to the technical field of printed-circuit board manufacturing processes. According to the technical key point, the method comprises the following steps that (1) basic bodies are manufactured; (2) the basic body 1, the basic body 2, the basic body 3 and a metal layer are pressed by means of a multiple-layer board manufacturing process, one or more of the basic body 1, the basic body 2, the basic body 3 and the metal layer are combined and pressed to form a multiple-layer printed-circuit board, and the basic body 1 is arranged among the contact portions of the basic body 2, the basic body 3 and the metal layer; (3) drilling and metallization are performed; (4) outer-layer graph making is performed to form the multiple-layer printed-circuit board provided with multiple layers of embedded single capacitors and/or a multiple-layer single capacitor paralleled-connection structure. The method for embedding the capacitors in the printed-circuit board achieves accurate control of values of the embedded capacitors on the premise that additional cost is not needed to be increased, is simple in process and is used for manufacturing the printed-circuit board.

Description

technical field [0001] The invention relates to a preparation process of a circuit board, in particular to a method for embedding capacitors in a printed circuit board. The present invention also relates to a printed circuit board with the above-mentioned embedded capacitor. Background technique [0002] With the increasing maturity of electronic design technology, traditional printed circuit boards are gradually unable to meet the development needs of today's electronic products in the direction of short, light, thin and multi-functional modular integration. Therefore, the emerging technology of internal integration of passive device printed circuit boards has been derived. . Among them, the number of capacitors ranks first in the demand for passive devices, and embedded capacitor technology has become the top priority for many circuit board manufacturers in the field of passive device integration. There are three advantages of embedding capacitors into printed circuit bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/32H05K3/46H05K1/18
CPCH05K1/18H05K3/32H05K3/46
Inventor 黄勇陈世金任结达邓宏喜徐缓
Owner BOMIN ELECTRONICS CO LTD
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