80results about How to "Reduce the number of solder joints" patented technology

The invention provides an integrated micro heat exchanger which can complete drying filtering, throttling and phase-change heat transferring of a refrigerant in a single component and can be used as an evaporator and a condenser as well, and relates to an integrated micro heat exchanger component with drying filtering and throttling functions. The integrated micro heat exchanger component comprises a micro plate heat exchanger 1, a fluid connector 2, another fluid connector 3, a refrigerant connector 4, a drying filtering element 5, a micro throttling element 6, a refrigerant circulation hole 7, another refrigerant circulation hole 8 and a refrigerant connector 9. The micro plate heat exchanger 1 is an entity formed by arranging four plates, etched into flow passages of different shapes, according to a certain sequence prior to vacuum diffusion welding. The refrigerant circulation hole 7 and the refrigerant circulation hole 8 are formed by means of post processing in the side face direction after the micro plate heat exchanger 1 is welded together into the entity. The drying filtering element 5 and the micro throttling element 6 are mounted in the refrigerant circulation hole 7. The drying filtering element 5 is a molecular sieve filter formed by sintering, and the micro throttling element 6 is a short throttling pipe or a throttling orifice with micropores drilled in the middle.

The invention discloses a novel LTCC structure based ultra wide band balun. The LTCC structure based ultra wide band balun includes a ceramic glass substrate provided with an input port Pin, an inputconnection lead Lin, an output Pout1, an output port Pout2, a grounding layer GND1, a grounding layer GND 2, a transmission wire W1 and a transmission wire W2. The transmission wire W1 and the transmission wire W2 are arranged above the grounding layer GND1. A first groove C1, a second groove C2, a third groove C3 , a fourth groove C4 and a fifth groove C5 are formed in the grounding layer GND1 through itching. The fifth groove C5 is disposed below the transmission wire W1. The first groove C1 is disposed below the transmission wire W2. The third groove C3 is connected between a connection post H and the input port Pin. One end of the second groove C2 is connected with the first groove C1 and the other end of the second groove C2 is connected with the third groove C3. One end of the fourthgroove C4 is connected with the fifth groove C5 while the other end of the fourth groove C4 is connected with the third groove C3. The lower end of the wiring post is connected with the grounding layer GND1. The novel LTCC structure based ultra wide band balun provided by the invention is low in medium loss, high in Q value, high in packaging density, short in production cycle and low in production cost.

The invention discloses a substrate with embedded components and a manufacturing method thereof. The manufacturing method includes providing a first metal layer and an embedded component, the first metal layer has at least two first bumps, which are correspondingly connected to the embedded component; then, placing the embedded component in a buried hole in a core layer; providing A second metal layer, and the second metal layer has at least two second bumps, corresponding to the embedded element; after that, sequentially press the first metal layer, the core layer and the second metal layer, so that the two first The bump and the two second bumps are respectively electrically connected to the embedded components; finally, the first metal layer is patterned to form a first circuit layer; and the second metal layer is patterned to form a second circuit layer , and the embedded element is electrically connected between the first circuit layer and the second circuit layer.