2results about How to "Improving Impedance Bandwidth" patented technology

The application discloses a miniaturized multilayer capacitive coupling LTCC dual-frequency antenna, which comprises an LTCC substrate, four metal layers embedded in the LTCC substrate, and a feeding electrode, a rear auxiliary electrode, a left ground electrode and a right ground electrode packaged on the surface of the LTCC substrate. The LTCC substrate comprises five dielectric layers, and the four metal layers are sequentially stacked in the vertical direction and are separated by the dielectric layers between adjacent metal layers. The four metal layers comprise a first coupling patch and a second coupling patch, a third coupling patch, a first radiation plate and a second radiation plate. The first coupling patch and the third coupling patch are coupled with the first radiation plate through interlayer coupling to generate a first resonant frequency; and the second coupling patch and the second radiation plate are coupled through interlayer coupling to generate a second resonant frequency which is higher than the first resonant frequency. The application realizes dual-frequency operation in a small size by optimizing the antenna structure, and has the characteristics of simple structure, easy processing and stable performance.

This invention discloses a microwave and millimeter-wave circularly polarized antenna based on a SIW circular cavity, comprising a first dielectric substrate, a second dielectric substrate, a millimeter-wave radiating patch, a microwave radiating patch, a microwave feed patch, a metal via, a millimeter-wave SIW circular cavity, a metal ground plane, a microwave feed probe, a microwave feed network, and a millimeter-wave feed network. The upper surface of the first dielectric substrate is printed with the millimeter-wave radiating patch, the microwave radiating patch, and the microwave feed patch. The millimeter-wave radiating patch has a radiating slot, and the microwave feed patch and the microwave radiating patch are connected. The second dielectric substrate is located directly below the first dielectric substrate. The upper surface of the second dielectric substrate is printed with a metal ground plane, and feed slots and feed circular holes for the microwave feed probe to pass through are etched on the metal ground plane. The lower surface of the second dielectric substrate is printed with the microwave feed network and the millimeter-wave feed network. This invention has advantages such as multi-frequency operation, wide bandwidth, and dual circular polarization, and has certain potential in wireless communication applications.