7results about How to "Reduce wiring difficulty" patented technology

The application relates to the field of semiconductor technology and discloses an electromagnetic shielding chip stack packaging structure, which comprises a frame, a base island and a pin; a first chip is attached to the upper surface of the base island; a first plastic packaging layer covers the frame and the first chip and exposes the lower surface of the frame; a second chip is attached to the upper surface of the first plastic packaging layer; a second plastic packaging layer is arranged on the upper surface of the first plastic packaging layer in a stacked mode and covers the second chip; a vertical interconnection structure is located in the first plastic packaging layer and is electrically connected to the pin and the second chip at two ends; an electromagnetic shielding layer is located on the side wall surface of the first plastic packaging layer and the second plastic packaging layer; an electromagnetic shielding wire is located in the first plastic packaging layer and is electrically connected to the electromagnetic shielding layer; and a grounding wire is located in the first plastic packaging layer and is electrically connected to the grounding pin and the electromagnetic shielding layer at two ends. The structure can be applied to an existing lead frame and realizes electromagnetic shielding of multiple chips in the vertical direction.

The application relates to a display module preparation method and a display module. The display module preparation method comprises the following steps: S1, a liquid-repellent film with liquid repellency to underfill adhesive material is arranged on the front surface of a bonding module comprising a substrate, a chip array, a first electrode array and at least one second electrode, wherein the first electrode array is arranged on the front surface of the substrate, each chip of the chip array is respectively provided with a first chip electrode and a second chip electrode on the bottom surface and the top surface thereof, and the bottom surface of each chip is fixed to one first electrode; the liquid-repellent film covers the chips and covers the surface of the substrate; S2, underfill adhesive material is added between each chip; S3, the underfill adhesive material is solidified, and the part of the liquid-repellent film covering the second chip electrode is removed; and S4, a conductor is arranged, so that the second chip electrode of each chip is respectively electrically connected to the at least one second electrode through one conductor. The display module preparation method has the advantages that the underfill adhesive can be uniformly distributed, and the chips are not easily polluted.

The present application relates to the field of air conditioners, and provides an air conditioner and a control method thereof. The air conditioner comprises: an assembly component, the assembly component comprising an electrical box module and an electric heating module, the electric heating module being electrically connected with the electrical box module; and a shell, the assembly component being movable relative to the shell, the assembly component having a working position installed in the shell and a maintenance position extending out of the shell. The combination of the electrical box module and the electric heating module can complete the wiring of the electric heating module during pre-assembly, improve the assembly efficiency, thereby improving the production efficiency, reducing the wiring difficulty, and facilitating the air conditioner production and installation. Meanwhile, when the electric heating module needs to be maintained, the assembly component can be moved as a whole relative to the shell to the maintenance position, without disassembling the fan, so that the maintenance can be performed, thereby facilitating the maintenance and improving the maintenance efficiency.

The application provides an electromagnetic shielding packaging structure, which comprises a lead frame with a base island and a pin; a chip structure arranged on the surface of the base island; a plastic packaging layer arranged on the surface of the lead frame and covering the chip structure, wherein a first step groove is formed on the surface of the plastic packaging layer close to the lead frame, and the bottom surface of the first step groove is a certain distance away from the pin of the lead frame; an electromagnetic shielding layer arranged on the surface of the first step groove; an electromagnetic shielding wire arranged on the side of the chip structure away from the lead frame, and the electromagnetic shielding wire is electrically connected with the electromagnetic shielding layer; and a grounding wire, the two ends of the grounding wire are electrically connected with the electromagnetic shielding layer and the grounding pin respectively. Through the structure, the electromagnetic shielding structure can be formed by wire bonding in the lead frame packaging structure, and the electromagnetic shielding wires do not need to be grounded by direct contact, which can greatly reduce the wire bonding difficulty of the electromagnetic shielding wires.

This invention discloses a self-powered secondary-side drive power supply circuit, a startup control method, and a transformer device for a dual active bridge converter. The circuit includes a primary-side H-bridge, a transformer, a secondary-side H-bridge, a supporting capacitor, an energy harvesting circuit, and a secondary-side H-bridge drive circuit. The energy harvesting circuit draws power from the output of the secondary-side H-bridge, eliminating the need for an external low-voltage auxiliary power supply and enabling self-powered secondary-side operation. Furthermore, it eliminates the need for a separate isolation power supply module for each secondary-side switch, reducing wiring complexity. Since the secondary-side H-bridge and supporting capacitor are inherent to the dual active bridge converter structure, the energy harvesting circuit only needs to be connected in parallel across the supporting capacitor. Compared to adding auxiliary windings, this invention does not require transformer modification. The energy harvesting circuit utilizes the uncontrolled rectification stage of the secondary-side H-bridge as the power source for the startup stage, achieving self-powered operation of the secondary-side H-bridge drive circuit with a simple structural design.

This utility model discloses an enameled wire output mechanism based on a split-type enameling machine, including an upper slide rod and a lower slide rod distributed vertically at intervals. Multiple sets of guiding mechanisms are connected to the upper and lower slide rods, each set guiding a single enameled wire. Each guiding mechanism includes a first guiding component slidably connected to the lower slide rod and a second guiding component slidably connected to the upper slide rod. A vertical first mounting block is rotatably connected to the first guiding component, and a first guide wheel is rotatably connected to the first mounting block. A horizontal second mounting block is rotatably connected to the second guiding component, and a second guide wheel is rotatably connected to the second mounting block. This utility model can reduce the possibility of frictional damage to the enameled wire and reduce the difficulty for manufacturers in wiring the enameled wire.