Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

394results about How to "Reduce wiring difficulty" patented technology

Driving control method for LED display screen

The invention provides a driving control method for an LED display screen. The method comprises the steps of (a) broadcasting a screen configuration command by a sending card in the wireless mode, and enabling a plurality of receiving cards to control respective loading areas thereof to respectively display the hardware identifier of each receiving card and the loading area information thereof so as to generate a data allocation table, wherein the data allocation table contains a loading position number allocated to each receiving card; (b) storing the data allocation table in the sending card, selectively and wirelessly broadcasting data messages generated based on the data allocation table to the plurality of receiving cards so as to enable the receiving cards to read their respective loading position numbers; and (c) according to the data allocation table, conducting the splitting and packaging process of input video data by the sending card so as to obtain video data packets, wirelessly broadcasting the video data packets to the plurality of receiving cards, and enabling the receiving cards to receive corresponding video data packet and drive their respective loading areas to display the received data according to the hardware identifiers of the receiving cards and the loading position numbers thereof. In this way, a real LED display system in the wireless mode can be realized.
Owner:XIAN NOVASTAR TECH

Display substrate, manufacturing method thereof, crack detection method and display device

The invention discloses a display substrate, a manufacturing method thereof, a crack detection method and a display device, relates to the technical field of display, and aims at solving the problemsthat an existing crack detection mode is complex in operation and wiring difficulty in an edge area of a display screen is easily increased. The display substrate comprises a pixel unit and a data signal line, wherein the data signal line is used for writing a data voltage signal into the pixel unit. The display substrate further comprises an electrostatic discharge circuit, and the electrostaticdischarge circuit comprises a first electrostatic discharge line and a second electrostatic discharge line; a first electrostatic discharge sub-circuit which is connected with the data signal line andthe first electrostatic discharge line, wherein a connecting line included in the first electrostatic discharge sub-circuit is reused as a crack detection line, and the crack detection line is located in a peripheral area, surrounding the display area, in the display substrate and extends along the edge of the display substrate. The first electrostatic discharge sub-circuit is used for conductingthe connection between the data signal line and the first electrostatic discharge line when the crack detection line is broken in a detection period. The display substrate provided by the invention is used for displaying.
Owner:BOE TECH GRP CO LTD +1

FPGA (Field Programmable Gate Array) realization method for multi-code-length LDPC (Low Density Parity Check) code decoder on basis of hierarchical NMS (Network Management System) algorithm

The invention discloses an FPGA (Field Programmable Gate Array) realization method for a multi-code-length LDPC (Low Density Parity Check) code decoder on the basis of a hierarchical NMS (Network Management System) algorithm, which comprises the following steps of: 1) replacing a check matrix of which the code rate is 1/2 in a WiMax protocol to obtain a new check matrix, and keeping the performance of the original matrix; 2) applying the new check matrix into a parallel hierarchical iterative decoding structure, generating the read-write address of a storage unit in a decoder by an address generation module, and realizing the design of a multi-code-length decoder; and 3) designing a memory structure according to the characteristics of a QC (Quality Control)-LDPC code in the design, and simultaneously reading and writing in information in each path of parallel processing unit. With the FPGA realization method, the storage volume of updated information in the decoding process is reduced, the information updating speed is effectively improved, the decoder iteration times is reduced, the decoding time delay is greatly lowered by the design structure of the memory, and the decoding efficiency is improved. Meanwhile, wiring is simple by a fixed cable of a storage unit and an updating unit, and the hardware realization difficulty is lowered.
Owner:SUN YAT SEN UNIV

Submodule unit of voltage source transverter based on full control components

The invention provides a submodule unit of a voltage source transverter based on full control components. The voltage source transverter is a three-phase six-bridge structure. Each bridge arm comprises a plurality of submodules which are connected in series. Each submodule comprises electric power components such as a capacitor, insulated gate bipolar translators (IGBT) modules with a structure of a semi-bridge, wherein the capacitor and the IGBT modules are connected in parallel. The submodule unit of the voltage source transverter based on the full control components further comprises a main support structure, a support plate, a connecting water pipe, radiators and the like. The main support structure is used for supporting the electric power components of the submodule unit, the support plate, the connecting water pipe and the radiators. The support plate is perpendicular to a base of the main support structure. The support plate is provided with the two radiators which are symmetrically arranged. The radiators are connected through the connecting water pipe. Two IGBT modules of each submodule are respectively arranged on the two radiators. The bottom of the capacitor of the each submodule is fixed on the base of the main support structure through bolts. The submodule unit of the voltage source transverter based on the full control components is a self-contained electrical system, is capable of expanding according to the need of the system, and is independent in structure and convenient to install and transport.
Owner:GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2

Wafer level packaging MEMS chip structure and processing method thereof

The invention relates to a wafer level packaging MEMS chip structure and a processing method thereof, and the structure forms a cavity structure for the movement of a comb tooth microstructure of a device layer through the sequential bonding of a cap layer, the device layer and a substrate layer. Electrical signals in the packaging cavity are led out from the side surface of the structure by crossing a substrate bonding sealing ring by a first-layer lead of a double-layer metal lead arranged on the substrate layer; after metal eutectic bonding wafer-level vacuum packaging is completed, deep silicon etching is carried out at a position corresponding to a metal electrode on the back surface of a substrate wafer to form a through hole, a conductive material is used for filling the through hole or forming a conductive silicon column, and electrode leading-out is carried out on the back surface. The structure can be integrated with a signal processing circuit in a flip-chip bonding mode. Compared with a mode of manufacturing a TSV through hole in a packaging cavity for electrical lead-out, the problem of packaging air tightness caused by filling a cavity with an insulating medium is avoided, and the problems of temperature stability and reliability caused by mismatching of thermal expansion coefficients of a filling material and a silicon material are also avoided.
Owner:BEIJING INST OF AEROSPACE CONTROL DEVICES

Amplitude limiting device and method

The invention discloses an amplitude limiting device and an amplitude limiting method. The amplitude limiting device is used for calculating and limiting the operating amplitude of a telescopic arm of a telescopic arm frame type construction machinery vehicle, and comprises an ARM (Advanced RISC Machine) controller module, a tilting angle sensor module, a length measurement sensor module and a rotary coder module, which are connected through a CAN (Controller Area Network) bus. The amplitude limiting method comprises the following steps: obtaining the pitching angle of the telescopic arm, the rotary position angle of the telescopic arm and the arm length of the telescopic arm; according to the structural form, the pitching angle and the arm length of the telescopic arm, calculating the operating amplitude of the telescopic arm; according to the rotary position angle, looking up a corresponding amplitude limiting critical value in a pre-stored amplitude limiting critical value corresponding table; and according to the comparison result of the operating amplitude and the amplitude limiting critical value, limiting or warning the operating amplitude of the telescopic arm to guarantee the working safety of the construction machinery vehicle and avoid the roll-over accident.
Owner:INST OF AUTOMATION CHINESE ACAD OF SCI

COB packaging structure of light-emitting diode

The invention relates to a COB packaging structure of a light-emitting diode. The COB packaging structure comprises a substrate, n drive chips and n light-emitting diode chip sets, wherein each light-emitting diode chip set comprises N light-emitting diode chips, n and N are integers, n is larger than or equal to 1, N is larger than or equal to 1, the n drive chips and the n light-emitting diode chip sets are packaged on the front face of the substrate in a modular mode to form n sets of COB display modules, the n drive chips and the n light-emitting diode chip sets form lamp-driver co-plane devices in a one-to-one connection mode, a fixed number of bonding pads are arranged on the back face of the substrate, and all the drive chips and all the light-emitting diode chip sets are communicated with the bonding pads on the back face of the substrate in a routing and hole passing mode. The n lamp-driver co-plane devices are packaged to form a new COB device, the number of the bonding pads on the back face of the substrate is fixed and independent of the number of sets of the drive chips, and therefore a large number of pins are saved, external device cables are greatly reduced, and the higher density can be achieved compared with the density achieved through traditional packaging.
Owner:GUANGDONG VTRON TECH CO LTD

Network isolation method and network isolation device

The invention provides a network isolation method and a network isolation device. The network isolation method comprises the steps of receiving a first message by first network accessing equipment, wherein the first message is transmitted from a physical server and carries label information, the physical server comprises a plurality of service bridges, different service bridges are connected with the first network accessing equipment through a physical network adapter of the physical server, and the label information is added by the service bridge which corresponds with the first message; determining second network accessing equipment which corresponds with a destination address by the first network accessing equipment when the label information matches the destination address that corresponds with the first message; and transmitting the first message to the second network accessing equipment by the first network accessing equipment through network core equipment so that the second network accessing equipment transmits the first message to the physical server which corresponds with the destination address, wherein the first network accessing equipment and the second network accessing equipment are connected with the network core equipment. The network isolation method and the network isolation device have advantages of realizing network isolation, reducing wiring difficulty and reducing network maintenance cost.
Owner:CHINA UNIONPAY

High-integration-level multi-beam tile type TR assembly

The invention discloses a high-integration-level multi-beam tile-type TR component, which is characterized in that radio frequency signals input from a radio frequency common input port are subjected to multi-beam signal power division, amplitude-phase modulation and power amplification through a signal processing circuit on a radio frequency control board, and then are output through an antenna output port; power supply and control signals input from a port of the power supply and control connector are transmitted to the wave control daughter board and are transited to the radio frequency power supply board through the wave control daughter board for voltage conversion, and low-frequency signals subjected to voltage conversion are communicated with the radio frequency control board through the fuzz button fixing board, so that transmission of the power supply and control signals is realized. According to the TR assembly, the fuzz button fixing plate is added, the assembling difficulty and the wiring difficulty of the radio frequency power supply plate can be reduced, the size, position and distribution of bonding pads for power supply and signal control are more free, the integration number of DAC chips and radio frequency processing chips is increased, the integration degree of the multi-beam radio frequency signal TR assembly is improved. And the device has the characteristics of miniaturization and high stability.
Owner:CHENGDU THUNDER MICROCRYSTALLINE TECH CO LTD

Soft and hard composite circuit board and manufacturing method thereof

The invention provides a rigid-flex composite circuit board which is applicable to the manufacturing technical field of an integrated circuit plate. The rigid-flex composite circuit board comprises a hard board area and a soft board area. The hard board area comprises a hard board and a flexible board that stick to each other. Both the hard board and the flexible board are provided with a circuit. The soft board area comprises the flexible board that is also provided with the circuit. The flexible board of the hard board area is arranged on the outer surface of the hard board. The flexible board of the hard board area combines the flexible board of the soft board area as a whole, thus facilitating the arrangement of a blind hole or a buried hole according to the needs. So cost is saved and the application scope of the rigid-flex composite board is effectively improved. The invention also provides a method for manufacturing the rigid-flex composite circuit board. The hard board is cut at first and the circuit is arranged on the hard board. Afterwards, the flexible board sticks to the outer surface of the hard board. At last, an outer circuit is arranged on the flexible board. In the method, the hard board is positioned on the inner layer of the hard board, thereby facilitating the arrangement of the blind hole or the buried hole according to the needs.
Owner:NAIR ENERGY EQUIP

Multifunctional socket capable of adjusting spacings between adjacent jacks

The invention discloses a multifunctional socket capable of adjusting spacings between adjacent jacks. The multifunctional socket comprises a socket panel; the left and right sides of the socket panel are connected with plug boards through a telescopic rod; a sliding rail is formed in the middle part of the upper surface of the socket panel, and the length of the sliding rail is longer than that of the socket panel; a groove matched with the sliding rail is formed in one side, close to the sliding rail, of each plug board; the part, exceeding the socket panel, of the sliding rail is clamped with the grooves; jack boxes are arranged at the top end of the first telescopic rod; jacks are formed in the middle part of the upper surface of each jack box; an electric wire is arranged at the right end of a wire hole; and a plug is arranged at the right end of the electric wire. The multifunctional socket capable of adjusting spacings between adjacent jacks is simple in structure, convenient to operate, and capable of lowering electric shock probability of a child through a protective cover and further improving the spacing between the adjacent jacks by virtue of sliding of the sliding block and up and down movement of the first telescopic rod, so that the usage rate of the jacks can be improved and use of multiple sockets can be reduced, thereby lowering cost, lowering difficulty in wire arrangement and improving attractive degree.
Owner:林南俊

Bidirectional bus communication circuit and communication method

ActiveCN106209543AReduce wiring difficultyThe difficulty of wiring is greatly reduced, and the difficulty of engineering is reduced.Bus networksPower modeComputer hardware
The invention provides a bidirectional bus communication circuit which comprises a host device, a plurality of slave devices and buses, wherein the host device is connected with the slave devices via the buses; the host device comprises a host data sending circuit, a host data receiving circuit and a host CPU; and each slave device comprises a slave data sending circuit, a slave data receiving circuit and a slave CPU. The invention further provides a bidirectional bus communication method which comprises the following steps: S1, the host device supplies power for or charges the slave devices; S2, data of the host device data is downlinked, while the slave devices receive the downlinked data; and S3, data of the slave devices is uplinked, while the host device receives the uplinked data. The bidirectional bus communication circuit provided by the invention can adopt various topology modes, and supports various modes such as an annular mode and a star-like mode, so that the engineering difficulty is greatly reduced in the aspects of topology modes, cable cost and wiring difficulty, the bidirectional bus communication circuit can support long-distance communication, up to 128 slave loads, and a low-power mode, and anti-jamming capability is enhanced.
Owner:ZHUHAI UNITECH POWER TECH CO LTD

High-voltage current transformer verification wiring device

The present invention relates to a high-voltage current transformer verification wiring device. The high-voltage current transformer verification wiring device includes a rack and a flatbed cart; the flatbed cart is provided with a plurality of grooves; the bottom of the rack is provided with a positioning channel; two sides of the positioning channel are provided with rubber chains driven by a motor; the top of the rack is slidably provided with a lifting pressing plate driven by a lifting driving mechanism; the bottom surface of the lifting pressing plate is provided with a plurality of metal pressing blocks at intervals; the metal pressing blocks are corresponding to bosses at the top ends of transformers; after the lifting pressing plate descends, the metal pressing blocks are electrically and correspondingly connected with the bosses; conductors are arranged between the metal pressing blocks, so that the transformers can be connected in series with two ends of a power source for detection; and two side portions of the rack are provided with a plurality of retractable elastic pushing pins. With the wiring device of the invention adopted, primary-side wiring and secondary-side wiring can be simultaneously performed on a plurality of transformers in a semi-automatic manner, and therefore, wiring efficiency can be improved, and wiring difficulty can be reduced. The device has the advantages of simple structure and convenient control, and can greatly improve verification efficiency and reduce labor intensity.
Owner:STATE GRID SHANDONG ELECTRIC POWER COMPANY WEIFANG POWER SUPPLY +1
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products