High-integration-level multi-beam tile type TR assembly

A high-integration, multi-beam technology, applied in multi-carrier systems, diversity/multi-antenna systems, electrical components, etc., can solve problems such as low integration, difficult design, and difficult assembly, to improve integration, soldering Point docking operation is simple and the effect of reducing the difficulty of wiring

Active Publication Date: 2021-06-18
CHENGDU THUNDER MICROCRYSTALLINE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a highly integrated multi-beam tiled TR assembly to solve the problems of low integration, difficult design, and difficult assembly of the multi-beam tiled TR assembly.

Method used

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  • High-integration-level multi-beam tile type TR assembly
  • High-integration-level multi-beam tile type TR assembly
  • High-integration-level multi-beam tile type TR assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A highly integrated multi-beam tiled TR component, such as figure 1 , 7 As shown, it includes RF public input port 11, power supply and control connector port 12, cover plate 1, wave control sub-board 2, upper cavity body 3, RF power supply board 4, fur button fixing board 5, RF control board 6 and lower The cavity 7 and the lower cavity 7 are integrated with an antenna output port 71 . The radio frequency common input port 11 is used for radio frequency signal input, and the radio frequency signal input from the radio frequency common input port 11 is carried out multi-beam signal power division, amplitude phase modulation, power amplification by the signal processing circuit on the radio frequency control board 6, and then passes through the antenna output port 71 realizes the output of the radio frequency signal. The power supply and control signals are input through the power supply and control connector port 12, and the power supply and control signals input from...

Embodiment 2

[0036] A highly integrated multi-beam tiled TR component, such as figure 1 , 7 As shown, it includes a radio frequency common input port 11 , a power supply and control connector port 12 , an upper cavity 3 , a lower cavity 7 and a cover plate 1 , and the cover plate 1 is installed on the upper cavity 3 to open. The wave control sub-board 2 is installed in the upper cavity 3 . Both the cover plate 1 and the sub-board 2 are assembled in the upper cavity 3, and the sub-board 2 can be installed inside the upper cavity 3 by screws; the cover plate 1 can be installed in the upper cavity 3 by screws or silver glue.

[0037] A radio frequency common input port 11 is integrated on the cover plate 1 for inputting radio frequency signals. The power supply and control connector port 12 is integrated on the wave control daughter board 2, such as figure 2 As shown, the power supply and control connector port 12 is provided with a micro-rectangular connector 22, and the micro-rectangula...

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PUM

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Abstract

The invention discloses a high-integration-level multi-beam tile-type TR component, which is characterized in that radio frequency signals input from a radio frequency common input port are subjected to multi-beam signal power division, amplitude-phase modulation and power amplification through a signal processing circuit on a radio frequency control board, and then are output through an antenna output port; power supply and control signals input from a port of the power supply and control connector are transmitted to the wave control daughter board and are transited to the radio frequency power supply board through the wave control daughter board for voltage conversion, and low-frequency signals subjected to voltage conversion are communicated with the radio frequency control board through the fuzz button fixing board, so that transmission of the power supply and control signals is realized. According to the TR assembly, the fuzz button fixing plate is added, the assembling difficulty and the wiring difficulty of the radio frequency power supply plate can be reduced, the size, position and distribution of bonding pads for power supply and signal control are more free, the integration number of DAC chips and radio frequency processing chips is increased, the integration degree of the multi-beam radio frequency signal TR assembly is improved. And the device has the characteristics of miniaturization and high stability.

Description

technical field [0001] The invention relates to the technical field of microwave radar, in particular to a highly integrated multi-beam tile-type TR assembly. Background technique [0002] In recent years, the fields of microwave communication, radar and guidance have developed rapidly, and the application scenarios of related platforms and carriers have become increasingly complex. In this realistic background, higher requirements are put forward for the function and performance of the loaded phased array antenna. As the core component of the phased array antenna, the TR component must further improve the characteristics of miniaturization, high integration and multi-function to meet the application requirements of the phased array antenna. [0003] Under multi-beam working conditions, TR components need to realize the control of each beam signal, including: power division / combination, power amplification, amplitude and phase adjustment, etc. At the same time, the design o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B7/0408H04B7/06H04B7/08H04L27/34
CPCH04B7/0408H04B7/06H04B7/08H04L27/34
Inventor 唐耀宗周沛翰冯琳丁卓富邓金峰薛伟
Owner CHENGDU THUNDER MICROCRYSTALLINE TECH CO LTD
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