Adaptive multi-step variable domain solder joint layout optimization method based on topology optimization for automotive components

A topology optimization and layout optimization technology, applied in design optimization/simulation, special data processing applications, instruments, etc., can solve the problem of not being able to optimize the number of solder joints and the location of solder joints at the same time, to ensure rationality and improve accuracy. Effect

Inactive Publication Date: 2018-12-21
DALIAN UNIV OF TECH
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Problems solved by technology

[0009] According to the above-mentioned technical problems that the existing solder joint topology optimization method cannot optimize the number of solder joints and the layout position of solder joints at the same time, and the existing solder joint screening strategy will lead to uncertainty in the design scheme, a topology optimization-based automatic Solder joint layout optimization method for automotive components adapting to multi-step variable domain

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  • Adaptive multi-step variable domain solder joint layout optimization method based on topology optimization for automotive components
  • Adaptive multi-step variable domain solder joint layout optimization method based on topology optimization for automotive components
  • Adaptive multi-step variable domain solder joint layout optimization method based on topology optimization for automotive components

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Embodiment 1

[0094] This embodiment provides a topology optimization-based self-adaptive multi-step variable domain welding spot layout optimization method for automotive components, and describes the specific implementation of the present invention in detail in conjunction with the accompanying drawings and technical solutions. The number and arrangement of solder joints have a direct impact on manufacturing cost and structural performance. The purpose of solder joint optimization is to avoid performance defects caused by insufficient solder joints and increase in manufacturing cost and process layout difficulty due to excessive solder joints.

[0095] Aiming at the present solder joint design, it is still difficult to simultaneously optimize the number of solder joints and the arrangement form, and the present invention adopts a continuous solder joint unit, such as figure 1 As shown in 3, instead of the traditional discrete solder joints, the solder joint optimization is converted from ...

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Abstract

The invention provides an adaptive multi-step variable domain optimization method for automobile component solder joint layout based on topology optimization, Based on the finite element model of continuous solder joint element, the definition of multi-step variable domain solder joint topology optimization problem, the criteria of multi-step iteration progression and termination, and the verification of optimization scheme, the optimization design of structural solder joint number and layout form is completed. The technical proposal of the invention solves the problems that the existing solder joint topology optimization method in the prior art cannot simultaneously optimize the number of solder joints and the position of the solder joint arrangement, and the existing solder joint screening strategy will lead to the uncertainty of the design proposal. The technical proposal of the invention solves the problems that the existing solder joint topology optimization method cannot simultaneously optimize the number of solder joints and the position of the solder joint arrangement.

Description

technical field [0001] The invention relates to the technical field of automobile body component design, relates to a welding point layout optimization method, in particular to a topology optimization-based self-adaptive multi-step variable domain welding point layout optimization method for automobile components. Background technique [0002] Resistance spot welding connection technology is the most important connection method used in automobiles. As its basic connection point, there are usually 3000 to 5000 solder joints on the car body. The number and arrangement of solder joints directly affect the manufacturing cost and structural performance of automobiles. [0003] Traditional solder joint layout schemes are mostly based on the designer's engineering experience, which makes it difficult to balance different design requirements in the layout form. The layout of solder joints in some areas needs to be further optimized and improved to avoid performance defects caused b...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/15G06F30/18G06F30/23
Inventor 亓昌严磊杨姝于晨
Owner DALIAN UNIV OF TECH
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