42results about How to "Increase packing density" patented technology

The invention provides a preparation method of spherical iron phosphate, and relates to the technical field of lithium ion batteries, and the preparation method comprises the following steps: S1, one-step reaction: carrying out parallel flow on an iron salt solution, a phosphorus salt solution and ammonia water according to a molar ratio of 1: (0.8-1.2): (0.8-1.1) to generate amorphous iron phosphate slurry; adding ammonia water into the iron phosphate slurry to adjust the pH value to 1.5-2.5; s2, membrane washing; s3, a second-step reaction: adding pure water into the washed iron phosphate slurry, adjusting the iron concentration to 0.5-1.2 mol / L, adding a phosphoric acid solution, heating to 90-120 DEG C, and controlling the heat preservation time for 30-90 minutes after the material is converted into a white material, so as to obtain white slurry; s4, washing: taking a filter cake; s5, drying: generating iron phosphate dihydrate; s6, calcining: spherical iron phosphate is generated, and the iron phosphate is successfully converted from a traditional olive type, peanut type or honeycomb type to a spherical type through the preparation method provided by the invention.

The invention discloses a bimorphic and fully-compact tungsten-copper alloy electronic packaging heat sink material and a preparation method thereof, relates to the technical field of alloy material preparation, and aims to solve the problem that the performance of a material prepared in the prior art is difficult to meet application requirements. The preparation method comprises the following steps that polyhedral tungsten powder and spherical tungsten powder are subjected to ball milling and mixing treatment, and bimorphic tungsten powder is obtained; the mass ratio of the polyhedral tungsten powder to the spherical tungsten powder is (80-95): (20-5); the bimorphic tungsten powder and copper powder are mixed in the nitrogen or argon protective atmosphere, and bimorphic tungsten-copper mixed powder is obtained; the mass ratio of the bimorphic tungsten powder to the copper powder is (7: 3)-(9: 1); the tungsten-copper mixed powder is subjected to hot isostatic pressing treatment after being subjected to sheathing treatment and degassing treatment, and the tungsten-copper alloy is obtained; and carrying out sheath removal treatment and machining treatment on the tungsten-copper alloy to obtain the tungsten-copper alloy electronic packaging heat sink material.

The invention relates to the technical field of polymer compositions, and discloses a fiber microcrack self-healing composition with a shape memory characteristic, which comprises modified polyester containing thermally reversible dynamic covalent bonds and an asymmetric polyether-polyester block copolymer interface regulator, the melt index ratio of the interface regulating agent to the modified polyester is 1.8-3.2, and the interface regulating agent is distributed on the periphery of the modified polyester to form a core-shell microdomain. By utilizing the rheological gradient among the components, the interface regulating agent forms a low-viscosity flowing layer when the matrix shrinks; and the modified polyester is restrained to directionally migrate towards the tip of the fiber microcrack, so that active closing and densification filling of the crack area are realized, micro holes in the repaired area are eliminated, and the mechanical continuity of the composition in a dynamic environment is kept.

The invention belongs to the technical field of semiconductors, and discloses a silicon optical chip packaging method which comprises the specific steps of S1, cutting, S2, temporary bonding, S3, plastic packaging, S4, grinding, S5, de-bonding, S6, coating, S7, exposure, S8, development, S9, through hole drilling, S10, sputtering, S11, pattern transfer, S12, pattern electroplating, S13, film stripping, S14, differential etching, S15, secondary fan-out of a circuit, S16, resistance welding, S17, surface treatment, S18, electrical testing, S19, cutting and S20, flip-chip bonding. And S21, implanting solder balls. According to the fan-out packaging technology, interlayer copper interconnection and surface circuit reconstruction are directly achieved on the silicon optical chip, the signal transmission distance is remarkably shortened, the packaging density is improved, and the limitation of a traditional wire bonding technology is overcome; meanwhile, according to the board-level fan-out packaging method, the processing efficiency and the makeup utilization rate are further improved, the fan-out design of a circuit with a larger area is supported, and the cost advantage and the superiority of technical adaptation are shown.

The invention discloses an optical thin film sputtering deposition method and device based on double pulse sources, and belongs to the technical field of optical thin film manufacturing in optical manufacturing. According to the method, corresponding deposition parameters are adjusted according to different substrates and target materials, and deposition preparation of various optical thin films is achieved; the double-pulse source is divided into a main source and an auxiliary source, high-energy charge energy particles generated by the main pulse source bombard the surface of a target material, cascade collision occurs in several atomic layers on the surface of the target material, energy exchange occurs between the particles and the target material, and after target material atoms obtain enough energy to overcome own atomic potential barriers, the target material atoms leave the surface of the target material and are deposited on the surface of a substrate to form a thin film; the high-energy particles generated by the auxiliary pulse source bombard the surface of the growing thin film, and the film material molecules and the high-energy particles generate energy and momentum transfer to obtain large kinetic energy, so that the adhesiveness of the thin film is enhanced, and the surface arrangement is more compact. The preparation of multiple optical films can be realized, and meanwhile, the filling density and the use performance of the optical film can be improved.

The invention discloses modified chickpea starch and a preparation method and application thereof, and belongs to the technical field of food processing.The modified chickpea starch is obtained by adding oat beta glucan into chickpea starch, then conducting pretreatment on the chickpea starch, conducting extrusion treatment on the chickpea starch through a double-screw extruder, and cooling, drying and smashing an extruded sample; wherein the addition amount of the oat beta glucan is 3 to 15 percent; the temperature of the extrusion treatment is 80-120 DEG C. The chickpea starch is subjected to compound modification by adopting a twin-screw extrusion technology in cooperation with oat beta glucan, and a starch semi-crystalline layer is deeply destroyed to realize deep regulation and control of a multi-scale structure; meanwhile, the oat beta glucan and the starch form a hydrogen bond network, so that the problem of excessive modification of chemical modification is avoided, and the thermal stability, the shear resistance and the aging resistance of the starch are remarkably improved; no chemical reagent participates in the whole process, no chemical residue risk exists, and the method has the advantages of continuous production, large treatment capacity, low energy consumption and the like.

The utility model belongs to the MBR flat membrane production and manufacturing field, concretely relates to a hollow multi -flow channel support plate and membrane element, membrane stack of flat membrane special, the hollow multi -flow channel support plate includes the upper and lower two layers of perforated plate of corresponding arrangement, a plurality of partition is arranged at intervals between two layers of perforated plate, and the independent flow channel is formed between adjacent partition and perforated plate. The utility model has realized that flat membrane element outflow area effectively expands, membrane element packing density improves greatly, has reduced flat membrane's production cost and operating energy consumption simultaneously.

The invention relates to the technical field of photoelectric devices, and discloses an optical engine packaging structure and a preparation method thereof. The structure comprises an adapter plate structure, an electrical module, a first rewiring layer, an optical module and a packaging substrate, a containing space of the adapter plate structure comprises at least part of the thickness of the adapter plate structure, and a conductive structure is arranged in a penetrating mode in the thickness direction; the electrical module is arranged in the accommodating space and the front surface of the electrical module is exposed; the first redistribution layer is arranged on the adapter plate structure and is electrically communicated with the conductive structure and the electrical module; the optical module is arranged on the first rewiring layer, the front side faces the first rewiring layer, and an optical port is exposed to the external space and connected with an external optical device; the packaging substrate is arranged on the back surface of the adapter plate structure and is suitable for being electrically connected with the electrical module. According to the invention, the optical module is stacked on the electrical module, so that the warping is reduced, the signal transmission is improved, the packaging size is reduced, and the process is simple.

The application relates to a kind of graphite-like capacitor carbon and its preparation method and application, relate to carbon material technical field, solve the problem that the needle coke-based capacitor carbon in the activation pore-forming process of prior art is difficult to consider high specific surface area, layered ordered graphite structure keeps, pore size structure uniform control and continuous electric conduction network, leading to the specific capacitance, rate performance and cycle stability of material are limited.The application is by mixing needle coke powder and chemical activator, first activation is carried out by heating, and the activated product is obtained, and the intermediate product A is obtained by post-processing;Intermediate product A is mixed with catalytic activator, second activation is carried out by heating, and catalytic graphitization product is obtained, and the intermediate product B is obtained by post-processing;The intermediate product B is calcined to obtain graphite-like capacitor carbon by refining treatment.The graphite-like capacitor carbon provided by the application can be applied to the preparation of supercapacitors, and the synergistic balance between high specific surface area, high packing density, excellent conductivity and structural stability is realized.

The present invention relates to a lithium secondary battery positive electrode active material, a preparation method thereof and a lithium secondary battery comprising the same. The lithium secondary battery positive electrode active material of the present invention comprises a lithium-excess layered oxide, wherein the lithium-excess layered oxide comprises primary particles having an average particle size of 300 nm to 10 μm in an amount of 50 volume percent to 100 volume percent relative to the total lithium-excess layered oxide.

The utility model discloses an automatic powder packaging production line, including the fixing frame, the fixed frame upper end face is equipped with the chute, the chute has the movable feed pipe in, the fixed frame upper end face is fixedly connected with electric telescopic link no.

The utility model discloses a kind of hydrogen purification devices, it includes 2 or more parallel hydrogen purification units, raw material main pipeline, purified hydrogen pipeline and relaxation separation tail gas pipeline, the hydrogen purification unit includes metal hollow fiber membrane assembly, heating component, the upper flange with gas outlet for discharging purified hydrogen, the intermediate flange with heat exchange jacket, and the shell with lower flange, the upper flange with gas outlet, the intermediate flange with heat exchange jacket and the shell with lower flange are connected airtight by nut, the shell with lower flange is located in the heating component. By adopting the hydrogen purification device of the utility model, crude hydrogen raw gas is first passed through heat exchange jacket before being purified using metal hollow fiber membrane assembly, heat exchange is carried out using heat exchange jacket, preheating of raw gas can be achieved, energy efficiency is improved, while helping to maintain system thermal balance, reducing equipment depreciation and operating risk caused by temperature fluctuation, enhancing the safety of the device.

A display module, a preparation method thereof, a display device and a mold. The display module comprises a display panel having a display side and a back side opposite to each other, the display panel comprising a display area, a bending area and a binding area, the bending area being connected with the display area and the binding area respectively, the bending area being bent into a curved surface towards the back side of the display panel, and the binding area being located on the back side of the display panel; the bending area is provided with a hole, one end of the hole being open on the display side of the display panel; a cover plate is covered on the display side of the display panel, the cover plate covering the display panel; a middle frame is surrounded on the periphery of the edge of the display panel and is in contact with the edge of the cover plate; a support fixing structure is located at least between the curved surface and the middle frame, and the support fixing structure covers at least part of the area on the outer side of the curved surface away from the display area of the display panel, and the support fixing structure covers one end of the hole.

The invention provides a liquid hydrogen storage tank based on hollow glass microspheres and a hollow glass microsphere filling device and method.The liquid hydrogen storage tank comprises a double-layer liquid hydrogen storage tank body, the double-layer liquid hydrogen storage tank body comprises an outer shell and an inner shell located in the outer shell, a vacuum cavity is formed between the outer shell and the inner shell, and the vacuum cavity is filled with the hollow glass microspheres. The hollow glass microsphere filling device comprises a liquid nitrogen storage tank, a gasifier, a heater, an HGM storage container, a pressure storage tank, a filter and a water ring pump, an outlet of the liquid nitrogen storage tank is connected with an inlet of the gasifier, an outlet of the gasifier is connected with an inlet of the heater, an outlet of the heater is connected with an inlet of the pressure storage tank, and an outlet of the heater is connected with a gas inlet of the HGM storage container. The device is suitable for heat insulation of the large liquid hydrogen storage tank.

The invention provides a POP packaging structure, a preparation method thereof and electronic equipment, and the POP packaging structure comprises a first packaging unit; the first side of the second packaging unit deviates from the first side of the first packaging unit, and the second packaging unit is provided with at least one threading channel penetrating in the thickness direction; the middle section of the conductive lead is arranged in the threading channel, the first end of the conductive lead is connected with the first side of the first packaging unit, and the second end of the conductive lead is connected with the first side of the second packaging unit; and the plastic packaging body is arranged on the first side of the first packaging unit and the first side of the second packaging unit, is connected with the first packaging unit and the second packaging unit, and wraps the conductive lead.

The invention belongs to the technical field of silicon micro-powder, and particularly discloses silicon micro-powder for integrated circuit packaging and a preparation method thereof, the silicon micro-powder is multi-stage modified spherical silicon micro-powder, and the multi-stage modified spherical silicon micro-powder is prepared from basic spherical silicon micro-powder through modification processes of gradient alkali etching pore forming, bifunctional silane grafting and polyaryletherketone oligomer coating in sequence; in the basic powder purification step, precise purification of the industrial-grade silica powder is realized through a combined process of acid pickling, hydrofluoric acid shallow etching, water washing and drying. Wherein the diluted hydrochloric acid can remove metal cation impurities in the silica powder in a targeted manner, and the impurities are prevented from forming a conductive path in the subsequent packaging process, so that the dielectric loss is reduced, and the insulating property of the material is improved; and the shallow etching of the hydrofluoric acid dilute solution can peel off the surface silicon dioxide impurity layer, and meanwhile, the etching depth is controlled to avoid damaging the spherical structure of the silicon micro powder, so that the uniformity of the subsequent modification process is ensured, and a high-quality base material foundation is laid for the subsequent modification step.

The application discloses a silicon nitride-aluminum nitride-based composite ceramic powder and a preparation method thereof. The preparation method of the composite ceramic powder comprises the following steps: preparing aluminum borate precursors and / or borate composite precursors by using a solid-phase reaction method; placing the prepared aluminum borate precursors and / or borate composite precursors in a high-temperature furnace; and performing a high-temperature nitriding reaction under a nitrogen or ammonia atmosphere to prepare binary or multi-element aluminum nitride-aluminum oxide composite powder. Then, the binary or multi-element aluminum nitride-aluminum oxide composite powder is combined with high-thermal-conductivity and high-strength silicon nitride-based spherical powder by airflow compounding to prepare the silicon nitride-aluminum nitride-based composite ceramic powder. The borate precursor solid-phase synthesis, one-step in-situ nitriding and airflow compounding process can be used to prepare the silicon nitride-aluminum nitride-based composite ceramic powder which can be applied to 6-35KV medium and high-voltage electric heating tubes. The process is free of carbon source and organic additive addition in the whole process, and complex processes such as hydrothermal treatment and spray granulation are abandoned, and the comprehensive production cost is reduced by 60%.

The utility model relates to water treatment equipment field, a horizontal ceramic flat plate membrane component, including support foot square tube and frame square tube, frame square tube forms the frame structure of rectangle, and four support foot square tubes are located at the corner of frame structure respectively, four support foot square tubes and the inside of frame square tube intercommunication, one of support foot square tube is as water production pipeline, another of support foot square tube is as aeration pipeline, and the rest two support foot square tubes are closed, install several aeration pipes in frame structure, and the inside of frame square tube is connected with the aeration pipe and the end, install the membrane group guard board of four periphery frames on frame structure top, install several ceramic membrane sheets in the inside vertical of membrane group guard board enclosure, and every ceramic membrane sheet all is provided with water collecting port, and the water collecting port is connected with water production pipeline through frame structure, the ceramic flat plate membrane component improves the pollution resistance, easy maintenance, structural stability, and high loading density.

A through-hole filled substrate in which a conductive via portion is easily manufactured, and which has high density, and high airtightness and adhesion between the conductive via portion and a hole portion. The through-hole filled substrate is manufactured by: a filling step of filling a first conductive via portion precursor including a filling conductive paste containing a high-melting-point metal particle, i.e., a metal component A, and a first organic vehicle, into a hole portion of an insulating substrate having the hole portion; a lamination step of laminating a laminating conductive paste containing a refractory metal particle, i.e., a metal component B, and a second organic vehicle, on the first conductive via portion precursor filled into the hole portion by the filling step; and a firing step of firing the insulating substrate including the two precursors obtained by the lamination step in a nitrogen atmosphere. The filling step includes a paste filling step of filling the filling conductive paste. At least one of the first conductive via portion precursor and the second conductive via portion precursor includes an active metal component containing an active metal. At least one of the filling conductive paste and the second conductive via portion precursor contains a metal component C having a lower melting point than the refractory metal particle.

This invention provides a method for preparing high bulk density potassium peroxymonosulfate composite salt. Through multi-dimensional process optimization including multi-point feeding and neutralization, ultrasonic action, crystal guiding agent, heating-heating-heating-cooling, and drying-mixing-sieving, the bulk density of PMS is synergistically improved, and the overall performance of the final product is superior to that of the prior art.

The application discloses a TGV interlayer-copper paste interconnection-high thermal conductivity and low loss insulation material collaborative packaging structure for three-dimensional integrated circuit packaging and a preparation method thereof, and belongs to the technical field of advanced electronic packaging materials. The structure comprises a TGV glass interlayer with low dielectric and adjustable thermal expansion coefficient, a high-uniformity metal interconnection structure formed by filling and sintering of functional copper paste, and a high-thermal-conductivity and low-loss insulation packaging layer. Through collaborative design of the interlayer material, the copper paste interconnection material and the insulation packaging material, excellent high-frequency electrical performance, thermal management performance and structural reliability can be realized. The application has simplified process and controllable cost, and is suitable for three-dimensional packaging application scenarios such as AI accelerators, high-performance computing, radio frequency front ends and heterogeneous integration.

The application refers to Fe-Ni / polysulfone inorganic-organic hollow fiber hybrid membrane and a preparation method thereof, including a preparation process: step 1: dissolving polysulfone in an organic solvent and adding an additive, stirring to form a uniform solution; then adding 0.5% to 30% of Fe and Ni metal powder by mass ratio under stirring to obtain a spinning solution; step 2: mixing pure water and a polar solvent according to a certain ratio to form a uniform solution, obtaining an inner coagulation bath; step 3: transferring the spinning solution to a liquid supply tank after vacuum degassing, quantitatively and constantly conveying to a spinneret, at the same time, quantitatively and constantly conveying the inner coagulation bath into the spinneret, the spinning solution passing through an air gap and entering an outer coagulation bath, the hollow fiber membrane being coagulated and formed under the action of the inner / outer coagulation bath, being washed by pure water and dried to obtain the Fe-Ni / polysulfone hollow fiber membrane, which has a typical asymmetric structure, high mechanical strength and good biocompatibility, can significantly improve the hydrophilicity of the membrane and can also enhance the protein contamination resistance of the membrane.

The utility model relates to the field of forming molds, and discloses a high-density EPS foam forming mold which comprises a fixed mold body, a plurality of supporting stand columns are fixedly installed at the positions, close to the corners, of the fixed mold body, top mounting plates are fixedly installed at the top ends of the supporting stand columns, and a forming mold cavity is formed in the position, close to the middle, of the top surface of the fixed mold body. A movable mold is arranged on the bottom surface of the top mounting plate, a vibration rod is started, the vibration rod operates to generate vibration, and after EPS foam raw material particles in a forming mold cavity are uniformly distributed, a worker starts an electric push rod I to drive a U-shaped plate to reset; then the hydraulic cylinder drives the module to enter the forming die cavity to perform EPS foam forming operation, so that EPS foam raw material particles can be promoted to collide with one another and move, free flowing and arrangement of the particles are facilitated, gaps among the particles are reduced, the filling density of the particles is improved, and therefore the uniformity of the EPS particles is improved; and the product quality after EPS foam molding is improved.

The invention discloses a circuit substrate and a processing method thereof, and a system-in-package substrate and a processing method thereof. The processing method of the circuit substrate comprises the following steps: providing an insulating base layer and two composite copper layers; the insulating base layer is stacked between the ultrathin copper layers of the two composite copper layers and then pressed into a whole, and the carrier copper layer is removed to obtain a first intermediate plate; performing MSAP process treatment on the first intermediate plate to form a line set comprising an inner-layer line and an impedance prototype on the ultrathin copper layer; the inner-layer lines in the two groups of line sets are communicated, and the impedance rudiment is of a single-line coplanar impedance structure formed by an impedance line lengthening body and a peripheral copper body; after the preset part of the impedance line lengthening body and the inner-layer circuit are subjected to film covering protection, the exposed part of the impedance line lengthening body and the peripheral copper body are etched away to obtain the hypersensitive impedance; and removing the film to obtain the circuit substrate. According to the processing method, the packaging density and precision are improved, large-scale production of the circuit board product with the hypersensitive impedance is realized, and the yield of the hypersensitive impedance is improved.

The invention discloses a chip packaging method, a chip packaging structure and electronic equipment. The packaging method comprises the steps that underfill glue is arranged on the first surface, and solidified glue can cover the solder balls; removing part of the solidified colloid to expose at least part of the solder balls; and mounting the chip on the substrate through the solder balls, and carrying out plastic packaging on the mounted product. According to the chip packaging method provided by the invention, the risk of generating holes after plastic packaging can be avoided, and the yield of products is improved.

This invention provides a small, long-tailed solid rocket motor, comprising a combustion chamber shell, a combustion chamber insulation layer, a propellant charge, an adjusting pad, a long tailed tube shell, a long tailed tube insulation layer, a nozzle shell, a nozzle insulation layer, a graphite throat liner, a plug, an electrode wire plug, a blunt-sensitive igniter, a pressure testing port plug, a connector mounting plate, and a short-circuit head. The propellant charge and adjusting pad are sequentially placed within the combustion chamber. The nozzle shell and long tailed tube shell are screwed together internally and externally. The blunt-sensitive igniter, via the electrode wire plug, connector mounting plate, and short-circuit head, is mounted on the side of the handle rib of the long tailed tube shell to provide short-circuit protection. The long tailed tube shell and combustion chamber shell are then assembled into the complete motor. This invention features high space utilization and minimal change in the center of gravity, resulting in a more rational structural layout.

The utility model discloses a packaging structure for a chip, which comprises an electric connection limiting frame, an electric connection clamping groove is arranged in the electric connection limiting frame, the electric connection clamping groove is arranged in four inner walls, the outer part of the electric connection clamping groove is communicated with a plurality of electric connection jacks, and the plurality of electric connection jacks are respectively arranged in four side walls of the electric connection limiting frame. Through the combination of the electric connection limiting frame and the lamination limiting frame, the modular packaging of the integrated chip is realized, the design facilitates the installation, replacement and expansion of the integrated chip, the flexibility and maintainability of the packaging are improved, the multi-layer lamination of the integrated chip can be realized through the increase and decrease of the lamination limiting frame, and the packaging efficiency is improved. The structural design is suitable for application scenes needing high integration, the packaging density and the space utilization rate are effectively improved, the connecting lines are etched in the connecting pole pieces, customized design can be carried out according to the connecting requirements of different types of integrated chips, and the compatibility and adaptability of the packaging structure to different chips are improved through the design.

The invention relates to the technical field of aluminum-based composite material preparation, in particular to a ceramic reinforced aluminum-based workpiece and a preparation method. The ceramic reinforced aluminum-based workpiece is prepared by the method. The method comprises the steps that a forming die is assembled and filled with aluminum-based composite powder; sintering the forming die filled with the aluminum-based composite powder in an inert atmosphere to obtain a sintered green body; performing die forging treatment on the sintered green body to obtain a prefabricated green body; and after the prefabricated blank is machined to the size of a finished product, the prefabricated blank is sequentially subjected to solution treatment and aging treatment, and the ceramic reinforced aluminum-based workpiece is obtained. By means of the method, the ceramic reinforced aluminum-based workpiece with the large length-diameter ratio can be prepared, and the problems that cracks are generated when a formed blank is not separated from the female die, and layering and fragmentation are generated in the demolding process are solved.

The invention provides a solid iodine working medium liquefying and crystallizing device which comprises a solid iodine liquefying container used for providing a dry environment for placing solid iodine particles; the circular-truncated-cone-shaped separating device is arranged in the solid iodine liquefying container and divides the solid iodine liquefying container into a solid iodine particle placing area and a bottom liquefying area; two ends of the connecting pipeline are respectively connected with the bottom liquefaction area and the iodine crystallization storage tank; the heating assembly is arranged on the outer walls of the solid iodine liquefying container and the connecting pipeline and is used for providing liquefying temperature of the solid iodine particles; the piston assembly is mounted at the top of the solid iodine liquefaction container; and the nitrogen purging device is communicated with the iodine crystal storage tank and is used for replacing impurity gas in the iodine crystal storage tank. According to the implementation mode, the solid iodine particles with the density of 2.5 g / cm < 3 > are liquefied and solidified to form the iodine crystals with the density of 4.93 g / cm < 3 >, and the filling density is improved, so that more fuel can be stored to be supplied to an electric thrust system for use, and the solid electric thrust system is of great significance to rapid development of the solid electric thrust system.

The utility model relates to an all-plastic ceramic flat membrane tower with high flux and high packing density, which comprises a membrane tower, a water collecting seal head and a base, the membrane tower is formed by stacking a plurality of membrane components, the water collecting seal head is positioned at the top end of the membrane tower, and the base is positioned at the bottom of the membrane tower; the membrane assembly comprises first frames, second frames and membrane elements, the two first frames serve as longitudinal edges, the two second frames serve as transverse edges to form a rectangular supporting frame, and the multiple membrane elements are transversely arranged in the supporting frame of the membrane assembly in parallel in the longitudinal direction. According to the membrane tower, the membrane elements with the water collecting openings in the two ends are adopted, the water production pressure is reduced, the membrane flux is increased, the membrane elements are transversely installed in the all-plastic membrane frame to form the sealed membrane assemblies, the multiple membrane assemblies are stacked up and down to form the membrane tower, the membrane tower is compact in structure, the filling density of the membrane elements is high, the sealing performance between the assemblies is good, and high-flux application can be achieved; the membrane frame is made of all-plastic materials, is more resistant to acid and alkali corrosion and is suitable for various water qualities.