The present invention relates to a composition (C) comprising, based on 100 parts by
mass of the resin present in the composition, 70 to 95 parts by
mass of an
epoxy resin (A) having a
viscosity at a temperature between 20°C and 25°C of 20 Pa·s or less, preferably between 1 and 20, more preferably between 1 and 10, and 5 to 30 parts by
mass of a curing agent (B) dispersed in the resin. The curing agent is a
phosphonium cation of the formula P(R 1 R 2 R 3 R 4 ) + (wherein R 1 , R 2 , R 3 and R 4 may be the same or different and represent a
hydrogen atom, an
alkyl group having 1 to 18 carbon atoms, or an
aryl group having 6 to 20 carbon atoms, and the
alkyl group and the
aryl group may be substituted), and an acetate anion of the formula (R 5 CO 2 ) - (wherein R 5 represents a
hydrogen atom, an
alkyl group having 1 to 18 carbon atoms, or an
aryl group having 6 to 20 carbon atoms, and the alkyl group and the aryl group may be substituted), or a
phosphinate anion of the formula [[(CH 3 ) 3 CCH 2 CH(CH 3 )CH 2 2 P(O)O] - . The present invention also relates to the use of the composition (C) for manufacturing a
hydrogen container, in particular a container for storing
gaseous hydrogen under pressure and containing a
composite material, of types II, III, IV, and V.