Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sheet type heater and manufacturing process thereof

A manufacturing process and technology for heaters, which are used in electric heating devices, ohmic resistance heating, heating element materials, etc., can solve the problems of low precision, high power consumption and damage of bridge wire heaters, and achieve high resistance precision and novel structure. , the effect of high power stability

Pending Publication Date: 2020-09-15
广德市镓锐电子有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the above-mentioned bridge wire heater not only has high power consumption and low precision, but also is easily damaged by external force

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sheet type heater and manufacturing process thereof
  • Sheet type heater and manufacturing process thereof
  • Sheet type heater and manufacturing process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Please refer to the attached image 3 As shown, it is a schematic cross-sectional structure diagram of the chip heater of the present invention. The chip heater includes a carrier layer 1, a heating layer 2 and a copper foil welding layer 3. The carrier layer 1 has a plurality of carrier substrates arranged one after the other, and each of the carrier substrates is made of high temperature resistant glass fiber cloth. 10 and a colloid layer 11 positioned on the front of the high temperature resistant glass fiber cloth 10; the heating layer 2 is positioned on the front of the carrier layer 1, and the copper foil welding layer 3 is positioned on the On the back side of the carrier layer 1, and the heating layer 2 is also connected to the copper foil welding layer 3; in addition, the heating layer pattern is etched on the front side of the heating layer 2, and the heating layer pattern is etched on the copper foil welding layer The soldering layer pattern is etched on the...

preparation example 1

[0050] The manufacturing process of the chip heater is carried out as follows:

[0051] a. Cut out a piece of high-temperature-resistant glass fiber cloth 10 according to the design. The high-temperature-resistant glass fiber cloth 10 has a front side and a back side. On the front side of the high-temperature-resistant glass fiber cloth 10, a layer of polyimide modified ring is scratch-coated. epoxy resin, and after the polyimide modified epoxy resin is dried and aged, a colloid layer 11 with a solid content greater than 99% is formed; wherein, the high temperature resistant glass fiber cloth 10 connected together and the colloidal layer 11 are collectively referred to as the carrier matrix;

[0052] b. Placing a plurality of said carrier substrates sequentially, and after pressing treatment, a carrier layer 1 is obtained, that is, after pressing treatment, the colloid layer 11 of another said carrier substrate located below will infiltrate into an upper one. In the gap of th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a sheet type heater and a manufacturing process thereof. The sheet type heater comprises a carrier layer, a heating layer and a copper foil welding layer, wherein the carrier layer is provided with a plurality of carrier base bodies which are sequentially arranged in a stacked mode, each carrier base body is composed of a high-temperature-resistant glass fiber cloth and a colloid layer located on the front face of the high-temperature-resistant glass fiber cloth, the heating layer is positioned on the front surface of the carrier layer, the copper foil welding layer ispositioned on the back surface of the carrier layer, the heating layer is further communicated with the copper foil welding layer, a heating layer pattern is etched on the front face of the heating layer, a welding layer pattern is etched on the back face of the copper foil welding layer, photosensitive epoxy resin packaging layers are packaged in the middle of the heating layer pattern and the middle of the welding layer pattern respectively, and tin plating layers are electroplated on the rest portions of the heating layer pattern and the rest portions of the welding layer pattern respectively. According to the invention, the sheet type heater is novel and reasonable in structure, low in product power consumption, high in resistance precision, high in power stability, not prone to damagedue to external force influence and long in product service life.

Description

technical field [0001] The invention relates to the technical field of heaters, and specifically provides a chip heater and a manufacturing process thereof. Background technique [0002] At present, the common heaters on the market are bridge wire heaters. Its working principle is: the current output by the external power supply is applied to the resistance bridge wire of the heater through the metal leg wire, and the current will heat the bridge wire, and the heated bridge wire will capable of supplying heat to the outside. [0003] However, the above-mentioned bridge wire heater not only has high power consumption and low precision, but also is easily damaged by external force. [0004] In view of this, the present invention is proposed. Contents of the invention [0005] In order to overcome the above-mentioned defects, the present invention provides a chip heater and its manufacturing process. The manufacturing process is simple and reliable, and the chip heater manu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/02H05B3/14H05B3/34
CPCH05B3/02H05B3/14H05B3/34
Inventor 殷桂兰
Owner 广德市镓锐电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com