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Method for Embedding Capacitor in Printed Circuit Board and Printed Circuit Board

A technology of printed circuit boards and embedded capacitors, which is applied in the direction of printed circuits connected with non-printed electrical components, multi-layer circuit manufacturing, and printed circuits assembled with electrical components. It can solve the problem of screen printing plane size and thickness uniformity control Poor, poor capacitance accuracy, difficult to control and other issues, to achieve the effect of improving signal integrity, reducing mounting costs, and reducing the size of the board

Active Publication Date: 2018-04-10
BOMIN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The embedded capacitor prepared by lamination technology has a simple process, but the process is limited by the material, and the capacitance density of the prepared embedded capacitor is low, and the material is currently expensive, and the cost of the prepared planar capacitor is higher than that of the surface mount. Capacitive components, and the capacitance accuracy is poor, it is difficult to control to within 15%; the process of embedding capacitors prepared by silk screen printing technology is more complicated than lamination technology, and the size and thickness uniformity of the screen printing plane are poorly controlled, so the production The accuracy of the capacitance value of the embedded capacitor is much lower than that of the lamination technology, and it cannot be applied to actual products at present

Method used

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  • Method for Embedding Capacitor in Printed Circuit Board and Printed Circuit Board
  • Method for Embedding Capacitor in Printed Circuit Board and Printed Circuit Board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] (1) Substrate production:

[0044] (a) Production of matrix 1: 1) The insulation material is cut, the resin in the insulation material is not fully cured, and is in a semi-cured state. The resin in the insulation material can be epoxy resin, phenolic resin or BT resin, etc., and the insulation material can contain Inorganic filler, reinforcement layer, etc., the reinforcement layer is preferably glass fiber cloth; 2) Paste the protective film, the bonding temperature is between 60°C and 150°C, the bonding temperature must be below the glass transition temperature of the insulating material, the protective film can It is polyester film, polyimide film, etc., and its thickness is between 5 μm and 100 μm; 3) Drilling, the drilling is a through hole, that is, the through hole runs through the upper and lower sides of the board, and the drilling can be done by mechanical drilling, It can be realized by laser drilling or punching. Laser drilling can be realized by infrared la...

Embodiment 2

[0051] A method for embedding capacitors in a printed circuit board of the present invention, its process is basically the same as that of Embodiment 1, the difference is that the preparation method of the base body 2 and the base body 3 and the way of stacking the plates during pressing are different in this embodiment .

[0052] The preparation method of the substrate 2 is specifically as follows: 1) Cutting the printed circuit board. The printed circuit board can be an insulating substrate, single-layer, double-layer or multi-layer board. The printed circuit board includes an insulating material and a metal layer. The resin has been completely cured. The resin in the insulating material can be epoxy resin, phenolic resin or BT resin. The insulating material can contain inorganic fillers, reinforcing layers, etc. The reinforcing layer is preferably glass fiber cloth. The metal layer can be made of copper, silver, etc. layer, gold layer, etc., preferably copper layer; 2) dril...

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PUM

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Abstract

The invention discloses a method for embedding capacitors in a printed circuit board and the printed circuit board thereof; it belongs to the technical field of circuit board manufacturing technology; its technical points include the following steps: (1) making a base body; (2) laminating , base 1, base 2, base 3 and metal layer, according to the multilayer board manufacturing process, base 1 and one or more combinations of base 2, base 3 and metal layer are pressed together to form a multilayer circuit board. The substrate 1 is provided between the contact parts of the substrate 2, the substrate 3 and the metal layer; (3) drilling and metallization; (4) making the outer layer pattern to form an embedded multilayer capacitor individual and / or multilayer A multi-layer printed circuit board with a parallel structure of individual capacitors; the present invention aims to provide a method for embedding capacitors in a printed circuit board with a simple process to achieve precise control of the resistance value of the embedded capacitor without additional cost And its printed circuit board; for circuit board production.

Description

technical field [0001] The invention relates to a preparation process of a circuit board, in particular to a method for embedding capacitors in a printed circuit board. The present invention also relates to a printed circuit board with the above-mentioned embedded capacitor. Background technique [0002] With the increasing maturity of electronic design technology, traditional printed circuit boards are gradually unable to meet the development needs of today's electronic products in the direction of short, light, thin and multi-functional modular integration. Therefore, the emerging technology of internal integration of passive device printed circuit boards has been derived. . Among them, the number of capacitors ranks first in the demand for passive devices, and embedded capacitor technology has become the top priority for many circuit board manufacturers in the field of passive device integration. There are three advantages of embedding capacitors into printed circuit bo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/32H05K3/46H05K1/18
CPCH05K1/18H05K3/32H05K3/46
Inventor 黄勇陈世金任结达邓宏喜徐缓
Owner BOMIN ELECTRONICS CO LTD
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