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A high-precision and high-reliability laminated thermistor chip and its manufacturing method

A technology of a thermistor chip and a manufacturing method, which is applied in resistance manufacturing, resistors with negative temperature coefficient, resistors, etc., can solve problems such as mutual diffusion, increase production cost, difference in sintering expansion rate, etc., and achieve higher resistance value. Accuracy, stable and reliable performance, avoiding the effect of quality degradation

Active Publication Date: 2021-11-23
DINGSENSE ELECTRONICS TECH CO LTD
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AI Technical Summary

Problems solved by technology

[0004] However, since chip-type laminated electronic components use internal electrodes co-fired with ceramic green bodies, in order to ensure high-temperature sintering of ceramics, high-temperature electrode materials such as palladium (Pb) and platinum (Pt) must be used to make internal electrodes, thereby increasing production costs.
At the same time, there is a compatibility problem between the internal electrode of the chip-type laminated electronic component and the ceramic green body. There are differences in the sintering expansion rate between each layer of ceramics and between the ceramic and the internal electrode, and mutual diffusion is prone to occur. problems, resulting in unstable resistance performance of chip laminated electronic components

Method used

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  • A high-precision and high-reliability laminated thermistor chip and its manufacturing method
  • A high-precision and high-reliability laminated thermistor chip and its manufacturing method
  • A high-precision and high-reliability laminated thermistor chip and its manufacturing method

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Embodiment Construction

[0031] see figure 2 , the manufacture method of high-precision and high-reliability laminated thermistor chip of the present invention, comprises the steps:

[0032] (1) Preparation of thermistor ceramic powder:

[0033] According to the formula of NTC thermosensitive ceramic powder, use 30%~40% Mn by mass percentage 3 o 4 (manganese oxide), 25%~35% Co 3 o 4 (cobalt oxide), 25% to 35% Fe 2 o 3 (iron oxide), 5% to 10% NiO (nickel oxide), 0.3% to 3%% SrCO 3 (strontium carbonate), 0.3% to 3% ZrO (zirconia) and other raw materials to make thermistor ceramic powder.

[0034] Adding SrCO to the powder formulation 3 (strontium carbonate) and ZrO (zirconia) as a joint stabilizer can enhance the stability and reliability of the electrical properties of the NTC thermistor.

[0035] (2) Ingot making and sintering:

[0036] The obtained thermistor ceramic powder is pressed into an ingot, and then sintered at a high temperature to obtain a ceramic body.

[0037] Specifically, t...

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Abstract

The invention relates to a method for manufacturing a high-precision and high-reliability laminated thermistor chip. The manufacturing method comprises the following steps: (1) preparing a thermistor ceramic powder; (2) preparing the thermistor ceramic powder (3) Slicing the ceramic body to obtain a cooked substrate; (4) Printing internal electrodes on the cooked substrate; (5) The cooked substrate with printed internal electrodes Sintering after stacking to obtain a thermistor; (6) cutting the thermistor into granules, and then chamfering; (7) preparing terminal electrodes on the semi-finished product obtained in step (6) to obtain a thermistor chip. The thermistor chip prepared by the manufacturing method of the invention is not easy to crack, has good compatibility among internal layers, is not easy to diffuse, has stable and reliable resistance performance, and achieves high precision.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a high-precision and high-reliability laminated thermistor chip and a manufacturing method thereof. Background technique [0002] With the rapid development of modern electronic technology and communication technology, the requirements for miniaturization, light weight, high speed, multi-function, high precision and high reliability of electronic equipment are increasing day by day. Modern electronic components, including heat-sensitive electronic chips, are gradually becoming In the direction of formalization, integration and low resistance. [0003] Existing chip-type laminated electronic components generally adopt the method of co-firing the inner electrode and ceramic green body. For example, the existing laminated thermistor chip adopts the production method of casting and printing laminated co-firing, such as figure 1 As shown, the steps are: powder slurry pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/00H01C17/28H01C7/04H01C1/14
Inventor 叶建开杨梦恬唐黎民柏琪星杨俊段兆祥
Owner DINGSENSE ELECTRONICS TECH CO LTD
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