399results about How to "Reduce bonding" patented technology

A composite filtration medium web of fibers containing a controlled dispersion of a mixture of sub-micron and greater than sub-micron diameter polymeric fibers is described. The filtration medium is made by a two dimensional array of cells, each of which produces a single high velocity two-phase solids-gas jet of discontinuous fibers entrained in air. The cells are arranged so that the individual jets are induced to collide in flight with neighboring jets in their region of fiber formation, to cause the individual nascent fibers of adjacent jets to deform and become entangled with and partially wrap around each other at high velocity and in a localized fine scale manner before they have had an opportunity to cool to a relatively rigid state. The cells are individually adjusted to control the mean diameters, lengths and trajectories of the fibers they produce. Certain cells are adjusted to generate a significant percentage of fibers having diameters less than one micron diameter, and which are relatively shorter in length and certain other cells are adjusted to generate a significant percentage of structure-forming reinforcing fibers having diameters greater than one micron diameter which are relatively longer in length. By employing appropriate close positioning and orientation of the cells in the array, the sub-micron fibers are caused to promptly entangle with and partially wrap around the larger reinforcing fibers. The larger fibers thereby trap and immobilize the sub-micron diameter fibers in the region of formation, to minimize the tendency of sub-micron diameter fibers to clump, agglomerate, or rope together in flight. Also, the larger fibers in flight are made to form a protective curtain to prevent the sub-micron fibers from being carried off by stray air currents.

A semiconductor package structure and the methods for forming the same are provided. The semiconductor package structure includes an interposer; a first plurality of bonding pads on a side of the interposer; a semiconductor chip; and a second plurality of bonding pads on a side of the semiconductor chip. The first and the second plurality of bonding pads are bonded through metal-to-metal bonds.

A golf club (40) having a club head (42) with a face component (60) and an aft body (61) is disclosed herein. The face component (60) has a striking plate portion (72) and a return portion (74). The aft-body (61) is composed of a crown portion (62), a sole portion (64) and optionally a ribbon section (90). The face component (60) is composed of a metal material, and the aft-body (61) is preferably composed of a non-metal material such as a composite material or a thermoplastic material. The face component (60) is bonded to the aft-body (61) with a leading edge (180) of an undercut portion (62a and 64a) of the aft-body positioned a distance of 0.100 inch to 0.500 inch from the interior surface (60a) of the face component (60) in order to reduce the stress on the bonded joint of between the face component (60) and the aft-body (61). The club head (42) has a volume in the range of 290 cubic centimeters to 600 cubic centimeters, a weight in the range of 165 grams to 300 grams, and a striking plate portion (72) surface area in the range of 4.00 square inches to 7.50 square inches.

A process for fabricating an integrated circuit package includes: selectively etching a leadframe strip to define a die attach pad and at least one row of contact pads; mounting a semiconductor die to one side of the leadframe strip, on the die attach pad; wire bonding the semiconductor die to ones of the contact pads; releasably clamping the leadframe strip in a mold by releasably clamping the contact pads; molding in a molding compound to cover the semiconductor die, the wire bonds and a portion of the contact pads not covered by the clamping; releasing the leadframe strip from the mold; depositing a plurality of external contacts on the one side of the leadframe strip, on the contact pads, such that the external contacts protrude from the molding compound; and singulating to provide the integrated circuit package.

The present invention relates to compositions and methods for preserving and extracting nucleic acids from saliva. The compositions include a chelating agent, a denaturing agent, buffers to maintain the pH of the composition within ranges desirable for DNA and / or RNA. The compositions may also include a reducing agent and / or antimicrobial agent. The invention extends to methods of using the compositions of the invention to preserve and isolate nucleic acids from saliva as well as to containers for the compositions of the invention.

In a vertical MOSFET comprises: a semiconductor layer (1, 2, 9, 10) having first and second surfaces opposite to each other and trenches (6) formed on the first surface; trench gates (8) formed in the trenches; a unit cell formed in a region of the semiconductor layer surrounded by the trench gates, the unit cell comprising a base layer (9) and a source layer (10) formed on the base layer and having the first surface as a principal semiconductor surface, the unit cell having a contact hole (12) formed on a center of the principal semiconductor surface and extending from the principal semiconductor surface through the source layer to an inside of the base layer; a contact (17) formed in the contact hole; a source electrode (18) formed on the contact; and a drain electrode (19) formed on the second surface, the contact is formed to a depth different to a peak depth which is a position having a maximum impurity-concentration in a depth direction of the base layer. The unit call further comprises a base contact layer (14) formed within the base layer so as to enclose a bottom of the contact and to bring the base contact layer into contact with the bottom of the contact.

A semiconductor package structure and the methods for forming the same are provided. The semiconductor package structure includes an interposer; a first plurality of bonding pads on a side of the interposer; a semiconductor chip; and a second plurality of bonding pads on a side of the semiconductor chip. The first and the second plurality of bonding pads are bonded through metal-to-metal bonds.

Disclosed is a composition for softening a wet laid cellulosic structure. A particularly preferred structure is an absorbent tissue. Further disclosed are tissue structures softened using the composition. The composition includes an effective amount of a softening active ingredient; a vehicle in which the softening active ingredient is dispersed; an electrolyte dissolved in the vehicle; and a bilayer disrupter. The electrolyte and the bilayer disrupter cooperate to cause the viscosity of the composition to be less than the viscosity of a dispersion of the softening active ingredient in the vehicle alone. Preferably, the softening active ingredient is a quaternary ammonium compound with the formula:(R1)4-m—N+—[(CH2)n—Y—R3]mX−the vehicle is water, the electrolyte is calcium chloride, and the bilayer disrupter is a nonionic surfactant. Also disclosed is a method of using the compound by adding it at a use concentration to the wet end of a papermaking process.

Process for fabricating a SONOS flash memory device, including in one embodiment, forming a bottom oxide layer of an ONO structure on a semiconductor substrate, wherein the bottom oxide layer has a first oxygen vacancy content; treating the bottom oxide layer to decrease the first oxygen vacancy content to a second oxygen vacancy content; and depositing a dielectric charge-storage layer on the bottom oxide layer. In another embodiment, a process for fabricating a SONOS flash memory device includes forming a bottom oxide layer of an ONO structure on the semiconductor substrate under strongly oxidizing conditions, wherein the bottom oxide layer has a super-stoichiometric oxygen content and an oxygen vacancy content reduced relative to a bottom oxide layer formed by a conventional process; and depositing a dielectric charge-storage layer on the bottom oxide layer.

A display device includes: a first substrate including a display area and a pad area; a second substrate facing the first substrate; a touch unit on the second substrate; a window on the touch unit, the window covering the display area and the pad area; an adhesive layer between the window and the touch unit and under the window at the pad area; and a first light source unit under the window at the pad area.

A multilayer film having two or more separable adjacent layers. The multilayer film includes adjacent layers formed of compositions of dissimilar primary materials. Optionally, at least one of the layers contains a slip additive to change the release tension between adjacent layers. The multilayer film may include an adhesive layer between layers, with the adhesive layer more adhesion compatible with one of the layers than the other. The multilayer film may be a relatively inexpensive means to produce labels, films, sheets, containers, etc., requiring protection or isolation of one surface without the additional processes of gluing together individual dissimilar layers. Applications include, but are not limited to, the multilayer film being used as a seal to secure containers, including envelopes, and being imprinted and used as a multilayer labeling system. In one preferred embodiment, at least one layer of the multilayer film undergoes a visibly observable change when the at least one layer is released from at least one other layer; the visibly observable change is useful for many purposes, including, but not limited to, serving as a security mechanism within a container seal which, when the seal is broken, provides evidence that the container was opened.

Apparatus and methods are provided for creating tubular devices, e.g., as components for catheters, sheaths, and or other devices sized for introduction into a patient. In one embodiment, a method is provided for making a tubular device using a sheet of material including a coated first surface. The sheet is rolled around a mandrel until longitudinal edges of the sheet are disposed near or adjacent one another, e.g., without attaching the longitudinal edges together. A tubular braid is positioned over the sheet-wrapped mandrel, one or more tubular segments are positioned over the tubular braid, and heat shrink tubing is positioned over the tubular segments. The resulting assembly is heated to cause the tubular segments to at least partially reflow and / or otherwise laminate the tubular segments to the tubular braid and sheet. The heat shrink tubing and mandrel are then removed to create the tubular device.

A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in turn deposited over the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces each of which has a terminal coated with a metal layer. A chip is mounted on the conductive traces and electrically connected to the terminals by bonding wires, with the dielectric material layer and solder materials being exposed to the outside. This package structure can flexibly arrange the conductive traces and effectively shorten the bonding wires, thereby improve trace routability and quality of electrical connection for the semiconductor package.

Hot-isostatic-pressure (HIP) is used to bond a cemented carbide inlay (e.g., an inlay ring) on a metal substrate (e.g., a hull ring). For example, an inlay ring is made from a powdered metal inlay preform typically comprising at least one metal carbide and at least one nonvolatile cement. The inlay preform is compressed and sintered to make an inlay ring having a predetermined shape, the inlay ring having a modulus of elasticity substantially greater than that of a hull ring. An inlay ring and a hull ring are sealingly vacuum brazed together with at least one evacuated bonding area between them. HIP is applied to compress the hull ring against the inlay ring, thus fusing the hull ring and inlay ring in at least one evacuated bonding area. Following HIP, the inlay ring and hull ring form a fused assembly in which the inlay ring substantially retains its predetermined shape.

A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, and a sealing member. The first semiconductor substrate has a surface and includes a sensing portion on the surface side. The sensing portion has a movable portion. The first semiconductor substrate and the second semiconductor substrate are bonded together to form a stacked substrate. The stacked substrate defines a hermetically sealed space for accommodating the sensing portion between the first and second semiconductor substrates. The stacked substrate further defines a recess extending between the first semiconductor substrate and the second semiconductor substrate to penetrate an interface between the first semiconductor substrate and the second semiconductor substrate. The sealing member is located in the recess.

The present invention is directed to a coated elastomeric sheet or strands having a polymeric coating applied to both sides. The powder-free polymer coating provides good release and anti-blocking properties to elastic strands, as well as adding to the machinability and end-use properties of the strands. The polymer-coated elastic strands are useful in the manufacture of diapers and other disposable articles requiring flexible elastic-lined openings.

The invention relates to a granular material for 3D binder printing, said granular material consisting of particles provided with an externally non-polar surface layer (2). The invention also relates to a method for producing a granular material for 3D binder printing, whereby a surface layer (2) having a non-polar outer side is applied to initial particles (1), and to a method for producing an object consisting of the inventive granular material, according to which a layer of the inventive granular material is applied to a base, and pre-determined regions (3) of said layer are moistened with a binding fluid, said binding fluid being selected from fluids in which a surface layer of the particles of the granular material is soluble. The invention further realties to objects consisting of interconnected particles of the inventive granular material. The invention enables a very precise printing process.

A combination of a low flexural modulus and low crystallinity polyolefin and a functionalized polyolefin were found to result in an olefin composition with excellent adhesion to metals and polar polymers (e.g. polyesters, polyamides, etc) especially fibers therefrom. When these two polyolefins were added to a thermoplastic vulcanizate (e.g. used to partially or fully replace the semicrystalline polyolefin of a thermoplastic vulcanizate), the thermoplastic vulcanizate was found to have the necessary adhesion to form fiber reinforced thermoplastic vulcanizate.

A substrate and a mask are closely adhered to each other with a high alignment accuracy. While the both ends of the substrate are sandwiched between a substrate supporting member and a planar member, the center portion of the substrate is bent in a convex fashion by means of a substrate pressing member. On a mask pedestal, the mask is also bent in a convex fashion with respect to the substrate by means of a mask pressing member. After alignment in the plane direction between the mask and the substrate is performed, the mask and the substrate are made to approach each other and the convex portion is closely adhered to each other at an initial stage, and then the respective whole surfaces of the mask and the substrate are closely adhered to each other, while the substrate pressing member and the mask pressing member are moved backward. The mask pressing member may be omitted.

A method of encapsulating an environmentally sensitive device. The method includes providing a substrate; placing at least one environmentally sensitive device adjacent to the substrate; and depositing at least one barrier stack adjacent to the environmentally sensitive device, the at least one barrier stack comprising at least one barrier layer and at least one polymeric decoupling layer, wherein the at least one polymeric decoupling layer is made from at least one polymer precursor, and wherein the polymeric decoupling layer has at least one of: a reduced number of polar regions; a high packing density; a reduced number of regions that have bond energies weaker than a C—C covalent bond; a reduced number of ester moieties; increased Mw of the at least one polymer precursor; increased chain length of the at least one polymer precursor; or reduced conversion of C═C bonds. An encapsulated environmentally sensitive device is also described.

A process for producing a film forming composition, the process including hydrolyzing and condensing: (A) at least one silane compound selected from a compound (A-1) shown by the following general formula (1), a compound (A-2) shown by the following general formula (2), and a compound (A-3) shown by the following general formula (3), RaSi(OR1)4-a  (1) Si(OR2)4  (2) R3b(R4O)3-bSi—(R7)d—Si(OR5)3-cR6c  (3); and (B) a cyclic silane compound shown by the following general formula (4):

The invention relates to a granular material for 3D binder printing, said granular material consisting of particles provided with an externally non-polar surface layer (2). The invention also relates to a method for producing a granular material for 3D binder printing, whereby a surface layer (2) having a non-polar outer side is applied to initial particles (1), and to a method for producing an object consisting of the inventive granular material, according to which a layer of the inventive granular material is applied to a base, and pre-determined regions (3) of said layer are moistened with a binding fluid, said binding fluid being selected from fluids in which a surface layer of the particles of the granular material is soluble. The invention further realties to objects consisting of interconnected particles of the inventive granular material. The invention enables a very precise printing process.

A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.

A nitride-based compound semiconductor light emitting device includes a first conductive substrate, a first ohmic electrode formed on the first conductive substrate, a bonding metal layer formed on the first ohmic electrode, a second ohmic electrode formed on the bonding metal layer, and a nitride-based compound semiconductor layer formed on the second ohmic electrode. The nitride-based compound semiconductor layer includes at least a P-type layer, a light emitting layer and an N-type layer, and has a concave groove portion or a concave-shaped portion.

A novel dough composition for improved dough can be used to produce a baked, high protein, low carbohydrate bread product. The formulation and process can be used to make low carbohydrate dough that can be used to manufacture bread and other bread-like products of high quality and consumer acceptance. The bread is characterized by low nutritive carbohydrate content, bread-like open cell structure and a high quality nutrition, texture and flavor. The dough comprises an aqueous leavened dispersion that comprises an effective but low amount of wheat flour for texture and flavor, an effective amount of gluten, in excess of the flour content, and an effective amount of a protein source along with an effective amount of an edible fiber to provide high protein content, low carbohydrate content and bread-like texture.

The invention discloses a one-step extrusion-blown molding pot forming technology. According to the one-step extrusion-blown molding pot forming technology, a mold pressing forming technology and an extrusion-blown molding technology are combined into a whole. An air inlet core bar of the extrusion-blown molding technology is also a male mold of the mold pressing forming technology. A pot cover, a spout and a pot body of a formed pot can be formed in an extrusion-blown molding mode with one mold in one step. The technological advance of the hollow forming technology field is promoted, the complex and refine development tendency of current hollow products is met, and more complex products can be developed through the idea.

A method of making an elastic laminate has the steps of first stretching a longitudinally elongated elastic film transversely and then relaxing the transversely stretched film. The relaxed and transversely stretched film is then cut into a pair of adjacent longitudinally extending strips that are bonded adjacent each other between two unstretched and longitudinally extending nonwoven webs to form a laminate. This laminate is then transversely stretched at least at the strips and then relaxed and wound up into a roll. Closure elements that have an elastic center region and less elastic end sections at both ends can be punched from the laminate thus made.

A SONOS flash memory device, including a semiconductor substrate; an ONO structure formed on the semiconductor substrate, the ONO structure including a bottom oxide layer, a dielectric charge storage layer and a top oxide layer, the bottom oxide layer having a super-stoichiometric oxygen content and an oxygen vacancy content of about 1010 / cm2 or less, wherein the bottom oxide layer exhibits a reduced charge leakage relative to a bottom oxide layer having a stoichiometric or sub-stoichiometric oxygen content and a greater number of oxygen vacancies. In one embodiment, the bottom oxide layer has an oxygen vacancy content of substantially zero.

A liquid crystal compound with high helical twisting power, a method for preparing the same, and a liquid crystal composition containing the same. The liquid crystal compounds include cyclic group chain structures similar to the liquid crystal to serve as the core structure, and multi-ring structures of natural alcohol with optical activity, such as alcoholates of terpenol, borneol, cinchonidine, quinine, or derivatives thereof. As a result, the liquid crystal composition containing the liquid crystal compounds can filter out light of specific wavelengths from incident light due to optical activity and high helical twisting power thereof.