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Laser micropore processor of rotating double-optical wedge

A technology of micro-hole processing and double optical wedge, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problem of insufficient pass precision at the edge of the aperture, improve pass precision and work efficiency, and reduce thermal influence zone effect

Inactive Publication Date: 2010-03-17
SHANGHAI INST OF LASER TECH
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  • Summary
  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the shortcomings of the thermal influence of the edge of the aperture and the insufficient precision of the hole pattern in the laser fine machining array microhole forming of the existing device, a laser microhole processing device with a rotating double optical wedge is provided.

Method used

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  • Laser micropore processor of rotating double-optical wedge

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Embodiment Construction

[0039] The specific embodiment of the present invention is described in conjunction with accompanying drawing:

[0040] Depend on Figure 5 As shown, a rotating double optical wedge laser microhole processing device is characterized in that it includes:

[0041] 1. An ultrashort pulse laser output system consisting of a laser, a beam expander and a laser transmission system: the laser is a DPSS solid-state laser that outputs nanosecond-level pulsed parallel light, and a computer is used to control the switch signal of the laser and adjust the laser The output power and repetition frequency are transmitted to the double wedge beam deflection system through the beam expander and the laser transmission system;

[0042] 2. A double-wedge beam deflection system consisting of two wedges, a double-wedge support rotation mechanism and a control system (such as Figure 4Shown): The two optical wedges are exactly the same, the support and rotation mechanism of the optical wedge makes ...

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Abstract

The invention discloses a laser micropore processor of a rotating double-optical wedge, comprising an ultrashort pulse laser output system consisting of a laser, a beam expander and a laser transmission system, a beam deflection system of the double-optical wedge consisting of two optical wedges, a bearing rotary mechanism of the double-optical wedge and a control system, a laser focusing system consisting of a laser focus lamp and a focuser and an adsorption location displacement system of workpieces and a computer system consisting of an installation mechanism of the workpieces and a two-dimensional displacement platform. The invention selects the DPSS laser with high-quality beam and uses the laser focusing system reaching or approaching the diffraction limit to obtain the fine focusesbeams, and then uses double-optical wedge to process the micropore in the situation of high speed revolution, therefore the invention reduces the heat affected zone of the edge of an aperture and improves caliber precision and work efficiency.

Description

technical field [0001] The invention relates to a rotating double optical wedge laser microhole processing device, which belongs to the application field of laser fine processing technology Background technique [0002] Laser micro-hole processing technology is to use the characteristics of the interaction between the laser beam and the material to carry out micro-drilling processing on materials (including metals and non-metals), involving multi-disciplinary comprehensive technologies such as optics, mechanics, electricity, computer control, material properties and detection. . Laser drilling is widely used in high-tech industries such as automobiles, microelectronics, optical communications, aerospace, biomedicine, solar energy and fuel cell new energy, improving or replacing some traditional processing methods. At present, the semiconductor integrated circuit industry is developing rapidly in the world. Computers, mobile phone circuit boards, and portable consumer electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/046B23K26/064B23K26/082B23K26/388
Inventor 潘涌姜兆华张伟王又良张同兴王健超沈冠群
Owner SHANGHAI INST OF LASER TECH
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