Laser processing method and laser processing equipment

A laser processing method and laser processing technology, which are applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of low efficiency and large grinding rod loss, achieve small pulse width, suppress the generation of microcracks, and improve The effect of processing efficiency

Active Publication Date: 2012-12-12
SUZHOU DELPHI LASER
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the grinding rod wears a lot and the efficiency is very low
Therefore, for tempered glass, such as Gorilla Glass (Gorilla), Sodalime Glass (Sodalime) and Dragontrail Glass (Dragontrail) and other tempered glass, the

Method used

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  • Laser processing method and laser processing equipment
  • Laser processing method and laser processing equipment
  • Laser processing method and laser processing equipment

Examples

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Example Embodiment

[0027] The laser cutting technology of the present invention is a heat removal cutting process using laser as an energy source. Specifically, the present invention uses the high power density output of the pulsed laser at the condensing point to instantly vaporize or melt the material at the laser condensing point, thereby realizing the removal of the material. The material heat removal area extends to form a heat removal surface, thereby realizing the cutting and separation of the material.

[0028] The cutting process of the present invention first irradiates and scans a laser on or near a predetermined cutting starting surface of the processed object to thermally remove material from the cutting starting surface of the processed object. The cutting starting surface of the processed object is thermally removed and the internal material of the processed object is exposed to form a new surface. Then, irradiate and scan the laser on the formed new surface to further remove the ma...

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Abstract

The invention provides a laser processing method and laser processing equipment. The laser processing method comprises the steps as follows: radiating the laser through an incident surface of a material to be processed, and colleting the light on the initial cutting surface of or close to the material to be processed so as to gasify and/or melt the material to be processed at a light collecting point and/or in an area close to the light collecting point; forming an initial thermal removing area on the initial cutting surface; continuously distributing the initial thermal removing areas on the initial cutting face along a preset path so as to form an initial thermal removing line; irradiating the laser to collect the light on the surface of or close to the material to be processed formed in the thermal removing step so as to gasify and/or melt the material to be processed at the light collecting point and/or the area close to the light collecting point, thereby forming a follow-up thermal removing area; and continuously distributing the follow-up thermal removing areas along the preset path so as to form a follow-up thermal removing line.

Description

technical field [0001] The invention relates to a laser processing method and laser processing equipment. Background technique [0002] Tempered glass, such as Gorilla Glass from Corning, Dragontrail and Sodalime from Asahi, Japan, has been widely used due to its high permeability and high strength. Applied to display devices. [0003] It is usually difficult to cut tempered glass well by traditional glass cutting process. Traditional glass cutting mainly includes wheel cutting, laser cutting and rod grinding. Traditional knife wheel cutting and laser cutting use knife wheel or laser to form cutting initial openings or initial cracks on the surface or inside of the glass, and then make the cracks extend between the upper and lower surfaces of the glass in the slitting process to completely cut the glass. When cutting tempered glass by traditional knife wheel cutting or laser cutting process, due to the stress in the tempered layer of tempered glass, cracks in the tempered...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/067B23K26/14B23K26/18B23K26/16
Inventor 赵裕兴狄建科益凯劼张子国闫华
Owner SUZHOU DELPHI LASER
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