746 results about "Irradiation laser" patented technology

A wafer processing method includes forming a bonded wafer by bonding a first wafer to a second wafer, irradiating a laser beam along a position separate inward from an outer circumferential edge by a predetermined distance in an annular manner and forming, inside the first wafer, an annular modified layer and cracks that extend from the modified layer toward a front surface side to cause warpage in the outer circumferential region. The method also includes detecting the amount of warpage of the outer circumferential region, determining whether or not bonding between the first wafer and the second wafer has been released on the basis of the amount of warpage of the outer circumferential region, deciding whether or not to execute a grinding step, and if so, grinding the first wafer from a back surface side.

A processing method of a workpiece with a circular disc shape includes sticking a tape to one surface of the workpiece and integrating the workpiece and a frame through the tape, holding the workpiece by a holding unit with the interposition of the tape, and irradiating the other surface of the workpiece located on the opposite side to the one surface with a pulsed laser beam having such a wavelength as to be absorbed by the workpiece from the side of the other surface. In irradiating the laser beam, the other surface is annularly irradiated with the laser beam in the state in which the orientation of the laser beam is adjusted in such a manner that the laser beam has an angle of incidence formed due to inclination with respect to a normal to the other surface of the workpiece by a predetermined angle.

Provided is an irradiation device that is capable of effectively suppressing activities of insect pests. An irradiation device (100) includes: a detection section (31) that detects an insect which is an irradiation target; an identification section (32) that identifies position information of the irradiation target; and an irradiation section (1) that, based on the position information, irradiates the irradiation target with shooting laser light (L2) while targeting a specific part of the irradiation target.

A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unit 190 configured to condense laser light B so as to face an upper surface 10a of a block 10 of single crystal diamond, a step of forming a modified layer 20, which includes a processing mark 21 of graphite and a crack 22b extending along a surface (111) around the processing mark 21, in a partial region of the upper surface 10a of the block 10 along the surface (111) of the single crystal diamond, along the surface (111) of the single crystal diamond at a predetermined depth from the upper surface 10a of the block 10 by radiating the laser light B on the upper surface 10a of the block 10 from the laser condensing unit 190 under predetermined conditions and condensing the laser light B inside the block 10, and moving the laser condensing unit 190 and the block 10 in a relative manner two-dimensionally, and a step of forming a cleavage plane 25 at the predetermined depth of the remaining region of the upper surface 10a of the block 10 by spontaneously propagating cleavage from the modified layer 20.

The present technology relates to a welding torch that can prevent worker safety accidents by achieving weight reduction through omitting unnecessary parts and using different materials for components constituting a manual laser welding torch which a worker can grip to weld a base material by using laser. More specifically, a gripping part comprises: a gripping body having a laser movement path therein, and having a movement path along which water circulates to cool multiple lenses provided inside the gripping part, a movement path along which gas can be discharged via a laser emission part, and a space part for reducing the weight of the welding torch, formed independently of each other, a gripping case being mounted on the outer surface of the gripping body; and a safety means mounted on the gripping case and the laser emission part so as to not only control the operation of a trigger that determines whether to emit laser, but also block the diffuse reflection of laser emitted to the outside through the laser emission part.

To provide a welding method of a temperature controller capable of suppressing distortion after welding an aluminum-containing plate material by a superposed laser beam.SOLUTION: A welding method of a temperature controller includes, in the following order: a fixing step of superposing aluminum-containing plate materials P and fixing the aluminum-containing plate materials P by a jig G; a pre-heating step of raising a pair of the aluminum-containing plate materials P in a superposed state and the jig G to a preset pre-heating temperature; and a welding step S3 of irradiating one outer surface of the pair of aluminum-containing plate materials P in a heated state with a laser beam LB to weld the same.SELECTED DRAWING: Figure 3

A method for manufacturing a fluidic device comprises: forming a laminate including a first substrate made from resin material transmissive to laser light, an intermediate layer stacked on the first substrate and made from resin material absorptive to the laser light, and a second substrate stacked on the intermediate layer and made from resin material transmissive to the laser light; and welding the first substrate and the intermediate layer, and the intermediate layer and the second substrate, by irradiating the laminate with laser light from the direction of the first or the second substrate and melting the intermediate layer over the entire thickness direction in an area irradiated with the laser light, wherein the forming includes forming a flow channel in a contact surface of the first or the second substrate with the intermediate layer; or forming a penetration area penetrating in the stacked direction in the intermediate layer.

This aggregation state determination method is a method in which laser light is irradiated into a liquid containing particles, and the aggregation state of the particles is determined on the basis of the light reception intensity of scattered light obtained by scattering the laser light by the particles. And determines the aggregation state of the particles on the basis of the value of a variation index indicating the variation in the light reception intensity.

The invention discloses a device and method for testing performance degradation of a deep ultraviolet fused quartz material, and the method comprises the steps: employing a continuous laser beam with the wavelength of 213nm as a detection light beam, and simultaneously monitoring the transmittance change of the detection light beam after the detection light beam passes through a deep ultraviolet laser irradiation region of the deep ultraviolet fused quartz material and the instantaneous change of the light intensity of a light beam central region; the color center defect concentration change of the deep ultraviolet fused quartz material caused by deep ultraviolet laser irradiation and the absorption change of the deep ultraviolet laser irradiation wavelength are obtained, and the transmittance change of the irradiation laser beam transmitting the deep ultraviolet fused quartz material is monitored at the same time; the performance degradation data of the deep ultraviolet fused quartz material under the irradiation of the deep ultraviolet laser and the contribution of the color center defect generated by the irradiation of the deep ultraviolet laser to the performance degradation are obtained. According to the invention, the contribution of color center defects to performance degradation can be distinguished, the performance recovery mechanism of hydrogen can be measured, and the measurement sensitivity of thermal lens signals can be effectively improved.

The present invention relates to an electrode notching device and an electrode notching method using same, the electrode notching device comprising: a transferring jig facing one surface of an electrode to be notched so as to support the electrode; a laser part for emitting a laser toward the electrode in order to cut a predetermined area of the electrode; a pattern jig which is provided at one side of the transferring jig to support one edge of the electrode and includes a first surface having a first cut part formed therethrough to allow the laser emitted from the laser part to pass therethrough; and a suction part for collecting foreign substances generated during a cutting process by the laser, wherein the suction part includes a first suction part positioned below the pattern jig and a second suction part positioned on the side surface of the pattern jig.

The invention provides a bulletproof helmet detection method and device. According to the bulletproof helmet detection method, a laser dot matrix is irradiated on the inner surface of a to-be-detected helmet, initial position information and real-time position information of each laser point position in the laser dot matrix are measured to obtain a real-time displacement vector of the laser dot matrix, and then the real-time displacement vector can be used for judging the deformation condition of the to-be-detected helmet. Meanwhile, in consideration of the fact that the helmet to be tested possibly generates rigid displacement during testing, a component with the minimum absolute value is screened out from the real-time displacement vectors, and the component is subtracted from each component in the real-time displacement vectors to obtain a real displacement vector of the laser dot matrix, so that the influence of the rigid displacement of the helmet to be tested on the actual deformation is filtered out, and the measurement accuracy is improved. The measurement precision is improved. The invention further provides a detection device which is used for realizing the detection method, and the laser light source and the image sensor are integrated into the supporting assembly, so that the internal deformation of the helmet to be detected is measured.

The present disclosure provides a light detection device capable of reducing an influence of disturbance light while suppressing a decrease in measurement accuracy on a short distance side.　According to the present disclosure, provided is an optical detection device (20) that detects laser light for measurement reflected from an object (50), the device comprising: a pixel (1000) that generates, in accordance with a received photon, a plurality of types of pulse signals (PLS1, PLS2) in which the pulse width increases with the elapse of time from the time at which the laser light is irradiated; a time information generation unit (111) that generates information on a first time range (tPLS1, tPLS2) that is a range corresponding to the pulse width and indicates an elapsed time; a histogram generation unit (112) that, on the basis of the information in the first time range, adds a prescribed number of frequencies in a range corresponding to the first time range to generate a histogram indicating the frequency value; and a signal processing unit (113) that generates a distance value (D) to the object (50) on the basis of the frequency value of the histogram.

An ablation method according to one aspect of the present disclosure includes a step of displaying, on a monitor, an image of a camera that is imaging an object to be ablated, a step of designating a region of the object to be irradiated with laser light by tracing the image displayed on the monitor, and a step of irradiating the designated region with laser light to ablate it.

Deep learning is performed by using a material of a processing object, a laser beam parameter showing a property of laser beam which the processing object is irradiated with, and pre-processed part data and post-processed part data that respectively reflect laser processing-involved three-dimensional shapes of a processed part before and after irradiation of the processing object with the laser beam. A first relationship of input data that are the material of the processing object, the pre-processed part data, and the laser beam parameter to output data that is the post-processed part data after irradiation with the laser beam in relation to the input data is accordingly obtained as one learning result.

The present steel sheet processing apparatus includes one or more support rolls and a laser irradiation unit. The laser irradiation unit includes a laser output unit, a laser scanning unit, a focusing optical unit, a housing, and an angle adjustment unit that changes an angle of the housing with respect to a steel sheet. When a surface of the steel sheet is scanned with a laser beam, the angle adjustment unit changes the angle of the housing in a plane formed by a normal direction of the steel sheet surface and a scanning direction so that a distance from the focusing optical unit to the surface of the steel sheet of the laser beam focused by the focusing optical unit is equal over a total length of a scanning region of the laser beam on the surface of the steel sheet. The laser irradiation unit irradiates the laser beam in a state in which the angle of the housing is changed by the angle adjustment unit to form grooves or residual stress regions on the surface of the steel sheet.

The invention discloses a laser annealing method and a semiconductor device. The laser annealing method comprises the following steps: providing a substrate; scanning at least one line on the substrate by using the laser beam, the scanning of one line on the substrate by using the laser beam comprises a periodic action, and the periodic action comprises that the laser beam and the substrate statically irradiate the substrate relative to each other, the laser beam stops irradiating, and a light source of the laser beam and the substrate move relative to each other along the line direction; wherein the irradiation area of the laser beam on the substrate is rectangular, the width of the rectangle is smaller than the width of the substrate in the row direction, the energy density distribution of the laser beam is an isosceles trapezoid, and the irradiation area of the laser beam on the substrate comprises a first gradient area, a uniform area and a second gradient area corresponding to the isosceles trapezoid. According to the laser annealing method, by adjusting the overlapping range of the irradiation areas of the laser beams, laser heat can be uniformly transmitted to the semiconductor device during laser annealing, so that amorphous silicon on the semiconductor device is uniformly crystallized.

A laser cutting device according to the present invention is to perform laser cutting of a workpiece and comprises a laser beam irradiation unit that emits a laser, a laser nozzle that has an internal passage along which the laser passes and can irradiate the laser at the workpiece from a tip end opening part that is provided on the tip end side in the optical axis direction of the laser, an acquisition unit that can acquire the outline of the laser that passes through the tip end opening part and the outline of the tip end opening part, and a control unit that calculates a positional deviation amount for the optical axis of the laser relative to the tip end opening part on the basis of the outline of the laser and the outline of the tip end opening part.

The utility model discloses a metal powder particle size detection device which comprises a laser particle size detector, a laser emitting end and a laser receiving end are arranged in the laser particle size detector, an insertion cavity for a sample box to be inserted is arranged in the laser particle size detector, and the upper end of the sample box is provided with an opening. The laser emitting end and the laser receiving end are arranged above the sample box, the laser emitting end irradiates laser to the sample box, and the laser receiving end is used for receiving light scattered by a powder sample in the sample box; a pneumatic stirring mechanism for stirring a sample in the sample box is arranged in the laser particle size detector; according to the utility model, pulse-type airflow is blown into the sample box through the air nozzle, so that metal powder in the sample box is stirred, and the powder is raised, so that the powder is prevented from being accumulated together, and the detected structure is more accurate.

To realize decontamination in a corner part such as internal corner of a structure by an optical system of a decontamination device and simple setting.SOLUTION: The decontamination method performs decontamination by irradiating an irradiation target member, that is, surfaces of a wall part 3 and a floor part 4 orthogonal to one another and a junction 5 at an internal corner part with a laser beam L emitted from a laser head 20 of a laser decontamination device at an irradiation angle 45°. The decontamination method includes adjusting a focal distance of the laser beam L in an optical system 30 of the laser head 20 in accordance with irradiation angle θv changing when the laser beam L is deflected and scanned, and emitting the laser beam L while focusing the laser beam L on the surfaces of the wall part 3 and the floor part 4 to cut the member surface for decontamination.SELECTED DRAWING: Figure 3

The aggregation state determination method according to the present invention is a method for irradiating a liquid containing particles with laser light and determining the aggregation state of the particles on the basis of the amplitude of change in the light reception intensity of scattered light obtained by scattering the laser light by the particles, and comprises: a correlation acquisition step for acquiring a correlation between the particles and the laser light; obtaining the correlation between the particle size of the particles and the change amplitude of the light receiving intensity; and a determination step for determining the aggregation state of the particles on the basis of the correlation.

The method for manufacturing a composite substrate includes: forming an intermediate layer on a support substrate; respectively irradiating FAB on the surface of the piezoelectric material substrate and the surface of the intermediate layer formed on the support substrate; the surface of the piezoelectric material substrate is further irradiated with FAB, and a sputtering film containing the material of the piezoelectric material substrate is formed on the surface of the middle layer; a bonding step for bonding the piezoelectric material substrate and the intermediate layer on which the sputtering film is formed to obtain a bonded body having the waveguide substrate; and irradiating the joined body with laser light along the surface direction of the composite substrate, and forming the composite substrate using the joined body irradiated with the laser light.

The present invention addresses the problem of providing a method and a device for bringing a holding layer into contact with an element only in a region that is the same as the size of a second main surface of the element or that is further inward than the size of the second main surface of the element. Specifically, a partial removal method for a holding layer is provided in which a part of the holding layer (10) is removed from a substrate (20) on which a second main surface (1B) of an element is held by means of the holding layer (10). A holding layer removal step is performed in which a portion of the holding layer (10) is removed by irradiating laser light from the first main surface (1A) side of the element so that the entire range of arrangement of the holding layer (10) in the region of arrangement of the element becomes an irradiation range.

The present disclosure includes a laser welding method in which a joint surface between a plurality of workpiece members is welded by radiating laser beam LB, and a locus of laser beam LB is controlled so as to perform wobbling scanning Sw by a combination of scanning motion Sa moving along first direction x parallel to the joint surface and swing motion Sb including first swing component Bx along first direction x and second swing component By along second direction y perpendicular to first direction x, the method including a defect determination step of determining occurrence of a welding defect; and an output control step of increasing or decreasing an output of laser beam LB when laser beam LB is radiated again toward the welding defect in a case where the welding defect occurs.

The invention provides a substrate processing apparatus capable of effectively controlling the process atmosphere of a substrate processing process using laser light. The substrate processing apparatus includes a support table module configured to support a substrate, a laser irradiation unit configured to irradiate laser light to the substrate, and an atmosphere creation module provided with a through hole through which the laser light passes. The atmosphere creation module may include a first gas supply component configured to supply atmospheric gas to the through hole, and a second gas supply component configured to supply atmospheric gas in a direction of the support table module.

The laser system (1) is configured to provide a laser line (L) in a working plane (WP) for line irradiation of an object (7). The laser line (L) extends to a significant extent in a first direction (x) and to a lesser extent in a second direction (y). The laser system (1) comprises a laser source (3) for providing a laser beam (3A) as a basis for an elongated input laser beam (13A) propagating along a propagation direction (z), and a homogenizing and focusing unit (60) for homogenizing the strip-shaped laser beam (13A) to form the laser line (L). The laser system (1) is particularly suitable for providing a laser line (L) that can be spliced ​​to another laser line (L') of a corresponding further laser system (1').

The application discloses a fouling detection device and method based on photoacoustic imaging, wherein the detection device comprises: a sealed cover with at least one transparent surface; a photoacoustic excitation module comprising a laser, an optical fiber bundle and a plurality of micro-fiber collimators; the micro-fiber collimators are integrated in the transparent surface and used for irradiating laser outside the transparent surface to generate a photoacoustic signal; a photoacoustic collection module arranged along the propagation direction of the photoacoustic signal and used for collecting the photoacoustic signal; and a data processing module in communication connection with the photoacoustic collection module and used for calculating the fouling degree outside the transparent surface according to the collected photoacoustic signal. The application adopts nanosecond-level light pulses to improve the detection accuracy; and the laser sequentially traverses the optical fiber, so that the position of fouling can be accurately located, and a reliable basis is provided for fouling removal.

The invention relates to a jig for laser welding and a method for manufacturing a battery. This laser welding jig (2) can be used when laser welding is performed by irradiating a portion to be welded (115) with laser light, and is provided with: a housing section (10) capable of housing the portion to be welded (115) in a first direction; and an inclined surface (20) extending in the circumferential direction so as to surround the portion to be welded (115) around an axis in the first direction, the inclined surface (20) being capable of reflecting laser light emitted toward the laser welding jig (2) in a second direction intersecting the first direction and toward the portion to be welded (115).

The utility model relates to the technical field of medical auxiliary instruments, and discloses a cerebral hemorrhage 3D printing guide plate which comprises a guide plate body and a positioning structure of the guide plate body, and one side of the guide plate body is fixedly connected with an upper clamping plate, a clamping plate bolt, a lower clamping plate and a right clamping plate. The medical supply butt joint device is reasonable in structure, medical supplies needing butt joint are placed on the upper surface of the lower clamping plate, the upper clamping plate moves upwards by screwing the clamping plate bolt, so that the upper clamping plate and the lower clamping plate clamp and fix the medical supplies needing butt joint, the right spring buckle is pressed, and then the right positioning plate and the right clamping plate are in butt joint. Laser irradiated by a right laser pen coincides with a right gasket, a right magnet piece is connected with the right gasket in a magnetic attraction mode, a binding belt is tightened by rotating a butt joint rotating shaft, and after being tightened, the binding belt penetrates through a butt joint hole and the butt joint rotating shaft at the same time through a positioning rod, so that the butt joint rotating shaft cannot rotate; the stability of the guide plate body can be enhanced.

The disclosed embodiments provide a method for fabricating a semiconductor device using gallium nitride as an epitaxial layer, comprising: depositing a laser absorption layer on a deposition surface of a substrate; patterning the laser absorption layer to form a patterned structure, and depositing a gallium nitride epitaxial layer on the patterned structure; and irradiating the laser absorption layer from the bottom surface of the substrate with a lift-off laser, such that the upper surface temperature of the irradiated area adjacent to the gallium nitride epitaxial layer is higher than the thermal decomposition temperature of gallium nitride. The laser absorption layer serves as a functional layer for absorbing the lift-off laser. Thermal decomposition of the adjacent gallium nitride epitaxial layer is achieved by heating the laser absorption layer to the thermal decomposition temperature of gallium nitride. Furthermore, the photon energy of the lift-off laser is less than the bandgap of gallium nitride. Therefore, no matter how the lift-off laser is focused, it will not be absorbed by the gallium nitride epitaxial layer, and the corresponding epitaxial layer will not generate heat.

The technical concept of the present disclosure provides a laser grooving apparatus, comprising: a conveying section that conveys an electrode sheet; a laser irradiation unit that irradiates a laser beam to the electrode sheet to groove the electrode sheet; a pattern jig configured to support the electrode sheet moving in a first direction; and a suction box on which the pattern jig is mounted and which has an internal space, the pattern jig including: a pattern hole which overlaps the electrode sheet in a second direction and through which the laser beam passes; and a side suction hole extending in a third direction intersecting the first direction and the second direction, and guiding outside air to be sucked into the inner space of the suction box in the third direction.