208 results about "Irradiation laser" patented technology

The method for manufacturing a composite substrate includes: forming an intermediate layer on a support substrate; respectively irradiating FAB on the surface of the piezoelectric material substrate and the surface of the intermediate layer formed on the support substrate; the surface of the piezoelectric material substrate is further irradiated with FAB, and a sputtering film containing the material of the piezoelectric material substrate is formed on the surface of the middle layer; a bonding step for bonding the piezoelectric material substrate and the intermediate layer on which the sputtering film is formed to obtain a bonded body having the waveguide substrate; and irradiating the joined body with laser light along the surface direction of the composite substrate, and forming the composite substrate using the joined body irradiated with the laser light.

The application discloses a fouling detection device and method based on photoacoustic imaging, wherein the detection device comprises: a sealed cover with at least one transparent surface; a photoacoustic excitation module comprising a laser, an optical fiber bundle and a plurality of micro-fiber collimators; the micro-fiber collimators are integrated in the transparent surface and used for irradiating laser outside the transparent surface to generate a photoacoustic signal; a photoacoustic collection module arranged along the propagation direction of the photoacoustic signal and used for collecting the photoacoustic signal; and a data processing module in communication connection with the photoacoustic collection module and used for calculating the fouling degree outside the transparent surface according to the collected photoacoustic signal. The application adopts nanosecond-level light pulses to improve the detection accuracy; and the laser sequentially traverses the optical fiber, so that the position of fouling can be accurately located, and a reliable basis is provided for fouling removal.

The technical concept of the present disclosure provides a laser grooving apparatus, comprising: a conveying section that conveys an electrode sheet; a laser irradiation unit that irradiates a laser beam to the electrode sheet to groove the electrode sheet; a pattern jig configured to support the electrode sheet moving in a first direction; and a suction box on which the pattern jig is mounted and which has an internal space, the pattern jig including: a pattern hole which overlaps the electrode sheet in a second direction and through which the laser beam passes; and a side suction hole extending in a third direction intersecting the first direction and the second direction, and guiding outside air to be sucked into the inner space of the suction box in the third direction.

A method of manufacturing a semiconductor device includes: preparing a superposed substrate in which a first substrate and a second substrate are bonded via a heat conduction control film, a peeling promotion film, and a laser absorbing film; irradiating the laser absorbing film with laser; and separating the first substrate from the second substrate, in which the thermal conductivity control film, the peeling promoting film, and the laser absorbing film are laminated in this order from the first substrate side, the thermal conductivity of the thermal conductivity control film is different from the thermal conductivity of the peeling promoting film, and the thermal conductivity of the laser absorbing film is different from the thermal conductivity of the peeling promoting film. The thermal expansion coefficient of the peeling promoting film is greater than the thermal expansion coefficient of the laser absorbing film.

The preliminary solder forming method is a method for forming preliminary solder on an aluminum electrode formed of aluminum. The preparation solder forming method includes: a disposing step of disposing solder on an aluminum electrode; and a bonding step in which the solder is bonded to the aluminum electrode by melting and solidifying the solder using a laser. In the joining step, the laser light is irradiated such that the energy of the laser light irradiated to the aluminum electrode is greater than the energy of the laser light irradiated to the solder.

The invention provides an electrode sheet manufacturing system and a battery manufacturing method using the electrode sheet manufacturing system. The electrode sheet manufacturing system can raise the temperature of an electrode body without raising the space temperature and can homogenize the thickness of the electrode body after pressurization. The electrode sheet manufacturing system according to the present invention produces an electrode sheet by pressurizing an electrode body, the electrode sheet manufacturing system being provided with: an irradiation mechanism that irradiates the electrode body with laser light to raise the temperature of the electrode body; and a pressing mechanism that presses the electrode body heated by the irradiation mechanism to produce an electrode sheet.

A laser welding method according to an embodiment of the present invention comprises: a step for alternately irradiating an end of a first linear member and an end of a second linear member adjacent to the first linear member with laser light to form a first weld pool spanning the end of the first linear member and the end of the second linear member; and a step for irradiating the first molten pool with the laser light. In the step of irradiating the first molten pool with the laser light, the center side of the first molten pool is set as the starting point of irradiation of the laser light, and the irradiation position of the laser light gradually moves away from the starting point or staged away from the starting point as the laser light rotates around the starting point.

The present application relates to a method of manufacturing an electricity storage device and an electricity storage device. The method of manufacturing an electricity storage device includes a housing main body preparation step, a seal plate preparation step, and a welding step. The seal plate prepared in the seal plate preparation step has a seal portion that covers an opening of the housing main body and overlaps an edge of the opening, and an insertion portion that enters into the opening along an inner side of the housing main body in a state where the seal plate plugs the opening. In the step of laser welding the housing main body and the seal plate, the junction of the edge of the opening and the seal portion is welded by irradiating laser to a portion on the seal portion side than the junction of the edge of the opening and the seal portion.

The invention provides a method for manufacturing a wiring board. The wiring board is provided with a via hole conductor which is accurately formed. A method of manufacturing a wiring board according to an embodiment includes the steps of: preparing a support substrate having a metal film layer (ML2) formed on a surface thereof; forming a plating film layer (122) including an alignment pattern (AP) on the metal film layer (ML2); forming an insulating layer (11) covering the plating film layer (122); forming a through hole penetrating the insulating layer (11) in the thickness direction by irradiating the insulating layer (11) with laser light (LL) by referring to position information obtained from the alignment pattern (AP); and forming a via conductor by filling the through hole with a conductor. The step in which the plating film layer (122) is formed includes a step in which the positive reflectance of light having a predetermined wavelength on the upper surface of the metal film layer (ML2) is made different from the positive reflectance of light having a predetermined wavelength on the upper surface of the plating film layer (122).

Disclosed is an apparatus for manufacturing a display device, the apparatus comprising: a stage on which a display substrate is mounted; a light source unit that generates light and emits a laser beam in a first direction; and a light path module that reflects the laser beam emitted from the light source unit and input, and outputs the laser beam in a second direction intersecting the first direction, thereby irradiating the stage with the laser beam. The light path module comprises: a head part provided with an input opening through which the laser beam is input; a level adjustment part that is disposed below the head part and can adjust the level of the head part in the height direction; a position adjustment part that is disposed below the level adjustment part and can adjust the position of the head part in the longitudinal direction; and a base disposed below the position adjustment part.

A method for manufacturing a pattern glass includes: providing a plurality of guide films on a pattern glass including flat areas and a pattern area between the flat areas, wherein the guide films are in contact with side surfaces of the flat areas; providing a first support film on top surfaces of the pattern glass and the guide films; providing a second support film on bottom surfaces of the pattern glass and the guide films; providing a shielding film having a through-hole formed therein on at least one selected from among the first and second support films, wherein the through-hole overlaps with the pattern area; injecting an uncured resin into the pattern area of the pattern glass through an injection channel formed between the guide films; and curing the uncured resin filled in the pattern area by irradiating a laser beam toward the pattern area exposed through the through-hole.

A laser irradiation system is disclosed. The system comprises a mobile application program executed in a mobile terminal of a user; a management server that determines whether the user is a hypertensive patient by receiving and analyzing the face image of the user from the mobile application; one or more laser radiators in which a plurality of light-emitting elements for radiating laser light to different parts of the body of a user in a lying position are arranged; and a controller that controls the laser irradiator. Further, the controller includes: a communication unit for performing close-range data communication with the mobile application; the information storage part stores meridian point information including acupuncture points for hypertension; and a control unit that, when data indicating that the user is a hypertensive patient is received from the mobile application via the short-range communication unit, drives and controls the light-emitting elements corresponding to the acupoints for hypertension stored in the information storage unit so as to irradiate the corresponding acupoints with laser light.

According to an exemplary embodiment, a method of manufacturing a secondary battery is provided. The manufacturing method can include the steps of aligning a bottom pouch and a cover pouch, wherein each of the bottom pouch and the cover pouch includes a sealing material layer, a protective layer, and a metal layer between the sealing material layer and the protective layer, and the sealing material layer of the bottom pouch is aligned to face the sealing material layer of the cover pouch; and irradiating a laser beam to a first sealing portion of the bottom pouch and the cover pouch. The wavelength of the laser beam can be in a range of 0.01 μm to 0.1 μm, or in a range of 0.8 μm to 1.0 μm.

A method of manufacturing a multilayer electronic component includes forming a ceramic laminate in which a plurality of ceramic green sheets and a plurality of internal electrode patterns are stacked in a first direction; cutting the ceramic laminate into individual multilayer chips, by irradiating a laser onto one surface of the ceramic laminate and irradiating a laser onto the other surface opposing the one surface of the ceramic laminate in the first direction; firing one of the multilayer chips so as to form a ceramic body including an internal electrode and a dielectric layer; and forming external electrodes on a first side and a second side of the ceramic body.

The application discloses a laser-assisted chemical vapor deposition system and belongs to the technical field of chemical vapor deposition, which can solve the problems of poor deposition quality, high deposition cost and narrow application range of the existing chemical vapor deposition system. The system comprises a deposition module, a laser module and a temperature monitoring module. The deposition module is used for depositing a thin film on a sample surface by using a chemical vapor deposition method. The laser module is connected with the deposition module and is used for providing an irradiation laser beam to the sample surface. The temperature monitoring module is connected with the deposition module and is used for monitoring the temperature of the sample surface. The control module is connected with the laser module and the temperature monitoring module and is used for controlling the power of the irradiation laser beam according to the temperature of the sample surface. The application is used for chemical vapor deposition.

The invention discloses a security and protection monitoring device and method based on human shape recognition and laser active intervention. The security and protection monitoring device comprises a mounting main body, an image acquisition unit, a laser emission unit, a holder control unit, an AI chip and a security control unit, the AI chip can run a deep learning human shape recognition algorithm and is used for processing a video stream acquired by the image acquisition unit in real time, framing a human shape target with high confidence and outputting pixel coordinates of the human shape target to the holder control unit; when the AI chip analyzes in real time and detects that the confidence coefficient of a human-shaped target in a picture provided by the image acquisition unit exceeds a set threshold value, the holder control unit controls the image acquisition unit and the laser emission unit to rotate and track the human-shaped target, and laser is irradiated to form a visual warning. The method has the advantage that the effectiveness and the real-time response capability of the security and protection system can be ensured.

A laser notching apparatus of the present disclosure includes a supporting member for supporting an electrode plate; and a laser irradiating member above the supporting member and which irradiates a laser to the electrode plate at a set angle to cut the electrode plate.

This invention provides a sterile filling method and system that avoids or reduces the risk of disinfectant residue and achieves effective sterilization in a short time. One sterile filling method is a method for filling a sterilized container with contents, comprising: laser irradiation treatment, irradiating the container or container preform with a CO2 laser to sterilize the container surface; and filling treatment, filling the container with contents.

A laser irradiation system (1) for crushing a stone (S) in a liquid by irradiating the stone (S) in the body with a laser light, the laser irradiation system (1) comprising: a laser fiber (3) having a fiber emission end (3a) for emitting the laser light; and at least one processor for controlling the frequency of the laser light emitted from the optical fiber emission end (3a), the processor switching the frequency of the laser light between a first pulse train, which is a high-frequency pulse train having an output power for crushing the stone (S), and a second pulse train, which is a high-frequency pulse train having an output power for crushing the stone (S). The second pulse train is a waveform pulse train having a lower frequency than the first pulse train and having a peak power gradually increasing in the axial direction of the irradiation time, and the second pulse train is emitted at least either before or after the timing at which the first pulse train is emitted.

In a bonding process in which two objects to be bonded are bonded to a bonding target portion set in the facing surfaces thereof, when an unbonded portion is generated in at least a portion of the bonding target portion, a bonding repair method repairs the bonded state of the unbonded portion by irradiating the unbonded portion with laser light.

The present disclosure relates to a welding method and a structure. The laser output required for laser welding is reduced while suppressing the generation of welding defects. In the welding method, a first member and a second member are overlapped, laser is irradiated from the first member side to perform laser welding, and after a thin-walled portion having a thickness thinner than other regions is formed in a predetermined region of the first member, laser is irradiated from the first member side to the thin-walled portion.

The invention relates to a laser irradiation positioning system and a laser irradiation positioning method for welding secondary battery components. The laser irradiation positioning system for welding the secondary battery components is configured to calculate a position at which the welding strength between the secondary battery components can be significantly improved when laser is irradiated for welding, thereby being capable of significantly improving the welding strength between the secondary battery components.

This utility model relates to the technical field of laser leveling, and proposes a laser leveling device, including a support frame, an adjustable pan-tilt head, and a laser leveling device. The adjustable pan-tilt head includes an adjustment box, an adjustment knob, a lifting column, a mounting platform, and a universal ball. The lifting column is slidably disposed vertically within the adjustment box, and the universal ball is movably disposed above the lifting column. The adjustment knob is disposed on the outer side of the adjustment box, and its driving end is inserted into the adjustment box and connected to the lifting column for driving the lifting column to move up and down, thereby clamping the universal ball through the lifting column. The mounting platform is disposed above the adjustment box, and a connecting column is disposed on the bottom surface of the mounting platform. The connecting column is inserted into the adjustment box and fixedly connected to the universal ball. The adjustment box is disposed at the top of the support frame, and the laser leveling device is disposed on the mounting platform. This utility model can adjust the angle of the laser leveling device, and can illuminate the laser in pitch, tilt, and other ways, thereby adapting to different usage scenarios and leveling operations in different situations.

To provide an inspection device for inspecting the state of a conveyance case used in a semiconductor manufacturing line, and to provide an inspection method.SOLUTION: A holding unit 1 configured to hold the conveyance case 9, a laser light source 22 configured to emit a laser toward the conveyance case 9, and a support frame 21 to which the laser light source 22 is attached, the laser light source 22 and the support frame 21 being disposed apart from each other; And an image capture 23 for generating an analysis image by photographing a light pattern formed on the conveyance case 9 by the laser for structured irradiation emitted from the laser light source 22, and a processing means 3 having a determination module 31 for generating a corresponding detection signal by determining a state of the conveyance case 9 based on the analysis image received from the image capture 23 by signal connection with the image capture 23.SELECTED DRAWING: Figure 1

To improve a bond strength.SOLUTION: A method for performing lap welding of a first member comprising a first metal and a second member comprising a second metal different from the first metal by laser, includes (a) radiating laser from the first component side, (b) intermittently radiating while moving laser, (c) making a laser radiation direction inclined with respect to a lap direction of the first component and the second component, (d) when viewed in the lap direction from the first component side, making a laser radiation direction at a first irradiation point a first radiation direction, and a laser radiation direction at a second irradiation point separated from the first irradiation point a second radiation direction different from the first radiation direction.SELECTED DRAWING: Figure 1

The present invention aims to provide an optical system of a laser processing apparatus in which the energy utilization efficiency of laser light is high, and the intensity distribution shape of the laser light at an irradiation point does not change even if the focal point position deviates due to thermal lens effect, and a laser processing apparatus using the optical system of the laser processing apparatus. To achieve this aim, the laser processing apparatus for processing a work by irradiating laser light according to the present invention has an optical system having optical surfaces in which a plurality of different focal points are provided on the same optical axis, and an irradiation point of the laser light on the work is at a different position from the focal points, and the intensity distribution of the laser light on a plane perpendicular to the optical axis at the irradiation point is annular at least with the optical axis as the center.

A laser handpiece according to an embodiment of the present disclosure may comprise: a main body unit; a laser radiation unit disposed inside the main body unit and configured to radiate a laser toward the front of the main body unit; a lens unit formed in front of the laser radiation unit and configured to refract the laser; a contact unit detachably coupled to the main body unit in front of the main body unit and configured to contact the skin of a person to be treated to irradiate the skin with the laser; a connector configured to be detachably coupled to a cable provided with a power supply line for supplying power and a discharge line for discharging heat generated from the laser radiation unit; and an intake unit formed in the main body unit and configured to draw air toward the connector.

A diamond substrate manufacturing method capable of reducing the loss amount when a single crystal diamond is processed into a diamond substrate. The diamond substrate manufacturing method includes: a step of arranging a laser condensing section (190) that condenses laser light (B) so as to face an upper surface (10a) of a single crystal diamond boule (10); a step of irradiating the laser light (B) from the laser condensing section (190) toward the upper surface (10a) of the boule (10), and forming a modified layer (20) including a graphite processing mark (21) and a crack (22) extending along a (111) plane of the single crystal diamond from the processing mark (21) to a prescribed depth from the upper surface (10a) of the boule (10) in a part of the boule (10); and a step of causing the cracking to spontaneously propagate to form a cracking surface (25) to a prescribed depth from the modified layer (20) to a remaining region of the upper surface (10a) of the boule (10).

To solve the problem that energy stability of EUV light by an extreme ultraviolet (EUV) light generation system is poor.SOLUTION: A control method of an extreme ultraviolet light generation system including a target supply unit configured to supply a target, a laser device configured to irradiate the target with a laser beam, an EUV energy sensor configured to detect energy of extreme ultraviolet light generated by irradiating the target with the laser beam, a light adjuster configured to adjust the energy of the laser beam, and a processor configured to adjust the light adjuster by PID control based on an output of the EUV energy sensor, the control method comprising: A processor acquires a first indicator value for an output of the EUV energy sensor and a second indicator value different from the first indicator value, and determines a control gain in the PID control based on the first and second indicator values.SELECTED DRAWING: Figure 6

The present application provides a wafer processing method capable of suppressing a decrease in the bending strength of a device chip. The wafer processing method is a wafer processing method of a wafer having a functional layer on a front surface side, and includes: a laser processing step of removing the functional layer along a separation lane by irradiating a laser beam and forming a laser-processed groove along the separation lane; a cutting groove forming step of forming a cutting groove on the inner side of the laser-processed groove along the separation lane by cutting the wafer with a cutting tool; a grinding step of grinding the back surface side of the wafer to thin the wafer, exposing the cutting groove on the back surface side of the wafer, and dividing the wafer into a plurality of device chips; and a processing strain removing step of supplying a gas in a plasma state to the back surface side of the wafer and removing processing strains formed on the back surface side and the side portions of the plurality of device chips. In the processing strain removing step, a heat-affected layer formed on the periphery of the laser-processed groove is removed.