The invention discloses a
laser quenching process of a down-the-hole
drill spline, which is characterized by comprising the following steps: S1, selecting a down-the-hole
drill to be quenched, and carrying out
surface cleaning on the curved surface of the spline; s2, setting
energy density, and introducing a curved surface absorption coefficient correction factor eta (eta (theta) = k (1 + theta / 180)) according to the
arc length and angle of the spline curved surface, wherein k is an absorption coefficient, theta is a central angle, E is equal to eta (theta) * (P / V) * S, E is
energy density, P is
laser power, V is
laser rate, and S is
light spot area; s3, a laser is started,
continuous scanning quenching is conducted on the spline curved surface according to preset parameters, and the
light spot center is kept consistent with the normal direction of the curved surface in the scanning process; and S4, the cooled down-the-hole
drill bit is
cut, and the quenched down-the-hole
drill bit of the spline structure is obtained. A curved surface absorption coefficient correction factor is introduced,
energy density is dynamically calibrated in combination with a spline curved surface central angle, accurate
energy regulation and control are achieved, it is guaranteed that the hardened layer depth reaches the standard and is uniform, and the process stability is improved.