This invention discloses a quality inspection
system for exothermic solder
powder, belonging to the field of exothermic solder
powder inspection technology. It solves the problem of delayed
brittle fracture failure of exothermic welded joints during service due to the
coupling of
grain boundary segregation and corrosive environment caused by inadequate control of trace impurities such as
bismuth during production, coupled with the blind spots in the screening of trace components in the current quality inspection
system. The
system includes a
data acquisition module, a data cleaning module, a
standardization module, a statistical modeling module, a distance calculation module, a control limit generation module, an
anomaly detection and early warning module, a model storage and management module, and a
database module. This invention constructs a reference
statistical model by collecting known qualified solder
powder samples. After standardizing the detection indicators of a new batch of solder powder, it calculates the
Mahalanobis distance between the new batch and the center of the
reference model. By comparing this distance with the
control limits set based on the distribution of the reference samples, it determines whether the new batch has quality anomalies.