This application discloses an electronic device, including a substrate, a
heating element, a
heat sink, a fan module, and a sealing element. The
heating element is mounted on the substrate. At least a portion of the
heat sink and the substrate have a heat-generating space in a first direction for accommodating the
heating element. The
heat sink is used to dissipate heat from the heating element. The fan module and the heat sink are arranged in a second direction. The sealing element is used to seal the heat-generating space in the second direction. This reduces the risk of low-temperature air blown from the fan module to the heat sink being diverted into the heat-generating space, improving the
utilization rate of the low-temperature air blown from the fan module to the heat sink. At the same time, it reduces the risk of high-temperature air flowing back through the heat-generating space and the risk of the
air temperature rising when blown into the heat dissipation channel by the fan module. This improves the heat dissipation efficiency of the heat sink, the heating element, and the electronic device, enhancing the heat dissipation capability of the electronic device.