53results about How to "Avoid dust adhesion" patented technology

A totally enclosed type main drive motor for a vehicle includes a stator core arranged on an inner circumference of an outer casing frame, a bracket arranged on one end of the outer casing frame to have a bearing built-in, a housing arranged on the other end of the outer casing frame to have a bearing built-in, a rotor shaft having its both ends supported by the respective bearings, a rotor core arranged on the rotor shaft, a fan arranged on one end of the rotor shaft, openings formed in both axial ends of a peripheral wall of the outer casing frame, connective air ducts arranged outside the peripheral wall so as to communicate with the openings and a cooler for connecting these connective air ducts with each other and also releasing heat of air flowing in the connective air ducts to outside air. The outer casing frame is attached to the vehicle so that a central axis of the outer casing frame extends horizontally and intersects with a traveling direction of the vehicle at right angles. With rotation of the fan, air inside the outer casing frame flows in the cooler in circulation to cool down the air. The totally enclosed type main drive motor is provided with guide plates that collect traveling wind flowing around the outer casing frame to the cooler.

A light source apparatus includes a light source to emit excitation light; a phosphor as a rotatable wavelength convertor; a motor to drive the phosphor; an excitation light condensing optical system to condense the excitation light emitted from the light source onto the phosphor; and a casing having a closed space to encase the light source, the phosphor, and the excitation light condensing optical system, and at least a part of the motor while a remaining part of the motor being protruded to an external space of the casing.

A substrate processing apparatus includes: a polishing device 30A for polishing the surface of a substrate; and at least one of an ultrasonic cleaning device 42 for cleaning the surface of the substrate with ultrasonic waves transmitted through a liquid, and a two-fluid jet cleaning device 44 for cleaning the surface of the substrate with a two-fluid jet spouted as a mixture of a gas and a liquid. A substrate processing method includes: a polishing step of polishing the surface of a substrate; and a solid matter noncontact cleaning step of cleaning the surface of the substrate by spraying a liquid to the surface of the substrate. The above apparatus and method make it possible to efficiently clean the surface of a substrate after it is polished.

A drive-section-isolated FOUP opener opens and closes a door of a FOUP which contains a plurality of semiconductor wafers. The FOUP opener includes a dock plate for carrying and positioning the FOUP; a dock moving mechanism for moving the dock plate to a position for detachment/attachment of the FOUP door; a port door including a mechanism for releasably holding the FOUP door; a port plate including an opening closed by the port door; a port door horizontal-movement mechanism for horizontally moving the port door; a sensor horizontal-movement mechanism for horizontally moving a sensor bracket, the sensor bracket carrying a mapping sensor; and a port-door-and-sensor vertical-movement mechanism for vertically moving the port door and the sensor bracket with the port door holding the FOUP door. A drive for the port door horizontal-movement mechanism, a drive for the sensor horizontal-movement mechanism, and a drive for the port-door-and-sensor vertical-movement mechanism are disposed opposite a clean room with respect to the port plate.

An image forming apparatus including a sheet roll supporter disposed below a main body of the image forming apparatus to support a sheet roll such that a sheet is fed from the sheet roll, an image forming unit to form an image on the sheet fed from the sheet roll, a sheet discharger disposed downstream from the image forming unit in a direction of conveyance of the sheet to discharge the sheet having the image thereon in a sheet discharging direction, a guide unit to guide the sheet discharged from the sheet discharger to the front of the main body of the image forming apparatus, and a stacking unit on which the sheet passing the guide unit is stacked. Upper and front parts of the sheet roll are covered with the guide unit and the stacking unit across a width direction of the sheet perpendicular to the sheet discharging direction.

Provided are a packaging device and packaging method of a hollow cathode sputtering target which installs, in the hollow cathode sputtering target, a cover of a size capable of covering a void of the target; provides one or more through-holes to the cover; places a resin bag over them, and performs vacuum suction to the inside of the bag. This packaging device and packaging method of a hollow cathode sputtering target is capable of performing vacuum suction even to the inside of the hollow portion covered with the resin bag.

Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a circuit substrate, photo-curing the resin composition, and thermally curing the photo-cured resin composition to thereby form an insulation layer, affords an insulation layer with improved surface smoothness and excellent dielectric properties.

There are disclosed a method and a apparatus for applying a strippable paint to a large-sized product finished with a sprayed coating, such as an automobile, to form a protective film on the surface of the coating. The product is conventionally kept in stock for a period of time before it is shipped. Contaminations such as dust are washed away from the surface of the product. Then, the strippable paint is applied, preliminarily dried, and non-preliminarily dried to form the protective film out of the strippable paint on the surface of the coating. This protective film is formed easily, appropriately, and reliably. The obtained protective film has a uniform and sufficient thickness. Even if the surface contains unapplied regions to which the paint should not be applied, the paint can be applied to the whole surface of the coating while avoiding the unapplied regions according to the invention. The application can be performed easily and reliably without leaving unapplied portions around the unapplied regions.

The present invention relates to a hard coating film used as a film for a flexible display window including a touch sensor and a flexible display window including a touch sensor using the same, and particularly, to a hard coating film having a surface resistance of 5*10¹¹ Ω/sq to 5*10¹³ Ω/sq.

The present invention provides a fabrication method which promotes adhesion of sheet materials when bonding a plurality of optical sheets into a compound sheet and provides a manufacturing method of optical sheets suitable for liquid crystal display units and the like. A manufacturing method according to one aspect of the present invention includes a lamination step of laminating a plurality of optical sheets; and a bonding step of irradiating at least one or more spots on a laminate of the optical sheets prepared in the lamination step with a laser beam from one side of the laminate and thereby bonding the irradiated spots to obtain a compound optical sheet in which the plurality of optical sheets are integrated. Preferably, the method further includes a step of forming a photothermal conversion layer from a light absorber between the optical sheets to be fused. Incidentally, ultrasonic welding may be used instead of, or in combination with, laser welding.

A filter assembly comprises a filter body for filtering dust and a filter housing for supporting the filter body. The filter body is configured in the form of a corrugation having alternate ridges and grooves, wherein a gap in the groove is blocked or shaped so as to prevent adhesion of the dust therein. Accordingly, detachment of the dust becomes easy when cleaning the filter body, and therefore, the filter assembly can maintain its performance as good as new one after being cleaned. A vacuum cleaner utilizing the filter assembly also provides the benefits of easy removal of the dust.