8results about How to "Improve laser processing efficiency" patented technology

The invention discloses a laser processing method, device and equipment and a computer readable storage medium, and relates to the technical field of laser processing, the method is applied to a laser processing system, the laser processing system comprises a laser device and a galvanometer, and the method comprises the steps that the galvanometer is controlled to move at a preset speed at a constant speed; monitoring the real-time position of the galvanometer; and when the real-time position is matched and consistent with a preset galvanometer position corresponding to a preset initial chip on the wafer to be processed, a laser is controlled to intermittently emit laser beams so that the laser beams reflected by the galvanometer can sequentially shoot down the chips to be processed on the wafer to be processed. According to the invention, the laser processing efficiency of each chip on the wafer can be improved.

The invention relates to a multi-band laser confocal silicon carbide crystal ingot processing device and method, the multi-band laser confocal silicon carbide crystal ingot processing device comprises an objective table and a laser assembly, the laser assembly comprises a first laser, a second laser, a first reflecting mirror, a second reflecting mirror and a laser focusing mirror, the second wavelength laser and the second wavelength laser reflected by the second reflector and emitted by the second laser device are output in a common light path mode, and a to-be-machined crystal ingot on the objective table is machined through the laser focus lens; the objective table comprises an X-axis moving module, a Y-axis moving module, a C-axis module and a B-axis module, the C-axis module is used for driving the to-be-machined crystal ingot to rotate around the vertical center axis of the to-be-machined crystal ingot, and the B-axis module is used for driving the to-be-machined crystal ingot to swing in the vertical plane. The device can improve the laser processing efficiency, can cut the cylindrical crystal ingot, is simple in structure, easy to operate and control, low in cost and particularly suitable for cutting the silicon carbide crystal ingot with large thickness, high hardness and high precision.

The bidirectional laser silicon carbide crystal ingot machining device comprises a first laser assembly, a second laser assembly and a rotary table, in the first laser assembly, laser emitted by a first laser device sequentially passes through a first reflecting mirror and a first laser focusing mirror and then vertically and downwards reaches the rotary table and the second laser assembly; laser emitted by the second laser sequentially passes through a second reflecting mirror, a third reflecting mirror, a second laser focusing mirror and a fourth reflecting mirror and then vertically and upwards reaches the rotary table; the rotary table comprises a C-axis module, a B-axis module and a machining seat, the C-axis module is used for driving a to-be-machined crystal ingot to rotate, and the B-axis module is used for driving the crystal ingot to swing in a vertical plane; and a corresponding linear moving module is also configured. The device can effectively improve the laser processing efficiency, process the cylindrical crystal ingot, maximally utilize the raw materials and reduce the cost, and is simple in structure, easy to control and suitable for cutting the silicon carbide crystal ingot with large thickness, high hardness, high manufacturing cost and high precision.

The utility model discloses a material belt adsorption mechanism and a laser processing device. The material belt adsorption mechanism comprises a laser processing device, the material belt adsorption mechanism comprises a conveying assembly, an adsorption assembly and a dust removal assembly, the conveying assembly comprises a conveying belt used for conveying a material belt, the conveying belt is provided with a first surface and a second surface which are opposite, the material belt is located on the side where the first surface of the conveying belt is located, and a plurality of adsorption holes are formed in the conveying belt; the adsorption assembly is arranged on the side where the second surface of the conveying belt is located and adsorbs the material belt to the first surface of the conveying belt through the adsorption holes. The dedusting assembly is arranged on the side where the first surface of the conveying belt is located and used for dedusting the first surface. According to the material belt adsorption mechanism, when the material belt adsorption mechanism operates, the conveying belt can be cleaned, the trouble that the material belt needs to be regularly and manually disassembled for cleaning is avoided, and the product quality is improved.

The application discloses a cord fabric unwinding and wrinkle removing device and a production method of an unwinding roller, and belongs to the technical field of cord fabric manufacturing. The unwinding and wrinkle removing device comprises an unwinding roller, a main hot moistening positioning roller and an auxiliary hot moistening pressing roller. Cord fabric on a cord fabric winding disc sequentially passes through the unwinding roller, the main hot moistening positioning roller and the auxiliary hot moistening pressing roller. The unwinding roller is used to apply a force to the cord fabric, so that the cord fabric is stretched along the width direction of the cord fabric. The main hot moistening positioning roller is used to moisten and fix the unwound cord fabric. The auxiliary hot moistening pressing roller is used to assist in moistening the cord fabric. The unwinding and wrinkle removing device integrates unwinding, setting and moistening. When the cord fabric is unwound, the unwound state can be fixed, and the cord fabric surface can be smoothed and wrinkle-free in time through moistening, so that the cord fabric is prevented from being stained with glue due to wrinkles.

This invention discloses an adsorption-type laser drilling platform, comprising a first plate and a second plate. The front of the first plate has several arrayed first grooves, and the top surface of the structural beams around the first grooves is also provided with first adsorption holes. The periphery of the first grooves is also provided with second adsorption holes. The interior of the second plate has a stepped structure, including the first grooves and an extension, with the first plate located on the extension. The top surface of the second plate is provided with third adsorption holes for adsorbing materials. The sidewalls of the second plate are provided with multiple air supply holes. The upper half of the second plate is provided with an air channel, and the air supply holes are connected to the third adsorption holes through the air channel to form an external air path. The lower half of the second plate is also provided with a through-hole cavity air hole, which is connected to the first adsorption holes and the second adsorption holes through the cavity to form an internal air path.

The present application discloses a cadmium telluride power generation glass with a SiO2 film and a preparation method thereof, and belongs to the technical field of power generation glass. The preparation method comprises: coating a suspension composed of nano-SiO2 particles on the light-facing surface of the cadmium telluride power generation glass mother material to form a SiO2 coating; then drying the cadmium telluride power generation glass mother material using a hot plate; then using a CO2 laser to scan the entire surface of the SiO2 coating of the cadmium telluride power generation glass mother material, and controlling the temperature at the SiO2 coating to 400‑450°C during the scanning process, so that the SiO2 coating is cured to form a SiO2 film with a thickness of 90‑150nm. The present application uses a CO2 laser scanning method to cure a layer of SiO2 film on the glass surface, which can not only effectively prevent the circuit on the backlight side of the glass from being damaged during the silicon oxide curing process, but also effectively reduce the reflectivity of the power generation glass and improve its photoelectric conversion efficiency.

The invention provides a diamond cutter laser drilling machining device which comprises a machining platform, the upper end of the machining platform is provided with a clamping device used for clamping a diamond cutter, a laser generating device and a position control device used for controlling the laser generating device to move, and a rotation driving device is arranged between the position control device and the laser generating device. The rotation driving device comprises a rotation positioning frame, a driving rotating shaft and an eccentric disc fixed to the driving rotating shaft. The laser generating device is fixed to the side wall of the eccentric disc. The airflow cleaning device is close to the clamping device and comprises an air blowing device located on the outer side of the rotating path of the laser generating device. Open type machining can be achieved, the clamping and processing time before and after machining is greatly shortened while the environment in a machining workshop is improved, and the laser machining efficiency of the diamond cutter is greatly improved.