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Laser processing control method and device and laser processing equipment

A technology of laser processing and control method, applied in the fields of laser processing control and laser processing equipment, can solve problems such as low laser processing efficiency, and achieve the effect of improving laser processing efficiency

Active Publication Date: 2021-08-24
SHENZHEN MAKER WORKS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, there are many manual processes in laser processing, resulting in low efficiency of laser processing

Method used

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  • Laser processing control method and device and laser processing equipment
  • Laser processing control method and device and laser processing equipment
  • Laser processing control method and device and laser processing equipment

Examples

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Embodiment Construction

[0038] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concepts of example embodiments to those skilled in the art.

[0039] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of the embodiments of the application. However, those skilled in the art will appreciate that the technical solutions of the present application may be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be employed. In other instances, well-known methods,...

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Abstract

The embodiment of the invention provides a laser processing control method. The method comprises the steps that a to-be-processed pattern track is obtained; a machinable area on the surface of a raw material placed on a processing platform is determined according to a raw material image acquired for the raw material, wherein the raw material image is acquired by a camera; according to a first size parameter of the to-be-processed pattern track in a preset coordinate system and a second size parameter of the machinable area in the preset coordinate system, a processing track of a pattern indicated by the to-be-processed pattern track on the machinable area is determined; and according to machining modes indicated by the machining parameters corresponding to the raw material and a track line of the to-be-machined pattern track, machining is conducted in the machinable area according to the machining track, wherein the machining modes comprise cutting machining and carving machining. Automatic laser processing is realized, and the processing efficiency is improved.

Description

technical field [0001] The present application relates to the technical field of laser processing, in particular, to a laser processing control method, device and laser processing equipment. Background technique [0002] Laser processing technology refers to the technology of cutting, welding, surface treatment and other processing of materials by using the characteristics of the interaction between laser beam and matter, which is widely used in the field of material processing. [0003] At present, laser processing equipment performs laser processing on the object to be processed according to the vector diagram or bitmap imported into the equipment system by the user. According to the material information of the object to be processed, the user needs to pre-set the processing parameters such as the processing speed, power, and the focal length of the laser head of the laser processing equipment, and perform image processing on the pattern to be processed in advance, so as t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/38B23K26/362B23K26/044B23K26/02
CPCB23K26/00B23K26/38B23K26/362B23K26/044B23K26/02
Inventor 刘宇超
Owner SHENZHEN MAKER WORKS TECH CO LTD
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