Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Laser processing device and method

A laser processing and laser technology, which is applied in the direction of metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of difficulty in further improvement and low efficiency, and achieve the effect of improving the efficiency of laser processing

Active Publication Date: 2019-03-08
深圳市大族半导体装备科技有限公司
View PDF13 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above problems, the embodiment of the present application provides a laser processing device and method to solve the problem that the existing single-track laser processing device and method are relatively low in efficiency and difficult to further improve

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser processing device and method
  • Laser processing device and method
  • Laser processing device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application. The terms "first", "second" and the like in the specification and claims of the present application and the above drawings are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of laser processing, discloses a laser processing device, and further discloses a laser processing method. The laser processing device comprises a laser device, a laser dividing component, a laser adjusting assembly and a focus lens; the laser device is used for emitting a laser beam; the laser dividing component is used for dividing the laser beam emitted by the laser device into N sub laser beams which are at the diverging angle and are distributed at equal intervals in the direction perpendicular to the propagation direction of the laser beam, wherein N is equal to 2, 3, 4...; the laser adjusting assembly is used for converting the sub laser beams at the divergent angle into sub laser beams at the contracting angle to enable the sub laser beams at the contracting angle to enter the focus lens; and the focus lens is used for focusing the multiple incident sub laser beams and then emitting the focused sub laser beams to a to-be-processed workpiece at equal intervals to process the to-be-processed workpiece. According to the laser processing method and device provided by the invention, compared with existing monorail processing, multi-rail processing is achieved, the laser processing efficiency is improved greatly, taking wafer laser cutting as an example, a plurality of cutting ways can be cut at a time, and the processing efficiency is improved exponentially.

Description

technical field [0001] The embodiments of the present application belong to the technical field of laser processing, and in particular relate to a laser processing device and method. Background technique [0002] In the field of wafer precision processing, as laser processing technology becomes more and more mature and the requirements for efficiency are getting higher and higher, how to further effectively and greatly improve laser processing efficiency is a problem worthy of study. At present, wafer processing adopts single-track processing, that is, processing with a single laser beam, and the processing technology is already very mature. If you want to further improve efficiency, you can only rely on increasing the processing speed, and taking into account the process effect and the movement of the precision platform. Performance, and it is impossible to greatly change the processing speed, and it is almost impossible to further improve the efficiency. Contents of the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/067B23K26/064
CPCB23K26/0648B23K26/0673
Inventor 李忠乾辛焕寅李福海费康杰周黎明李海峰陈红黄浩张红江柳啸尹建刚高云峰
Owner 深圳市大族半导体装备科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com