A laser processing method and device

Abstract

The invention discloses a laser processing method. The method includes the following steps that a laser device is started through a computer control system, so that the laser device emits laser beams; the light beams pass a small-hole diaphragm, so that the functions of mode selection and radius control over the laser beams are achieved; the laser beams passing the small-hole diaphragm are collimated and expanded through a lens set; the collimated and expanded laser beams are converted into Bessel beams through an axicon optical element; and the Bessel beams are emitted to the surface of a processed material through a galvanometer system. The invention further discloses a laser processing device. The position of a focus does not need to be determined during processing, and the laser processing method has the characteristics of being large in depth-diameter ratio, high in precision and the like. The implementation method is simple, an optical path is easy to adjust, and the laser processing method and device have good application prospects in the laser processing field.

Description

technical field [0001] The invention relates to the technical field of laser precision machining, especially the laser cutting, scribing, drilling and other processing fields of glass, solar silicon wafers, LED wafers, PCBs and FPCB boards, and specifically relates to a laser processing method and device. Background technique [0002] Laser precision machining technology has the advantages of non-contact, wide range of processing materials, high precision, high repetition rate, small heat-affected area, and high flexibility in shape and size processing. It is widely used in micro-machines, micro-electronic devices, medical equipment, aviation precision manufacturing, etc. field. The space control and time control of the laser are very good, and the degree of freedom for the material, shape, size and processing environment of the processing object is very large, and it is especially suitable for automatic processing. The combination of laser processing system and computer nu...

AI Technical Summary

Problems solved by technology

Therefore, it is necessary to determine the focus position before precision machining. Poor control of the focus position will greatly affect the effect of laser processing. In addition, when processing non-planar materials, it is necessary to control the focus position in real time to ensure that the focus position is always on the surface of the material. surface, which puts forward higher requirements for control technology and increases processing costs

The energy distribution of the processing beam along the diameter direction is Gaussian, that is, the energy in the center of the beam is the highest, and the energy gradually decreases along the radius direction. The energy difference between the edge part and the center part is relatively large, and a certain sharp cone angle will be formed during processing. , which is unfavorable for laser precision machining

In traditional laser processing, the depth-to-diameter ratio (aperture depth / aperture width) has certain limitations. Due to the contradictory relationship between the focal depth of the traditional laser processing lens and the size of the focal spot, it is difficult to improve the resolution and processing depth at the same time.

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