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A laser processing device and method

A technology of laser processing and laser beams, which is applied in the direction of metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of difficulty in further improvement and low efficiency, and achieve the effect of improving the efficiency of laser processing

Active Publication Date: 2021-10-26
深圳市大族半导体装备科技有限公司
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Problems solved by technology

[0003] In order to solve the above problems, the embodiment of the present application provides a laser processing device and method to solve the problem that the existing single-track laser processing device and method are relatively low in efficiency and difficult to further improve

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  • A laser processing device and method
  • A laser processing device and method
  • A laser processing device and method

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Embodiment Construction

[0046] In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application. The terms "first", "second" and the like in the specification and claims of the present application and the above drawings are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to ...

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Abstract

This application belongs to the technical field of laser processing, and discloses a laser processing device, comprising: a laser for emitting a laser beam; a light splitting element for dividing the laser beam emitted by the laser into N (N=2, 3, 4 ...) sub-laser beams with a diverging angle and equally spaced distribution along a direction perpendicular to the propagation direction of the laser beam; a laser adjustment component for converting the sub-laser beams at a diverging angle into sub-lasers at a contracting angle beams, so that the sub-laser beams with contracted angles can enter the focusing mirror; the focusing mirror is used to focus the injected multiple sub-laser beams and shoot them to the workpiece to be processed at equal intervals, so as to process the workpiece to be processed. A laser processing method is also disclosed. Compared with the existing single-track processing, the method and device provided by the present application realize multi-track processing and greatly improve the efficiency of laser processing. Taking laser cutting wafers as an example, Multiple cutting lanes can be cut at one time, and the processing efficiency is doubled.

Description

technical field [0001] The embodiments of the present application belong to the technical field of laser processing, and in particular relate to a laser processing device and method. Background technique [0002] In the field of wafer precision processing, as laser processing technology becomes more and more mature and the requirements for efficiency are getting higher and higher, how to further effectively and greatly improve laser processing efficiency is a problem worthy of study. At present, wafer processing adopts single-track processing, that is, processing with a single laser beam, and the processing technology is already very mature. If you want to further improve efficiency, you can only rely on increasing the processing speed, and taking into account the process effect and the movement of the precision platform. Performance, and it is impossible to greatly change the processing speed, and it is almost impossible to further improve the efficiency. Contents of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/067B23K26/064
CPCB23K26/0648B23K26/0673
Inventor 李忠乾辛焕寅李福海费康杰周黎明李海峰陈红黄浩张红江柳啸尹建刚高云峰
Owner 深圳市大族半导体装备科技有限公司
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