Device and method for abnormally cutting toughened glass by ultra-short pulse laser

Abstract

The invention relates to a device and method for abnormally cutting a toughened glass by ultra-short pulse laser. An output end of an ultra-short pulse laser apparatus is provided with an optical gate, an output end of the optical gate is provided with a beam expander, an output end of the beam expander is provided with a 45-degree holophote, an output end of the 45-degree holophote is provided with a three-dimensional (3D) dynamical focusing system, an output end of the 3D dynamical focusing system is provided with a telecentric field lens which is arranged facing to a platform above which a blowing device is arranged. When the ultra-short pulse laser device is used to cut, a heating device is used for heating the glass; the ultra-short pulse laser is focused in the glass by the 3D dynamical focusing system to abnormally scan the glass along with the laser, and the whole processing procedure is in helical processing; a suction dust-collecting device at the bottom of the platform is used for collecting the scanned glass slag; and the blowing device on the platform is used for blowing the slag and dust particles processed on the surface of the glass. The abnormal graph processing to the toughened glass is a processing form with smooth cutting surface and high cutting efficiency.

Description

technical field [0001] The invention relates to a device and a method for cutting toughened glass with an ultrashort pulse laser profile. Background technique [0002] Due to the continuous growth of demand for electronic products for different purposes such as the IT industry (small cell) and TV (large cell), there are requirements for cutting glass substrates with special shapes, cutting requirements for cutting glass thickness below 0.6mm and maintaining a high level of glass strength after cutting. . [0003] The traditional glass special-shaped cutting method is to use diamond or hard metal wheel interpolation method, and cutting auxiliary liquid is added during the processing. This mechanical interpolation cutting method has low cutting efficiency, low yield rate, and artificially added cutting during cutting. The auxiliary agent causes the liquid auxiliary agent to adhere to the sample, which has a short-circuit effect on the ITO conductive glass circuit with a circu...

AI Technical Summary

Problems solved by technology

However, when these two lasers deep-process thicker glass, there will be a certain taper, and as the thickness of the glass increases and the complexity of the processed special-shaped graphics increases, the taper becomes more and more obvious, which affects the actual use of the product.

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