A cutter for substrate using microwaves laser beam and method thereof

An ultra-short pulse, cutting device technology, applied in glass cutting devices, laser welding equipment, optics, etc., can solve the problems of focus distance and irradiation direction, and achieve the effect of avoiding thermal damage, improving accuracy, and preventing damage

Inactive Publication Date: 2009-03-25
RAINBOW SUN
View PDF0 Cites 31 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] In addition, because of the cutting method using the laser beam, there may be other variables that are not important in the mechanical method, but when the laser beam is irradiated, the debri

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A cutter for substrate using microwaves laser beam and method thereof
  • A cutter for substrate using microwaves laser beam and method thereof
  • A cutter for substrate using microwaves laser beam and method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0060] figure 2 It is an overall block configuration diagram schematically showing a substrate cutting device using an ultrashort pulse laser beam according to a first embodiment of the present invention.

[0061] refer to figure 2 , the substrate cutting device utilizing the ultrashort pulse laser beam according to the first embodiment of the present invention roughly comprises: a laser generating module 100 generating an ultrashort pulse laser beam; and a fixed substrate S (refer to Figure 3 to Figure 5 ) and the focus adjusting module 200 etc. which freely adjust the focus of the ultrashort pulse laser beam generated by the laser generating module 100.

[0062] Here, the above-mentioned ultrashort pulse laser beam has, for example, a femtosecond FS (10 -15 seconds) ~ picosecond PS (10 -12 second) (preferably about 50 FS to 3 PS) pulse.

[0063] The above-mentioned substrate S can be used in various display devices (for example, LCD, PDP, OLED, FED, etc.), and prefera...

no. 2 Embodiment

[0088] The substrate cutting device utilizing the ultrashort pulse laser beam of the second embodiment of the present invention is the same as the aforementioned first embodiment of the present invention, and all apply the laser generation module 100, the focus adjustment module 200 and the auxiliary device in the same way, and the auxiliary device For example, there are the driving module 300 , the convergence module 400 , the monitoring module 500 , the auxiliary cutting module 600 , and the control module 700 , etc. For specific descriptions of these, refer to the first embodiment of the present invention.

[0089] In particular, the focus adjustment module 200 applicable to the second embodiment of the present invention has the following function, that is, when adjusting to make the ultrashort pulse laser beam generated by the laser generation module 100 focus on the substrate S along the desired cutting path Afterwards or at the same time, adjust so that the focus of the u...

no. 3 Embodiment

[0101] The substrate cutting device using the ultrashort pulse laser beam of the third embodiment of the present invention is the same as the aforementioned first embodiment of the present invention, and all apply the laser generating module 100, the focus adjustment module 200 and the auxiliary device in the same way, and the auxiliary device For example, there are the driving module 300 , the convergence module 400 , the monitoring module 500 , the auxiliary cutting module 600 , and the control module 700 , etc. For specific descriptions of these, refer to the first embodiment of the present invention.

[0102] On the other hand, the focus adjustment module 200 applicable to the third embodiment of the present invention is different from the above-mentioned first and second embodiments of the present invention in that it has the following functions, that is, to fix the substrate S and adjust it so that The ultrashort pulse laser beam generated by the module 100 is focused on ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a substrate cutting device by using ultrashort pulse laser bean and a cutting method thereof. Ultrashort pulse laser from FS to PS is used, complex per/post procedures are simplified as far as possible unrelated to substrate characteristic of glass or transparent material, wherein the substrate characteristic of glass or transparent material is a little different according to use and property of displays, thereby preventing unwanted cutting, gaps or damage, and minimizing defect rate. The substrate cutting device by using ultrashort pulse laser bean comprises a laser generating unit which generates ultrasonic pulse laser bean; a focus adjusting unit for adjustment to focus the ultrashort pulse laser bean on the internal of the substrate to be cut, which guides internal filament forming phenomenon to form a cutting groove in the substrate by focusing the ultrashort pulse laser bean on the internal of the substrate and radiating along the desired cutting path. Substrates of diversified displays can be quickly cut with high precision by simple procedure without generation of damage and gaps.

Description

technical field [0001] The present invention relates to a substrate cutting device using an ultrashort pulse laser beam and a cutting method thereof. Focus position of a pulsed laser beam, a substrate cutting device using an ultrashort pulsed laser beam and a cutting method thereof capable of cutting substrates used in various displays quickly and with high precision without cracks or damage in a simple process. Background technique [0002] Recently, with the speed up, integration, and weight reduction of information communication technology, the development of information processing devices with very fast information processing capabilities has been accelerated, and thus, it is possible to display high-speed processed information that can be recognized by the operator. The technological development of an information display device (hereinafter referred to as a "display device") with an interface function occupies an important proportion in the industry. [0003] The usual...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C03B33/08B23K26/38C03B33/09
CPCB23K26/04G02F1/1303H01L21/3043
Inventor 李晚燮法里德·艾哈迈德闵喆基
Owner RAINBOW SUN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap