12results about "Etching metal masks" patented technology

The invention relates to an electronics assembly (EA) comprising: - a circuit carrier (ST), - a semiconductor component (HB) which is embedded in the circuit carrier (ST) and has an electrical contact surface (KF1), - wherein the contact surface (KF1) of the semiconductor component (HB) is contacted physically and electrically by means of a microvia (MV), the microvia (MV) being sintered onto the contact surface (KF1) of the semiconductor component (HB) in a sintering process from a metallic, in particular copper-containing, sinter paste (SP). The invention also relates to an inverter comprising said electronics assembly (EA) and to a method for manufacturing said electronics assembly (EA)

Disclosed is an electronic assembly (EA) comprising: - a circuit carrier (ST), - a semiconductor device (HB) embedded in the circuit carrier (ST) and having an electrical contact surface (KF1), - wherein the contact surface (KF1) of the semiconductor device (HB) is physically and electrically contacted by means of a microvia (MV), wherein the microvia (MV) is sintered onto the contact surface (KF1) of the semiconductor device (HB) in a sintering process using a metallic, in particular copper-containing, sintering paste (SP). Furthermore, an inverter with a specified electronic assembly (EA) and a method for manufacturing the specified electronic assembly (EA) are described.

This application relates to a printed circuit board manufacturing method and a printed circuit board. The method includes: forming a through hole in a multilayer printed circuit board that runs through the multilayer circuit board, where the multilayer printed circuit board is provided with an upper printed circuit board, a wiring layer, and a lower printed circuit board that are stacked; forming a blind hole from the upper printed circuit board to the wiring layer in the multilayer circuit board; drilling between the through hole and the blind hole to form a connection groove, where the through hole is in communication with the blind hole through the connection groove; and allowing an electrolyte solution to flow through the through hole, the connection groove, and the blind hole to form a conductive layer, achieving an electrical connection between the upper printed circuit board and the lower printed circuit board.

An electronic device includes a substrate, a first conductive layer pattern, a second conductive layer pattern, a first opening, a dielectric layer, a third conductive layer pattern and a chip. The first conductive layer pattern is disposed on a surface of the substrate. The second conductive layer pattern is disposed on another surface of the substrate. The another surface is opposite to the surface. The first opening penetrates the surface and the another surface. The dielectric layer is disposed on the surface and covers the first conductive layer pattern. The third conductive layer pattern is disposed on the dielectric layer and electrically coupled to the first conductive layer pattern through a second opening penetrated the dielectric layer. The chip is disposed on the substrate and electrically coupled to the third conductive layer pattern through a first solder ball. The second opening tapers toward and misalign with the first opening.

A method of manufacturing a component carrier includes forming a poorly adhesive structure on at least one layer structure, thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure, thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure, and forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure.

To solve the problem in which, when partially forming a modified layer inside a glass substrate by laser irradiation, it is extremely difficult to control a modification depth so that, if a through-hole is formed by etching a modified portion, variation may occur in a depth direction or radial direction.SOLUTION: A multilayer wiring board manufacturing method for forming a through-hole in a glass substrate having a first surface and a second surface includes: a first step of bonding a support to the second surface of the glass substrate; a second step of forming a modified portion by irradiating both the glass substrate and the support with laser; a third step of peeling off and removing the support; and a fourth step of forming a through-hole by etching processing in the glass substrate.SELECTED DRAWING: Figure 3

A method of manufacturing a printed circuit board having a metallic conductor structure is described. The method comprises: providing a base substrate (101) in the form of a film or sheet, the base substrate having a first substrate side (101a) and a second substrate side, the base substrate being at least partially composed of a non-conductive organic polymer material, the first substrate side (101a) being covered with a covering metal layer (102); and removing the cover metal layer (102) in some regions of the first substrate side (101a). In order to remove the cover metal layer (102), a mask layer (103) is applied to the cover metal layer (102). The mask layer (103) is removed in some regions such that the first substrate side (101a) is divided into at least one first sub-region (104), in which the first substrate side (101a) is covered only by the cover metal layer (102), and at least one second sub-region (105), in which the first substrate side (101a) is covered by the cover metal layer (102) and the mask layer (103). The covering metal layer (102) is then removed in the at least one first sub-region (104). According to the invention, the mask layer (103) is removed by an etching process using an etching solution, and a phase change or a chemical conversion is carried out in the mask layer (103) in the first sub-region (104) prior to the etching process.

Method for manufacturing a printed circuit board with a metallic conductor structure (109, 119) comprising the steps a. Provision of a base substrate (101) formed as a film or plate with a first substrate side (101a) and a second substrate side, which consists at least partially of an electrically non-conductive organic polymer material and in which the first substrate side (101a) is covered with a cover metal layer (102), and b. partial removal of the top metal layer (102), where the top metal layer is removed in sections (102) c. a mask layer (103) is applied to the top metal layer (102), d. the mask layer (103) is removed in sections, so that the first substrate side (101a) is divided into at least one first sub-area (104) in which the first substrate side (101a) is covered only with the cover metal layer (102), and into at least one second sub-area (105) in which the first substrate side (101a) is covered with the cover metal layer (102) and by the mask layer (103), and e. the cover metal layer (102) in which at least one first sub-area (104) is removed, characterized by the fact that f. the mask layer (103) in the first sub-area (104) is removed by an etching treatment using an etching solution and prior to the etching treatment to remove the mask layer (103) in the first sub-area (104) a phase transformation or a chemical transformation is effected in the mask layer (103), wherein the mask layer (103) consists of an inorganic semiconductor or a compound of an inorganic semiconductor or of a polymer material which can assume at least a partially crystalline state and an amorphous state.

To provide a pattern-forming body that allows for easy manufacturing and processing of wiring structures. [Solution] The pattern forming body 200 comprises a main body portion 201 made of a light-transmitting material, a pillar structure portion 202, and a light-shielding pattern 203. The light-shielding pattern 203 is provided on the first surface 201A of the main body portion 201. The pillar structure portion 202 protrudes from a second surface 201B facing the first surface 201A and is composed of a plurality of pillars 202A made of a light-transmitting material. The shape and arrangement of the light-shielding pattern 203 when viewed from a direction perpendicular to the first surface 201A corresponds to the shape and arrangement of the wiring 407 in the wiring structure 400. The shape and arrangement of the pillars 202A when viewed from the same direction corresponds to the shape and arrangement of the vias 406 in the wiring structure 400.

This invention relates to the field of communication technology, and particularly to a method for fabricating blind vias on a high-speed printed circuit board and the printed circuit board itself. The method includes the following steps: providing an upper printed circuit board, a wiring layer, and a lower printed circuit board; laminating the upper printed circuit board, wiring layer, and lower printed circuit board together to form a multilayer printed circuit board; forming return vias penetrating the multilayer printed circuit board; forming signal vias connecting to the wiring layer on the multilayer printed circuit board; forming connection grooves on the multilayer printed circuit board to connect the signal vias and return vias; thermally melting the circuit board between the signal vias and the wiring layer to maximize the contact area between the signal vias and the wiring layer; electrically connecting the signal vias and return vias; severing the electrical connection between the signal vias and return vias; and filling the connection groove between the signal vias and return vias with a filling medium. This application can handle multilayer printed circuit boards of different thicknesses, increasing its practicality.

A hybrid mold that is used for forming a wiring structure including wiring and vias connecting pieces of the wiring in different layers to each other, the hybrid mold includes a body made of an optically transparent material, a masking pattern made of an opaque material and disposed on a first surface of the body and a pillar structure including a plurality of pillars made of the optically transparent material and protruding from a second surface of the body, the second surface being opposite to the first surface. The masking pattern has shape and placement corresponding to shape and placement of the wiring when viewed from a direction orthogonal to the first surface, and the plurality of pillars each has shape and placement corresponding to shape and placement of the vias when viewed from the direction orthogonal to the first surface.

The invention describes a method for producing a printed circuit board having a metallic conductor structure. The method comprises providing a base substrate (101) which is formed as a film or plate, has a first substrate side (101a) and a second substrate side and at least partially consists of an electrically non-conductive organic polymer material and in which the first substrate side (101a) is covered with a covering metal layer (102), and removing the covering metal layer (102) in regions. In order remove the covering metal layer (102) in regions, a mask layer (103) is applied to the covering metal layer (102). This mask layer is then removed in regions. In the process, the first substrate side (101a) is divided into at least one first subregion (104), in which the first substrate side (101a) is covered only with the covering metal layer (102), and into at least one second subregion (105), in which the first substrate side (101a) is covered with the covering metal layer (102) and by the mask layer (103). The covering metal layer (102) in the at least one first subregion (104) is then removed. The invention proposes removing the mask layer (103) in the first subregion (104) by an etching treatment using an etching solution and implementing a phase transition or a chemical transformation in the mask layer (103) before the etching treatment.