Method for manufacturing a
printed circuit board with a metallic conductor structure (109, 119) comprising the steps a. Provision of a base substrate (101) formed as a film or plate with a first substrate side (101a) and a second substrate side, which consists at least partially of an electrically non-conductive
organic polymer material and in which the first substrate side (101a) is covered with a cover
metal layer (102), and b. partial removal of the top
metal layer (102), where the top
metal layer is removed in sections (102) c. a
mask layer (103) is applied to the top metal layer (102), d. the
mask layer (103) is removed in sections, so that the first substrate side (101a) is divided into at least one first sub-area (104) in which the first substrate side (101a) is covered only with the cover metal layer (102), and into at least one second sub-area (105) in which the first substrate side (101a) is covered with the cover metal layer (102) and by the
mask layer (103), and e. the cover metal layer (102) in which at least one first sub-area (104) is removed, characterized by the fact that f. the
mask layer (103) in the first sub-area (104) is removed by an
etching treatment using an
etching solution and prior to the
etching treatment to remove the
mask layer (103) in the first sub-area (104) a phase transformation or a
chemical transformation is effected in the
mask layer (103), wherein the mask layer (103) consists of an inorganic
semiconductor or a compound of an inorganic
semiconductor or of a
polymer material which can assume at least a partially crystalline state and an amorphous state.