The invention discloses
a diamond grinding wheel surface
topography geometric modeling method based on a
discrete element method, which comprises the following steps: measuring the geometric dimension of
a diamond grinding wheel, and defining the geometric model dimension of the
grinding wheel; a discrete element particle
grinding wheel model is generated in EDEM
software, and particles are bonded through Bonding bonding keys to establish a
grinding wheel initial model; according to
grinding wheel surface
topography measurement and grinding wheel
granularity calculation, the average distance between
abrasive particles is obtained; defining a single
abrasive particle model, dividing grids for the geometric model of the grinding wheel, and establishing cube virtual grids; initial positioning
abrasive particle central surfaces are located at all vertexes of the outer surfaces of the virtual grids, and abrasive particle poses move in the virtual grids; polygonal abrasive particles are generated in EDEM
software, a cuboid binding agent base body is established, the plane of the cuboid binding agent base body is defined to be in the center coordinate plane of an abrasive particle
external connection ball, the abrasive particles and the binding agent base body are bonded through a Bonding key, and a grinding wheel three-dimensional geometrical morphology model is formed; and determining a three-dimensional geometrical morphology model of the grinding wheel according to the actual grinding particle
exposure height and the moving grinding particle meeting conditions. According to the method, multi-shape single abrasive particles are adopted, abrasive particle sizes, abrasive particle intervals and abrasive particle distribution are considered, the grinding wheel surface appearance model is established through EDEM discrete element
software, the
area density deviation between the model and actual cup type grinding wheel abrasive particles is within 2%, the grinding wheel and the surface abrasive particles are bonded through Bonding keys, and the grinding performance and result of the grinding wheel can be evaluated and predicted more accurately.