137 results about "Diamond grit" patented technology

The invention discloses an intelligent control method and system for the thickness of a nickel plating layer of a diamond fretsaw, and relates to the technical field of intelligent control. The method comprises the steps that a combined nickel plating constraint space and a reinforced nickel plating constraint space of a combined nickel plating tank and a reinforced nickel plating tank are established; optimizing and generating combined nickel plating parameters of the combined nickel plating tank; executing a combined nickel plating process, detecting the thickness distribution of a combined nickel plating layer, completing a carborundum electroplating process, and detecting the carborundum distribution density; and dynamic reinforcing nickel plating parameters are generated and adjusted, a reinforcing nickel plating tank is configured according to the dynamic reinforcing nickel plating parameters, and a second nickel plating procedure is executed to achieve intelligent thickness control. The technical problems that the plating thickness control precision is insufficient, the product quality stability is poor and the production efficiency is low due to the fact that an existing diamond fretsaw nickel plating layer thickness control method cannot accurately adapt to bus base material characteristic fluctuation, plating solution state change and personalized requirements in the production process are solved.

The invention particularly discloses a wafer heavy scratch three-dimensional shape repairing process based on a DFG 8560 single-axis accurate grinding mode, and aims to solve the problems that deep subsurface damage is introduced by rough grinding in a traditional double-stage grinding process, the machining efficiency is low, and material waste is serious. The process comprises the following steps: identifying a heavy scratch defect existing on the surface of a wafer through an automatic optical detection system; a ceramic bond diamond grinding wheel with the particle size of 8000 is adopted, uniaxial accurate grinding is conducted through ultrapure water cooling under the optimized parameters that the rotating speed of a main shaft is 1300-2300 rpm, the rotating speed of a workbench is 1785-2100 rpm and the rotating speed ratio is 0.6-1.3, and three-dimensional shape repairing is directly completed by skipping rough grinding; the rotating speed and pressure of grinding are dynamically regulated and controlled in three stages, the total time is less than or equal to 135 seconds, and the removal amount is 6-12 microns. By the adoption of the technical scheme, the surface roughness Ra can be smaller than 0.5 nm, the subsurface damage layer can be smaller than 50 nm, the repair success rate is larger than 98.5%, the machining time is remarkably shortened by 35% or above, and the material removal amount is reduced by 40%.

The invention discloses an automatic compensable grinding and polishing machining method for a hemispherical harmonic oscillator. The method comprises the steps that a diamond grinding wheel with the first granularity is used for conducting generating method machining on a workpiece according to the first feeding speed; replacing a diamond grinding wheel with a second granularity, performing tool setting to obtain an actual position of machining feeding, and performing generating method machining on the workpiece again according to a second feeding speed from the actual position; the polishing wheel is replaced, tool setting is carried out to obtain the actual position of machining feeding, generating method force control polishing is carried out on the workpiece from the actual position, workpiece in-place measurement is carried out after polishing, compensation polishing is carried out according to the in-place measurement result till the requirement is met, and the hemispherical harmonic oscillator is obtained. The problem of automatic tool changing in the generating method hemispherical harmonic oscillator machining process can be solved, the tolerance requirement for tool manufacturing is lowered, the process time is saved, the machining procedure is completed on the premise of one-time clamping, and the requirement for coaxiality among an inner ball, an outer ball and a supporting rod of a workpiece is met.

The utility model discloses an ultra-precise grinding diamond grinding wheel which comprises a diamond lapping body, a connecting disc is installed on one side of the diamond lapping body, the ultra-precise grinding diamond grinding wheel further comprises a heat dissipation mechanism, the heat dissipation mechanism comprises a heat dissipation disc arranged on the other side of the diamond lapping body, an injection opening is formed in one side of the heat dissipation disc, and a heat dissipation mechanism is installed on the other side of the heat dissipation disc. A liquid outlet nozzle is fixedly connected to the outer side of the heat dissipation disc, an oil coating assembly is installed on the outer ring of the heat dissipation disc, and a containing cavity is formed in the heat dissipation disc; and the auxiliary mechanism is arranged on one side of the connecting disc. The problems that when an existing diamond grinding wheel is used by workers, due to the fact that the diamond grinding wheel rubs with other grinding wheels for a long time, a large amount of heat is generated, the temperature of the diamond grinding wheel is gradually increased, the hardness of the diamond grinding wheel is reduced, abrasion of the diamond grinding wheel is likely to be aggravated, and the service life of the diamond grinding wheel is prolonged are solved. And the service life of the diamond grinding wheel is influenced.

The application discloses a laser modification polishing integrated method for improving thinning efficiency of silicon carbide wafers. First, the wafer is placed on an ultrasonic vibration platform; then laser slow scanning parameters are set to make the semiconductor wafer efficiently modified under the action of ultrasonic vibration; then an air flow device is started, laser polishing parameters are set, and the laser is polished on the surface of the modified wafer under the action of ultrasonic vibration and high-speed air flow; finally, the wafer after laser polishing is ground and thinned by a wafer thinning machine matched with a fine-grit diamond grinding wheel, so that the final finished product sample is obtained. The method has the advantages of simplicity, high efficiency, strong repeatability and the like, and in combination with an external field assisted laser modification polishing process, the thinning efficiency can be effectively improved and the wafer thinning cost can be reduced.

This utility model relates to the field of abrasive technology, specifically disclosing a diamond grinding wheel with good heat dissipation, including a base connected to a grinding machine; multiple grinding wheel blocks are fixedly connected to the lower end face of the base; the side of the base is provided with a protruding edge; a free ring is rotatably connected to the upper end of the base; a limit ring is detachably fixed to the free ring corresponding to the protruding edge; an inclined air duct is inclinedly connected to the upper surface of the free ring; an external air pump and air pipe are connected through the inclined air duct, so that air with a pressure greater than one atmosphere is supplied through the inclined air duct as a driving power source, while restricting the rotation of the inclined air duct and the free ring to keep them stationary. Then, the base and grinding wheel blocks are driven to rotate by the grinding machine spindle for grinding. Then, as the base rotates, the multiple inclined air holes are sequentially connected to the inclined air duct to transport high-speed flowing air. The heat generated by the grinding of the workpiece and grinding wheel blocks in the base keeps the workpiece and grinding wheel blocks at room temperature and prevents them from expanding and deforming, thus affecting the grinding accuracy.

The utility model belongs to the technical field of diamond grinding wheels, and particularly relates to a diamond grinding wheel for grinding a lead screw. The grinding wheel comprises a base body and a grinding layer. Wherein the grinding layer comprises grinding teeth, a first grinding groove and a second grinding groove; the first grinding groove and the second grinding groove are symmetrically formed in the two sides of the grinding teeth and are in smooth connection with the grinding teeth. According to the diamond grinding wheel for grinding the lead screw, the thread groove grinding part and the thread body grinding part are arranged on the grinding wheel at the same time, continuous thread grooves and thread body segments on the lead screw can be ground, and the grinding wheel is matched with translation of the grinding wheel and rotation of the lead screw and the grinding wheel; and grinding machining of all parts on the spiral groove of the lead screw can be completed at the same time.

The utility model provides an emery feeding liquid spraying device of an emery groove, which comprises a cleaning box, a fixing frame and a bottom plate, the rear end of the fixing frame is fixedly connected with an electric push rod, the telescopic end of the electric push rod is fixedly connected with a sliding seat, the rear end of the fixing frame is fixedly connected with four fixing blocks, and a sliding rod is fixedly connected between every two groups of fixing blocks. By means of the design, the problems that when an original device conducts grinding treatment on a carborundum groove, omission occurs when grinding equipment grinds the carborundum groove due to the fact that the structure of the carborundum groove is complex, operation needs to be conducted many times, the working time is prolonged during machining, and the machining efficiency of the carborundum groove is affected are solved, and the carborundum groove grinding device is reasonable in structure, convenient to operate and high in practicability. The device is simple in structure and good in practicability, impurities on the surface of the carborundum groove can be effectively removed by uniformly spraying the gravel on the surface of the carborundum groove, so that the surface cleaning efficiency of the carborundum groove is improved, and the machining speed is reduced.

The utility model discloses an automatic deburring device for a bearing bush blank, and particularly relates to the technical field of deburring, the automatic deburring device comprises a deburring frame, a sliding plate and a supporting block, the sliding plate is located above the deburring frame, the supporting block is fixedly located on the outer wall of the sliding plate, and a displacement deburring assembly is arranged on the upper surface of the supporting block; the displacement deburring assembly comprises a displacement motor, a displacement block, a frame table, a rotating motor, a rotating shaft, a transmission shaft and a plurality of diamond abrasive belts. The displacement motor is fixed to the upper surface of the supporting block, and the displacement block is fixed to the output end of the displacement motor. The displacement deburring assembly is adopted, the displacement motor drives the displacement block to rotate forwards and backwards in a reciprocating mode, the rotating motor enables the rotating shaft to rotate forwards and backwards in a reciprocating mode, a plurality of diamond abrasive belts can transversely move to conduct deburring on a plurality of bearing bush blanks from different angles and directions, the deburring directions are more, and the deburring effect is better.

The utility model discloses a diamond grinding wheel grinding clamp, which relates to the technical field of grinding clamps and comprises a base, a limiting plate is mounted at the upper end of the base, a connecting box is mounted at the upper end of the limiting plate, a top plate is mounted at the upper end of the connecting box, and sliding plates are mounted at four corners of the lower end of the top plate. Sliding boxes are installed at the four corners of the upper end of the base correspondingly, a connecting block is installed in the center of one side of the top plate, a spiral barrel is arranged on one side of the upper end of the base, a spiral rod is installed in the spiral barrel, a gear is installed on one side of the spiral barrel, and a stepping motor is arranged at the lower end of the gear. The diamond grinding wheel grinding clamp has the advantages that the diamond grinding wheel grinding clamp can quickly clamp and fix a workpiece, and the height of the workpiece can be adjusted, so that the diamond grinding wheel grinding clamp can collect scraps and waste liquid generated during grinding, can quickly discharge the scraps and the waste liquid, and is convenient to clean.

The invention belongs to the field of diamond grinding wheel machining, and particularly discloses a diamond grinding wheel for V-shaped groove machining and a machining system and method.The diamond grinding wheel comprises a grinding wheel base body, a grinding wheel cover, single crystal diamond abrasive particles and a reflecting mirror; a radial cylindrical low-light-path channel is machined in the grinding wheel base body, and the channel extends from the center of the grinding wheel to the area close to abrasive particles in the circumferential direction in the radial direction. The single crystal diamond abrasive particles are directionally adhered along the side surface of one circle of the grinding wheel according to the uniform direction and the equal circumferential distance, and one single crystal diamond abrasive particle is adhered to the tail end of each channel; the adjacent sharp ridges of the single crystal diamond abrasive particles jointly form a V-shaped forming blade with a uniform included angle; the reflecting mirror is installed in the center of the grinding wheel cover or close to the center of the grinding wheel cover.

The present application relates to abrasive tool technology field, especially to a kind of prefabricated double-layer hollow particle porous metal-ceramic composite binder diamond grinding wheel and its preparation.The double-layer hollow particle provided by the present application is sequentially center cavity, ceramic binder layer and brazing alloy layer from inside to outside.The present application is used in the preparation of porous metal-ceramic composite binder diamond grinding wheel working layer section by prefabricating double-layer hollow particle, and the adjustment of porosity and the arrangement of pore structure of porous diamond grinding wheel can be realized, while improving porosity, increasing chip space, maintaining the strength of the grinding wheel, meeting the high quality processing requirements of different hard and brittle materials.

The present invention relates to the technical field of tile adhesives and discloses a crack-resistant, super-strong, and highly flexible diamond grit carbon fiber tile adhesive and a preparation method thereof. The tile adhesive comprises 35-40 parts by weight of cement, 60-65 parts by weight of sand, 0.1-0.8 parts by weight of nano-silicon dioxide-modified carbon fibers, and 1.5-4 parts by weight of diamond grit. The carbon fibers of the present invention are surface-grafted with nano-silicon dioxide and have excellent compatibility with cement and sand, allowing for uniform dispersion in the tile adhesive matrix. This significantly improves the mechanical properties of the tile adhesive, exhibiting high tensile adhesive strength, compressive strength, and flexural strength, thereby improving the crack resistance and flexibility of the tile adhesive.

A grinding wheel dressing tool with hollow spheres preferably includes a tool shank and a dressing portion. The tool shank preferably includes a shank portion and a tool body. The shank portion extends from one end of the tool body and a dressing portion cavity is formed in an opposing end. The dressing portion preferably includes a quantity of diamond grit, metal bond powder, binder and a plurality of hollow spheres. The dressing portion cavity is preferably filled to a top with metal bond powder. The diamond grit, the metal bond powder and the binder are mixed together to form a grit mixture. A tubular mold is slipped over a top of the tool body. The dressing portion is created by forming alternative layers of grit mixture and hollow spheres in the tubular mold. The tubular mold is heated and the grit mixture pressed with a plunger.

The invention relates to the field of machine manufacturing, and particularly discloses a metal-based ceramic bond diamond grinding wheel and a preparation method thereof.The metal-based ceramic bond diamond grinding wheel comprises the following raw materials of a diamond grinding material, a reinforcing phase and a composite bond; wherein carbon fibers are selected as the reinforcing phase, the composite binding agent comprises a metal binding agent and the balance of ceramic binding agent, and the ceramic binding agent comprises the following raw materials of calcium fluoride, aluminum fluoride, lithium borate, boric acid and the balance of silicon dioxide; the preparation method comprises the following steps: S1, premixing the diamond grinding material and the reinforcing phase, then adding the composite binding agent, spraying a polyvinyl alcohol solution after mixing, and mixing and granulating to obtain granules; s2, the granules are loaded into a mold to be subjected to hot press molding to obtain a grinding wheel blank; and S3, sintering the grinding wheel blank at high temperature to obtain the metal-based ceramic bond diamond grinding wheel. The emery grinding wheel has the advantages that the abrasion resistance and the impact resistance of the grinding wheel are improved, and then the service life of the emery grinding wheel is prolonged.

The invention discloses an automatic diamond grinding wheel trimming and balancing device of an optical glass edge grinding machine, and relates to the technical field of optical glass edge grinding equipment.The automatic diamond grinding wheel trimming and balancing device comprises an equipment base, a driving mechanism and a balance monitoring module, a supporting base, an intelligent control box, a sliding rail and a support are arranged on the equipment base, and the driving mechanism is installed on the inner side of the support and connected with a grinding wheel disc body; the balance monitoring module is installed in the center of the sliding rail, the intelligent control box and the support are provided with trimming discs with handle adjustment, and the driving mechanism clamps a grinding wheel through a motor, a fluted disc and other transmission structures; the variable speed motor drives the grinding wheel to rotate, the dressing discs on the two sides conduct synchronous grinding, the balance monitoring module captures unbalanced pressure fluctuation of the grinding wheel in real time and feeds back and early warning, synchronous linkage of dressing and monitoring is achieved, machining errors are avoided, and the optical glass edge grinding precision and the finished product percent of pass are improved.

The application discloses a preparation method of a high-entropy alloy laser brazing single-layer diamond grinding wheel, and comprises the following steps: a grinding wheel steel base material is mechanically processed to obtain a grinding wheel steel base; Cr, Cu, Ni-Cr-B-Si and Ti powders are ball milled to prepare high-entropy alloy powder as a brazing filler metal; a tool forming blank is prepared in the order of the grinding wheel steel base as the bottom layer, the brazing filler metal as the middle layer and diamond abrasive particles as the upper layer; the brazing filler metal is heated to melt by laser in an inert gas environment; after cooling, the diamond abrasive particles are brazed and fixed on the surface of the grinding wheel steel base to obtain the single-layer diamond grinding wheel. After laser brazing, interface reaction between the surface of the diamond abrasive particles and the molten high-entropy alloy occurs, a metal carbide layer which is firmly combined with the surface of the diamond is formed, firm chemical and metallurgical bonding between the diamond and the brazing filler metal is generated, and thus the single-layer diamond grinding wheel is prepared, and the single-layer diamond grinding wheel has the advantages of good wettability of the brazing filler metal to the diamond, high production efficiency and small thermal damage of the diamond.

The application belongs to the technical field of laser welding equipment, and particularly discloses a laser welding device for diamond grinding wheel processing, which comprises a welding table, a mounting plate fixedly connected to the top of the welding table, and a laser welding gun mounted on the mounting plate; a rotating disc horizontally mounted on the top of the welding table; a fixing device comprising a chuck, a pressing rod, a clamping block and a driving assembly, the chuck being horizontally mounted on the top of the rotating disc and coaxial with the rotating disc, the top of the chuck being provided with a grinding wheel to be welded, the top surface of the chuck being uniformly and annularly provided with three mounting grooves, and the pressing rod and the clamping block being slidingly mounted in the mounting grooves. Through the linkage of the driving shaft, the screw rod, the shaft sleeve and other structures, the synchronous action of the inner and outer clamping is realized by single-power driving, the structure is compact and stable, the clamping efficiency is high, the device is suitable for the quick clamping of diamond grinding wheels of multiple specifications, and the complexity and the debugging difficulty of the device are reduced.

The utility model relates to the technical field of medical instruments, and discloses a root canal linear passage bur, which comprises a drill bit, a bur body and a connecting part, the drill bit comprises a drill body and a drill tip, the drill body is detachably connected with the bur body, emery is sprayed on the outer wall of the drill body by adopting a sand blasting process, a first external thread is arranged on the outer wall of the drill tip, and the length of the drill tip is 2-3mm; the first external threads are arranged on the outer wall of the drill tip, and the corundum is sprayed on the drill body by adopting a sand blasting process, so that the drill tip can move more stably when being drilled into teeth due to the arrangement of the first external threads, the sprayed corundum can enhance the overall strength of the drill body, and meanwhile, the drill tip is prevented from being damaged. The drill bits and the needle body are detachably connected, so that a doctor only needs to prepare a plurality of drill bits of different models before an operation and replace the drill bits according to actual requirements in the operation process, and compared with the prior art, the drill has the advantages that the drilling capacity is good, the occupied area of an instrument tray is reduced, and the operation of the doctor is facilitated.

The invention relates to a single-layer abrasive particle diamond grinding wheel surface topography random generation method, which realizes the digital generation of the grinding wheel surface topography by establishing an abrasive particle size distribution, space distribution and exposure height three-dimensional parameter model based on the idea of combining statistical modeling and random simulation. By introducing truncated normal distribution to form an abrasive particle size distribution function and applying a three-dimensional random bias vector, random features of the size and position of the abrasive particles on the surface of the diamond grinding wheel are truly represented, the authenticity and applicability of the model are remarkably improved, the accuracy of the characterization modeling technology is improved, and the method is suitable for large-scale popularization and application. And the technical defect of machining damage caused by random distribution of the abrasive particles can be overcome.

The invention relates to a preparation method of an alkali-free low-temperature sintered glass ceramic binding agent. The preparation method comprises the following steps: 1) respectively carrying out ball-milling mixing on a fluxing component, a nucleating component and a high-temperature stable component; 2) preparing a melt, and adding a fluxing component at 1000 DEG C to form a melting system; adding a nucleation component at 1250 DEG C, and inducing the formation of a crystal nucleus by using the stability of the nucleation component at a high temperature; adding the high-temperature stable component at the temperature of 1400 DEG C; 3) carrying out quenching water quenching on the melt, drying, and crushing to obtain crude powder; and 4) refining the rough powder until D90 is less than or equal to 0.3 m to obtain the alkali-free low-temperature sintered glass ceramic binding agent. The water resistance and acid resistance of the diamond grinding wheel are improved through an alkali-free metal formula, the melting temperature of the binding agent is smaller than or equal to 750 DEG C, and the thermal expansion coefficient of the binding agent is matched with that of diamond; the microhardness and the breaking strength are improved through effective devitrification, and the service life of the diamond grinding wheel is prolonged by more than or equal to 30%.

The invention provides a diamond grinding wheel for precise grinding and a preparation method of the diamond grinding wheel. The preparation method of the diamond grinding wheel comprises the following steps: firstly, preparing agglomerated diamond microspheres with different formulas and different particle sizes by mainly taking diamond micro-powder and a first ceramic bond as raw materials; and preparing the diamond grinding wheel by taking agglomerated diamond microspheres with different formulas and different particle sizes in a certain proportion, a second ceramic bonding agent, a pore forming agent and the like as raw materials. According to the diamond grinding wheel, agglomerated diamond microspheres are used as raw materials, so that a plurality of cutting edges are ground at the same time when the diamond grinding wheel is used for grinding, and the grinding wheel has high grinding efficiency and good workpiece surface quality; the agglomerated diamond microspheres with different proportions can enable the diamond grinding wheel to have excellent self-sharpening capability, namely sharpness. And in addition, the agglomerated diamond microspheres enable the diamond grinding wheel to have a more reasonable pore structure, so that the diamond grinding wheel has better chip containing and heat dissipation capacities.

This utility model discloses an automatic grinding machine for inner arc planer blades used in refrigeration high-frequency welded pipes. It features a work cabinet with a worktable and a control console mounted on the work cabinet. The work cabinet houses a workpiece holder, a surface grinding frame, and an arc grinding frame. The workpiece holder moves along the X and Y axes, while the surface and arc grinding frames are located at two separate stations and move along their respective Z axes. A first distance-measuring and positioning device is mounted on the surface grinding frame, and a second distance-measuring and positioning device is mounted on the arc grinding frame. Employing an XYZ three-axis linkage + dual-station grinding system, the machine achieves automatic positioning, distance measurement, and grinding of the planer blade, improving processing accuracy and shape consistency. Precise control via diamond grinding wheels and PLC ensures that the dimensions and shape of the inner arc R conform to standards. The machine has a long service life and a user-friendly working environment. It is suitable for grinding planer blades of different specifications, offering strong versatility and high production efficiency.

The invention relates to the technical field of grinding wheel grinding tools, and discloses a low-temperature fired ceramic bond cubic boron nitride diamond superhard grinding tool which comprises a main driving component, an output shaft of the main driving component is fixedly connected with a main transmission rod, and one end of the main transmission rod is fixedly connected with a diamond grinding wheel; the continuously rotating cleaning brush can sweep particulate abrasive particles existing on the surface of the diamond grinding wheel, meanwhile, the fan-shaped spray head is used for spraying the mixed liquid to the surface of the diamond grinding wheel in a fan shape, loose debris particles generated after sweeping of the cleaning brush are flushed, the cleanliness of the grinding face of the diamond grinding wheel is improved, and the service life of the diamond grinding wheel is prolonged. And the rotating side transmission fan can generate wind power and blow the wind power to the inner side of the outer protection frame, airflow is guided to the surfaces of the cooling fins in cooperation with a flow guide frame, the cooling and heat dissipation effect on the cooling fins is improved, meanwhile, mixed liquid left on the surface of the diamond grinding wheel is blown away through an air knife, the dryness of the surface of the diamond grinding wheel is kept, and shutdown cleaning and drying are not needed.

The present application belongs to abrasive tool technical field, and particularly relates to a preparation method of metal-bonded diamond porous semiconductor thinning grinding wheel; the preparation steps of the present application include abrasive layer material preparation, agglomerate forming, agglomerate sintering and processing, agglomerate bonding or welding with a substrate, and post-processing to obtain a porous high-strength metal-bonded diamond thinning grinding wheel. The original hydrogen reduction pre-sintering metal-bonded abrasive is adopted, and the metal bonding agent and pore-forming agent are optimally selected; the prepared material is formed by machine pressing, and then sintered in a vacuum furnace at 600-900 DEG C; the substrate is bonded or welded, and the porous high-strength metal-bonded diamond grinding wheel is obtained after machining and processing. The performance of the grinding wheel exceeds the service performance of existing grinding wheels in SiC wafer thinning, sapphire thinning, monocrystalline silicon thinning and other semiconductor thinning applications.

The utility model relates to a grooving device for diamond grinding wheel production, which comprises a mounting case, the rear end face of the mounting case is fixedly connected with a mounting bracket, the top end face of the mounting bracket is fixedly connected with a hydraulic telescopic rod, and one end of the hydraulic telescopic rod is fixedly connected with a grooving motor. A main shaft of the grooving motor is fixedly connected with a grooving blade through a coupler, the inner side of the bottom end face of the mounting case is fixedly connected with a double-output-shaft motor, main shafts at the two ends of the double-output-shaft motor are both fixedly connected with driving lead screws, and the outer sides of the two driving lead screws are both provided with square lead screw sliding blocks; the screw rod sliding block is in fit sliding connection with the inner side wall of the bottom of the mounting case; in the grooving process, chippings generated by grooving can be sucked into the dust removal machine box through strong suction force generated by working of the air suction fan, the situation that the chippings splash to pollute the environment is avoided, the difficulty of later manual cleaning is lowered, and the filter screen can be pulled out through the sealing plate to treat the chippings.

The embodiment of the present application provides a discharge dressing method, system, equipment and medium based on the height of the abrasive grains coming out of the edge, which belongs to the field of diamond dressing technology. The method includes: obtaining the grinding wheel parameters of the diamond grinding wheel, extracting the fuzzy control strategy, the abrasive grains coming out of the edge height change threshold, the motion parameters and the power supply parameters from the database according to the grinding wheel parameters, and calculating the target discharge power according to the grinding wheel parameters; operating the CNC machine tool and performing pulse discharge according to the motion parameters and the power supply parameters, and calculating the real-time discharge power according to the pulse discharge waveform; then, calculating the abrasive grains coming out of the edge height of the diamond grinding wheel at different discharge times, when the difference in the coming out height is greater than the abrasive grains coming out of the edge height change threshold, updating the fuzzy control strategy; if the power difference between the real-time discharge power and the target discharge power is greater than the preset power deviation threshold, using the updated fuzzy control strategy to adjust the motion parameters and the power supply parameters. The present application can improve the accuracy of diamond dressing.

The invention discloses a ceramic bond which comprises the following raw materials in parts by weight: 30-50 parts of silicon dioxide, 15-30 parts of boric acid, 4-6 parts of aluminum oxide, 4-8 parts of barium oxide, 5-10 parts of aluminum oxide, 5-10 parts of zinc oxide, 4-8 parts of sodium carbonate, 1-5 parts of calcium carbonate, 1-5 parts of magnesium oxide and 1-10 parts of lithium carbonate. The invention further discloses a diamond grinding wheel prepared from the ceramic bond. The diamond grinding wheel is prepared from the following raw materials in percentage by weight: 10-20% of the ceramic bond, 50-60% of diamond micro powder, 5-10% of white corundum, 10-20% of a pore forming agent and 5-15% of resin powder. The ceramic bond is low in firing temperature, tightly combined with diamond micro-powder and high in holding force, the porosity of the prepared diamond grinding wheel reaches 70%, the abrasive ratio is low, and meanwhile the stability is high in the using process.

The present application relates to the field of grinding control, especially to a diamond grinding wheel dressing method and system. The method comprises the following steps: firstly, collecting the three-dimensional point cloud of the grinding wheel, and using a Kalman filtering mechanism combining wear model prediction and real-time data observation to accurately correct the three-dimensional point cloud to obtain the real wear state of the grinding wheel. Then, based on the corrected three-dimensional point cloud, an electrochemical activity degree for representing the electrolytic dressing efficiency of each point of the grinding wheel is calculated. Next, the electrochemical activity degree, the theoretical dressing amount of each point of the grinding wheel and the expected normal wear amount are taken as parameters, and an energy density matrix representing the dressing intensity requirement of each position of the grinding wheel is obtained by solving an objective function. Finally, the present application implements the adaptive and high-precision dressing of the grinding wheel by combining dynamic sensing and model prediction.