The invention particularly discloses a
wafer heavy scratch three-dimensional shape repairing process based on a DFG 8560 single-axis accurate
grinding mode, and aims to solve the problems that deep subsurface damage is introduced by rough
grinding in a traditional double-stage
grinding process, the
machining efficiency is low, and material waste is serious. The process comprises the following steps: identifying a heavy scratch defect existing on the surface of a
wafer through an automatic optical detection
system; a
ceramic bond
diamond grinding wheel with the particle size of 8000 is adopted, uniaxial accurate grinding is conducted through
ultrapure water cooling under the optimized parameters that the rotating speed of a main shaft is 1300-2300 rpm, the rotating speed of a
workbench is 1785-2100 rpm and the rotating speed ratio is 0.6-1.3, and three-dimensional shape repairing is directly completed by skipping rough grinding; the rotating speed and pressure of grinding are dynamically regulated and controlled in three stages, the total time is less than or equal to 135 seconds, and the removal amount is 6-12 microns. By the adoption of the technical scheme, the
surface roughness Ra can be smaller than 0.5 nm, the subsurface damage layer can be smaller than 50 nm, the repair success rate is larger than 98.5%, the
machining time is remarkably shortened by 35% or above, and the
material removal amount is reduced by 40%.