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Diamond grinding wheel

A diamond grinding wheel and diamond technology, applied in the field of diamond grinding wheels, can solve the problems of poor impact resistance and fatigue performance, low bonding strength, difficulty in applying high-speed machining, etc., and achieve high grinding precision, short sintering time, and high holding force strong effect

Active Publication Date: 2017-05-10
磐维科技(青岛)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Resin bond is easy to process and repair, but its use temperature is low, its bonding strength and holding force to abrasives are low, abrasives are easy to fall off, and grinding accuracy is poor; ceramic bond has better bonding strength, high holding force, and high use temperature , but its high brittleness, poor thermal conductivity, poor impact resistance and fatigue performance, it is difficult to apply to high-speed processing
Although the existing metal bond has good strength, toughness and heat resistance, there is usually a problem that chemical metallurgical bonding cannot occur between the bond and the abrasive grains, so the abrasive grains are only mechanically embedded in the bond , the holding force is limited; it is easy to cause the failure of the grinding wheel due to the shedding of abrasive particles, especially in the high-efficiency grinding of difficult-to-machine materials; in addition, the exposed height of the abrasive is low, and the chip space is small, and it is easy to be damaged by the chip during grinding. failure due to clogging

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The metal bond of this embodiment is composed of the following raw material components in mass percentage: Cu 55%, Sn 37%, TiH 2 8%; the sum of the mass fractions of each component is 100%; the above-mentioned raw materials are Cu powder, Sn powder and TiH2 powder; the particle size of the above-mentioned raw material powders is 20 μm.

[0023] The diamond grinding wheel of this embodiment is made of the following raw materials in mass percentage: 50% of diamond abrasive, 44% of metal bond powder, and 6% of auxiliary binder. The particle diameter of the above-mentioned diamond abrasive is 10 μm.

[0024] The preparation method of above-mentioned diamond grinding wheel is as follows:

[0025] (1) Mixing: Put diamond abrasive, Cu powder, Sn powder and TiH2 powder into the mixer according to the formula, add auxiliary binder and mix for 4 hours to obtain the mixture;

[0026] (2) Drying: Put the uniformly mixed raw materials in step 1 into the dryer and heat to 100ºC, an...

Embodiment 2

[0031] The metal bond of this embodiment is composed of the following raw material components in mass percentage: Cu 50%, Sn 44%, TiH 2 6%; the sum of the mass fractions of each component is 100%; the above-mentioned raw materials are Cu powder, Sn powder and TiH2 powder; the particle size of the above-mentioned raw material powders is 80 μm.

[0032] The diamond grinding wheel of this embodiment is made of the following raw materials in mass percentage: 33% of diamond abrasive, 62% of metal bond powder, and 5% of auxiliary binder. The particle diameter of the above-mentioned diamond abrasive is 60 μm.

[0033] The preparation process of diamond grinding wheel is as follows:

[0034] (1) Mixing: Put diamond abrasive, Cu powder, Sn powder and TiH2 powder into the mixer according to the formula, add auxiliary binder and mix for 4 hours to obtain the mixture;

[0035] (2) Drying: Put the uniformly mixed raw materials in step 1 into the dryer and heat to 150ºC, and keep it warm ...

Embodiment 3

[0040] The metal bond of this embodiment is composed of the following raw material components in mass percentage: Cu 54%, Sn 31%, TiH 2 15%; the sum of the mass fractions of each component is 100%; the above-mentioned raw materials are Cu powder, Sn powder and TiH2 powder; the particle size of the above-mentioned raw material powders is 150 μm.

[0041] The diamond grinding wheel of this embodiment is made of the following raw materials in mass percentage: 25% of diamond abrasive, 72% of metal bond powder, and 3% of auxiliary binder. The particle diameter of the above-mentioned diamond abrasive is 150 μm.

[0042] The preparation process of diamond grinding wheel is as follows:

[0043] (1) Mixing: Put diamond abrasive, Cu powder, Sn powder and TiH2 powder into the mixer according to the formula, add auxiliary binder and mix for 4 hours to obtain the mixture;

[0044] (2) Drying: Put the uniformly mixed raw materials in step 1 into the dryer and heat to 120ºC, and keep it wa...

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Abstract

The invention relates to the field of superhard materials, in particular to a diamond grinding wheel which is excellent in impact resistance and shape retention, can bear higher load during a high-speed grind process, and comprises a steel core and an abrasive material ring adhered together through a resin adhesive; the abrasive material ring is characterized by being prepared from the following raw materials in mass percent: 25-50% of diamond abrasive material, 44-72% of a metallic bond and 3-6% of an auxiliary adhesive. The diamond grinding wheel has excellent heat conductivity to facilitate reduction of grinding temperature so as to reduce power loss and increase grinding speed; the auxiliary adhesive in the formula facilitates formation of pores, and the characteristic of high holding force of the metallic bond is combined, so that the chip space can be effectively increased, and the utilization of the abrasive material is more sufficient; and the grinding wheel has the characteristics of high grinding efficiency, low grinding temperature and power loss, high machining precision and long service life.

Description

technical field [0001] The invention relates to the field of superhard materials, in particular to a diamond grinding wheel. Background technique [0002] Modern machining is developing in the direction of high precision, high speed, hard machining, dry machining (no coolant) and cost reduction, which puts forward quite high requirements for the performance of superhard abrasive tools. Currently commonly used superhard grinding materials include cubic boron nitride (CBN) and diamond abrasives. Although the hardness of CBN abrasive is inferior to that of diamond, its thermal stability and chemical stability are strong, especially it will not react with iron and iron alloys, so it can be used in iron-based alloy materials such as hardened steel, high-speed tool steel, bearing steel, stainless steel, It has been widely used in the grinding of many high-strength toughness difficult-to-machine materials such as die steel, heat-resistant steel, advanced high-strength steel and hi...

Claims

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Application Information

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IPC IPC(8): B24D3/10B24D3/34B24D18/00
CPCB24D3/10B24D3/342B24D18/0009
Inventor 胡成洋其他发明人请求不公开姓名
Owner 磐维科技(青岛)有限公司
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