Method for preparing diamond grinding wheel ceramic bond with low sintering temperature and high strength

A technology of diamond grinding wheel and low sintering temperature, which is applied in the direction of metal processing equipment, manufacturing tools, grinding/polishing equipment, etc. It can solve the problems of increasing the economic cost of firing, thermal damage of diamond abrasive, and affecting the performance of abrasive, so as to achieve porosity Good tonality, few correction times, and long working life

Inactive Publication Date: 2014-05-07
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The firing temperature of vitrified bonds currently on the market is higher than 720°C in the process of preparing diamond grinding wheels, which will cause thermal damage to the diamond abrasive, affect the performance of the abrasive and increase the economic cost of firing, and most of the vitrified bonds have low strength. At 100MPa, it cannot meet the needs of the modern precision grinding industry

Method used

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  • Method for preparing diamond grinding wheel ceramic bond with low sintering temperature and high strength
  • Method for preparing diamond grinding wheel ceramic bond with low sintering temperature and high strength
  • Method for preparing diamond grinding wheel ceramic bond with low sintering temperature and high strength

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specific Embodiment approach

[0017] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with examples.

[0018] The embodiment of the present invention provides a low sintering temperature and high strength diamond grinding wheel vitrified bond with good performance.

Embodiment 1

100

[0022] According to the formula shown in the above table, select raw materials and calculate the ingredients. The list of raw materials and ingredients is shown in the following table:

[0023]

[0024] Put the raw materials in the above table into the high-temperature furnace for melting according to the proportion of ingredients. The heating process in the high-temperature furnace is as follows: raise the temperature to 800°C at a rate of 5°C / min; continue to raise the temperature to 1350°C at a rate of 3°C / min. hours; and then heated up to 1500°C at a rate of 3°C / min, and kept at 1500°C for 2 hours to obtain a molten liquid. Then the molten liquid is water-quenched and dried at 70° C. for 24 hours, ground by a ball mill and passed through a 200-mesh sieve to obtain powder, which is a low sintering temperature and high-strength diamond grinding wheel vitrified bond.

[0025] The present invention further provides a diamond grinding wheel containing the abov...

Embodiment 2

[0029] Step 1: Select raw materials according to the formula shown in the above table and calculate the ingredients. The list of raw materials and ingredients is shown in the following table:

[0030]

[0031] Step 2: Put the raw materials in the above table into the high-temperature furnace according to the proportion of ingredients for melting. The heating process in the high-temperature furnace is as follows: heat up to 800°C at a rate of 5°C / min; continue to heat up to 800°C at a rate of 3°C / min. Insulate at 1350°C for 2 hours; then raise the temperature to 1500°C at a rate of 3°C / min, and keep at 1500°C for 2 hours to obtain a molten liquid.

[0032] The third step: quench the molten liquid in water and dry it at 70°C for 24 hours, grind it with a ball mill, and pass through a 200-mesh sieve to obtain powder, which is a vitrified bond for diamond grinding wheels with low sintering temperature and high strength.

[0033] The present invention further provides a d...

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Abstract

The invention provides a method for preparing diamond grinding wheel ceramic bond with low sintering temperature and high strength. The method includes the following steps of (1) mixture calculation, (2) melting and (3) water quenching and grinding, wherein the step (1) includes that raw mineral materials and chemical materials are used as the source of oxide, the mixture calculation is performed according to the oxide and the content thereof in the raw mineral materials and the chemical materials, and oxide compositions and contents thereof by weight part in the materials meet the following requirement, that is to say 40-60 parts of silicon dioxide, 10-30 parts of diboron trioxide, 2-6 parts of aluminum oxide, 12-16 parts of calcium oxide, 2-8 parts of sodium oxide, 0.5-2 parts of zinc oxide, 0.5-1.5 parts of barium oxide, 0.5-1 part of titanium dioxide, 0.5-2 parts of tungsten trioxide and 0.5-1 part of bismuth oxide, and after the step (3), the diamond grinding wheel ceramic bond with the low sintering temperature and the high strength can be obtained. The method is simple in preparing process and low in costs, and the obtained diamond grinding wheel ceramic bond is good in performances.

Description

technical field [0001] The invention belongs to the technical field of material engineering, and in particular relates to a preparation method of a low-sintering-temperature high-strength diamond grinding wheel vitrified bond. Background technique [0002] The diamond grinding wheel is a circular bonded abrasive tool with a through hole in the center, which is made of diamond abrasives as raw materials, and metal powder, resin powder, ceramics, etc. as binders. Due to the characteristics of diamond abrasives (high hardness, high compressive strength, and good wear resistance), diamond grinding wheels become ideal tools for grinding hard and brittle materials and hard alloys in grinding processing, which not only has high efficiency and high precision , and the roughness is good, the consumption of abrasive tools is small, the service life is long, and the working conditions can be improved at the same time. With the development of modern industry and technology, diamond gri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00B24D3/14
Inventor 何峰周琪谢峻林
Owner WUHAN UNIV OF TECH
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