56results about How to "Excellent cuttability" patented technology

The present invention provides an abradable coating which is applied to the surfaces of stationary parts in rotary machinery such as gas turbines and does not cause damage or other trouble to the blades, as well as a method for forming the same. This method for forming an abradable coating comprises the steps of coating a shroud material with a partially stabilized zirconia ceramic material to form a zirconia ceramic layer having a cubic or tetragonal crystal structure on the surface of the shroud material; and subjecting the shroud material having the zirconia ceramic layer formed thereon to high-temperature water treatment at a temperature of 100 to 450° C. for 1 to 300 hours and thereby transforming the crystal structure of the zirconia ceramic layer into a monoclinic crystal structure. Alternatively, shot peening may be employed in place of the high-temperature water treatment.

A polycrystalline cubic boron nitride compact which comprises greater than 75 volume % and not greater than 90 volume % cubic boron nitride particles, the cubic boron nitride particles comprising particles of at least two average particle sizes, and a binder phase constituting the balance of the compact and comprising at least one titanium compound selected from titanium boride, titanium nitride, titanium carbide and titanium carbonitride and at least one aluminium compound selected from aluminium oxide, aluminium boride, aluminium nitride, aluminium carbide and aluminium carbonitride.

Provided are a substrate film and a method of manufacturing the substrate film. The substrate film may have excellent thermal resistance and dimensional stability, has excellent stress relaxation to prevent damage of a wafer caused by remaining stress, inhibits damage to or flying-off of the wafer caused by application of a non-uniform pressure during the processing of the wafer, and has excellent cuttability. Accordingly, the substrate film of the present invention can be effectively used as a processing sheet in a process of processing various kinds of wafers including dicing, back-grinding or picking-up.

The present invention relates to a lead-free, bismuth-free free-cutting phosphorous brass alloy and its method of manufacture. The alloy comprises: Cu; Zn; 0.59 to 1.6 wt % P; and other elements in the amount of 0.005 to 0.6 wt %, which comprise at least two elements selected from the group consisting of Al, Si, Sb, Sn, Rare earth element (RE), Ti and B, and the balance being unavoidable impurities. The phosphorous brass alloy contains a combined wt % of Cu and Zn of between 97.0 wt % and 99.5 wt %, within which the content of Zn is above 40 wt %. Considering the solid solubility of P in the matrix of copper will be decreased rapidly with the temperature decrease and form the brittle intermetallic compounds Cu₃P with Cu, the present invention relies upon P to ensure excellent cuttability of the invented alloy. The invented alloy is reasonably priced, and has excellent cuttability, castability, hot and cold workability, dezincification corrosion resistance, mechanical properties and weldability. The phosphorous brass alloy is a useful alloy for spare parts, forging and castings that require cutting, and particularly in forging and castings for low pressure die casting that requires cutting, grinding, welding and electroplating. The phosphorous brass alloy may also be used for faucets, valves and bushings of water supply systems, and for bar and wire materials that require high corrosion resistance and compactness.

A curable compound is provided, which can be obtained as a mixture of at least two components to be stored separately, of which one component includes a silane-modified polymer and the component of a second component includes an acid or basic salt containing water of crystallization. An aminic adhesion promoter is contained in one or both components or a further component, with the stipulation that no component contains all three substances. Additionally, a method is provided for accelerating the curing of a silane-modified polymer, in which an acid or basic salt containing water of crystallization is added to the silane-modified polymer.

An object of the invention is to provide a scintillator panel which exhibits excellent cuttability and can be cut without the occurrence of problems such as the separation of a scintillator layer and which can give radiographic images such as X-ray images with excellent sensitivity and sharpness. The scintillator panel of the invention includes a reflective layer and a scintillator layer formed by deposition on a support, and the reflective layer includes light-scattering particles and a specific binder resin and has a specific thickness.

To provide a hardenable pressure-sensitive adhesive film which is excellent in cuttability and permits excellent shearing such as punching or perforating without adhesive spew.

[Means for Solving Problems] A hardenable pressure-sensitive adhesive film (1), characterized by being produced by laminating an isotropic support sheet (11) made of a resin which exhibits lengthwise and widthwise shear strengths of 2 to 2000 g [200 mm/min 25 mm width], preferably 5 to 1000 g, still preferably 10 to 500 g in the thickness range of 2 to 60 [mu]m with a face sheet (12) made of a resin-base pressure-sensitive adhesive. In the film (1), the face sheet(s) (12) may be present on either or both sides of the support sheet (11).

A UV curable adhesive composition includes a morpholine group-containing (meth)acrylic copolymer.

A composition and method for treating an aramid cord include a bisphenol-A-based- and/or a bisphenol-F-based-liquid epoxy resin, a reactive diluent, and a curing agent. The composition and method also may include an elastomer-modified epoxy-functional adduct and/or an elastomer-modified epoxy-resin adduct.

A transmission belt is made of a cord, a rubber or thermoplastic matrix, and an adhesion material which is able to adhere the cord to the rubber or thermoplastic matrix. The cord is made of at least two yarns, such that a first yarn has a melting or decomposition point T₁ and a second yarn has a melting point T₂, wherein T₁>T₂. A ratio of a linear density of the first yarn to a linear density of the second yarn is between 1,000:1 and 1:1, wherein the second yarn is fused to the first yarn. A method of making such cords includes intertwining the first and the second yarn and then heating to a temperature between T₁ and T₂, with the heating step being integrated with or followed by a step wherein the cord is subjected to a dipping treatment with a rubber adhesion material.

The present disclosure provides a brazing bond type diamond tool having excellent cuttability and a method of manufacturing the same. The diamond tool includes a shank having a body and a tip portion formed along an edge of the body, and a brazing bond layer formed on the tip portion of the shank to secure diamond particles with a brazing bond. The tip portion is thinner than the body and is integrally formed with the body.

A lead-free free-cutting corrosion-resistant silicon-bismuth brass alloy, including the following: between 60.0 and 65.0 wt % of Cu, between 0.6 and 1.8 wt % of Si, between 0.2 and 1.5 wt % of Bi, between 0.02 and 0.5 wt % of Al, less than 1.5 wt % of Ni+Mn+Sn, between 0.01 and 0.5 wt % of La—Ce alloy, between 0.002 and 0.02 wt % of B, with the remainder being Zn and inevitable impurities, wherein the total amount of impurities are no more than 0.5 wt %.

Provided is a sheet for processing a wafer. The sheet can exhibit excellent heat resistance and dimensional stability, prevent breakage of a wafer in response to residual stress due to excellent stress relaxation properties, inhibit damage to or dispersion of the wafer due to application of a non-uniform pressure, and also exhibit excellent cuttability. The sheet can effectively prevent a blocking phenomenon from occurring during wafer processing. For these reasons, the sheet can be useful for processing a wafer in various wafer preparation processes such as dicing, back-grinding and picking-up.

It is an object of the present invention to provide a substrate for lithium ion battery separators which has high adhesion to an inorganic particle layer, can be made thin and is excellent in tensile strength and cuttability and a lithium ion battery separator including the substrate for lithium ion battery separators. The substrate for lithium ion battery separators which contains heat-resistant fibers and synthetic resin short fibers contains fibrillated heat-resistant fibers having a modified freeness of not more than 300 ml as the heat-resistant fibers and has a content of the fibrillated heat-resistant fibers having a modified freeness of not more than 300 ml of not less than 1.0 mass % to less than 5.0 mass % based on the total of all the fiber components contained in the substrate. The modified freeness is a value measured in accordance with JIS P8121-2:2012 except that an 80-mesh wire net having a wire diameter of 0.14 mm and an opening of 0.18 mm is used as a screening plate and the concentration of a sample is 0.1%.

An expanded polymeric material which consists of at least 200 phr, preferably at least 300 phr, but less than 1000 phr, preferably less than 700 phr ingredients in total, comprising 100 phr of at least one polymer, of which at least one is a sulphur and/or metal oxide crosslinkable elastomer and at least 40 phr, preferably at least 55 phr of at least one polymeric flame retardant, preferably a brominated polymeric flame retardant.

A lead-free free-cutting magnesium brass alloy comprises 56.0 to 64.0 wt % Cu, 0.6 to 2.5 wt % Mg, 0.15 to 0.4 wt % P and other elements 0.002 to 0.9 wt % which comprise at least two elements selected from the group consisting of Al, Si, Sb, Sn, Re, Ti and B and the balance being Zn and unavoidable impurities. The process for producing such alloy is also proposed. The invented alloy is excellent in cuttability, castability, hot and cold workability, corrosion resistance, mechanical properties and weldability and particularly applicable in spare parts, forging and castings which need cutting, grinding and electroplating process. The cost of necessary metal materials of the invented alloy is lower than lead-free free-cutting bismuth and antimony brass alloy and is equivalent to lead-contained brass alloy.

Considering the solid solubility of P in the matrix of copper will be decreased rapidly with the temperature decrease and form the brittle intermetallic compounds Cu₃P with Cu, the present invention elects P as one of the main elements for ensuring the excellent cuttability of the invented alloy. The lead-free free-cutting phosphorous brass alloy comprises: Cu, Zn, 0.4 to 1.6 wt % P. and other elements in the amount of 0.005 to 0.6 wt %, which comprise at least two elments selected from the group consisting of Al, Si, Sb, Sn, Re, Ti and B, and the balance being unavoidable impurities. The phosphorous brass alloy contains a combined wt % of Cu and Zn of between 97.0 wt % and 99.5 wt %, within which the content of Zn is above 35 wt %. The method of manufacturing the alloy is also disclosed. The invented alloy has excellent cuttability, castability, hot and cold workability, dezincification corrosion resistance, mechanical properties and weldability. The phosphorous brass alloy is applicable in spare parts, forging and castings that require cutting, and particularly in forging and castings for low pressure die casting that requires cutting, grinding, welding and electroplating. The phosphorous brass alloy may be used for faucets, valves and bushings of water supply systems, and for bar and wire materials that require high corrosion resistance and compactness.