Brazing bond type diamond tool with excellent cuttability and method of manufacturing the same
Patent Information
- Authority / Receiving Office
- US · United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- NIWA DAIYAMONDO INDS
- Publication Date
- 2013-03-07
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit under 35 U.S.C. §119 of Korean Patent Application No. 10-2011-0090504 filed on Sep. 7, 2011 in the Korean Intellectual Property Office, the entirety of which disclosure is incorporated herein by reference.BACKGROUND
[0002] 1. Technical Field
[0003] The present invention relates to a technique for manufacturing a diamond tool, and, more particularly, to a brazing bond type diamond tool which has improved cuttability through a unique shank structure, and a method of manufacturing the same.
[0004] 2. Description of the Related Art
[0005] A general diamond tool is manufactured by welding a metal powder sintered compact having diamond particles to a shank constituting a main body of the diamond tool. The metal powder sintered compact acts as a bonding material for securing the diamond particles.
[0006] Such a diamond tool has a problem with low impact strength.
[0007] To solve this problem, Korean Patent Publication No. ...