CMP conditioner

a conditioner and conditioner technology, applied in the direction of gear teeth, gear teeth, gear-teeth manufacturing apparatus, etc., can solve the problems of unavoidable scratching, inability to be sure, scratching will be generated on the surface being polished, etc., to prevent diamond grit from falling off
US7150677B2Active Publication Date: 2006-12-19MITSUBISHI MATERIALS CORP
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Patents(United States)
Current Assignee / Owner
MITSUBISHI MATERIALS CORP
Publication Date
2006-12-19

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Abstract

A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the conditioning surface and face in a direction faced by the conditioning surface.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a CMP conditioner that is used in the conditioning of polishing pads of a chemical mechanical polishing (CMP) apparatus that polishes semiconductor wafers and the like.

[0003] Priority is claimed on Japanese Patent Application No. 2004-274912, filed Sep. 22, 2004, the contents of which are incorporated herein by reference.

[0004] 2. Description of Related Art

[0005] For this type of CMP conditioner, a technology has been proposed, for example, in patent document 1 (Japanese Unexamined Patent Application, First Publication No. 2001-71267) in which, in a pad conditioning diamond dresser in which a single layer of diamond grit is adhered to a base metal operating surface of a disk-shaped or cup-shaped base metal by nickel plating, 70% or more of the adhered diamond grit has ridges or peaks of crystals as protruding ends. Moreover, in patent document 2 (Japanese Unexamined Patent Application, Firs...

Claims

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