Method and device for quickly separating optical crystals by using laser light

Abstract

The invention discloses a method for quickly separating optical crystals by using layer light. The method comprises the following steps of setting the separating direction of the optical crystals by using ultrafast laser light or a miniature diamond grinding wheel; forming a precast microcrack with the direction along a to-be-separated path at a separation starting end; performing scanning heating on the preformed microcrack by using focusing laser light to form a laser-induced microcrack; quickly moving the focusing laser light along the to-be-separated path until the laser moving speed is the same with the crack expansion speed; enabling the focusing laser light to always follow the foremost end of the microcrack; performing thermal expansion effect on materials on two sides of the microcrack; generating forward squeezing force and lateral pulling stress on the tip of the microcrack; and pulling materials of the crystals so as to realize high-quality separation of the crystals. A device comprises a microcrack preforming mechanism, a single-focus-point laser machining system and a two-dimensional worktable. By using the method and the device, the separation speed, the separation accuracy, the machining safety and the machining quality of the optical crystals can be improved, non-loss separation of the optical crystals is realized, and a quasi-polishing-level finishing separation surface is formed.

Description

technical field [0001] The invention belongs to the technical field of laser processing applications, and relates to a method for rapidly separating optical crystals by laser and a related device. The invention can utilize laser light to separate and process transparent materials quickly and with high quality, especially to separate optical crystals such as potassium dihydrogen phosphate (KDP) safely, quickly and with high quality. Background technique [0002] KDP type crystal is an important class of multifunctional crystal materials. During World War II, KDP was used to manufacture piezoelectric transducers and sonar equipment and became military supplies. Since the emergence of laser technology in the 1960s, this type of crystal material has been widely used in the field of optoelectronic technology due to its high nonlinear optical coefficient, wide light transmission band, and excellent electro-optical and frequency conversion performance. Especially in recent years, ...

AI Technical Summary

Problems solved by technology

[0005] Although this method realizes the non-contact separation of KDP crystals, it must use an ultrafast laser to form a pretreatment surface in the crystal, and there are still the following problems: (1) The use of ultrafast lasers to modify the crystal has a negative impact on the light intensity control accuracy and Stability requirements are extremely high, the mechanism is complicated, and the equipment is expensive

(2) Making a modified surface that runs through the separation track will destroy the stability of the internal stress of the crystal, and will also form a burst point when encountering material lattice defects, and cracks often occur during the manufacturing process

(3) The pretreatment surface that runs through the crystal will destroy the roughness and material properties of the separated side wall, so that the separated crystal side wall must be polished and removed before the pretreated area can be used

(4) The separation principle of this method is the tensile stress generated by laser heating material expansion and cooling, so the separation speed is severely restricted by the cooling of the material. Although it is much faster than traditional mechanical cutting, the speed still cannot meet the actual needs.

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