Low-filling high-heat-conductivity organic-inorganic compound

An inorganic composite and high thermal conductivity technology, applied in the field of organic-inorganic composites, can solve the problems of thermal conductivity impact, high thermal conductivity filler content affecting contact area and heat dissipation capacity, and product cost increase, so as to reduce interface thermal resistance and achieve remarkable technology The effect of progress and economic value, low cost of industrialization

Inactive Publication Date: 2016-07-13
ANHUI UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the above technical solution, although the thermal conductivity of the organic / inorganic thermally conductive compound is improved by doping metal powder, such as silver powder, it is found that the thermal conductivity of the product is still affected by the content of thermally conductive fillers in practical applications.
Although the high filler content improves the thermal conductivity of the product, it will lead to an increase in the cost of the product, and it will also cause the defects that the high content of thermal conductive filler in the composite system will affect the contact area and heat dissipation capacity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036]Add 100 parts of spherical metal aluminum powder into the ball mill, add solvent oil, 6 parts of stearic acid and 7 parts of polyethylene wax at the same time, ball mill for 8 hours, use a sieving machine to screen out 200 mesh flake aluminum powder fillers, 90 °C for 12 hours in vacuum to obtain flake aluminum powder. Add 100 parts of flake aluminum powder and 700 parts of spherical alumina after ball milling into the high-speed mixer, stir for 0.5 hours, add 400 parts of vinyl silicone rubber, continue stirring for 2 hours, and put the product at 60 ° C The thermally conductive silicone grease with high thermal conductivity was prepared by vacuum drying. The thermal conductivity of the composite was measured to be 2.5K / w.M using a Setaram thermal conductivity meter TCI (the same below).

Embodiment 2

[0038] 200 parts of boron nitride were ball milled for 2 hours, dispersed in water, and ultrasonically stripped for 12 hours to prepare flake boron nitride. Add 200 parts of ultrasonicated boron nitride and 400 parts of zinc oxide into the high-speed mixing tank and stir for 1.5 hours. Continue to add 300 parts of vinyl silicone rubber, continue to stir for 2 hours, and vacuum dry the product at 80° C. for 12 hours to obtain thermally conductive silicone grease with high thermal conductivity. The thermal conductivity of the test compound is 2.0K / w.M.

Embodiment 3

[0040] Add 150 parts of graphite flakes, 100 parts of flaky boron nitride, and 400 parts of spherical aluminum powder into a high-speed mixing kettle and stir for 2 hours. After heating to remove excess solvent, add 400 parts of polyethylene glycol 400, continue to stir for 8 hours and dry to prepare a thermally conductive compound with high thermal conductivity. The thermal conductivity of the test compound was 3.8K / w.M.

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Abstract

The invention discloses a low-filling high-heat-conductivity organic-inorganic compound which comprises, by weight, 50-1000 parts of organic component serving as a heat-radiating matrix, 100-400 parts of flaky inorganic matter serving as a first heat-conducting filler and 10-800 parts of non-flaky inorganic matter serving as a second heat-conducting filler.A heat-conducting network of two dimension / three dimension and two dimension / one dimension is formed in the organic heat-radiating matrix by compounding the inorganic heat-conducting fillers various in shape, so that the low-filling high-heat-conductivity organic-inorganic compound has high heat conductivity and good storage stability.

Description

technical field [0001] The invention relates to a heat-conducting composite, in particular to an organic-inorganic composite with low filling and high thermal conductivity. Background technique [0002] In today's complex and multi-functional electronic products, how to effectively dissipate heat for electronic components is one of the basic problems to ensure the normal operation of the product. Add heat-conducting gaskets and heat-conducting gaskets made of inorganic heat-conducting materials, but there are often large gaps on the contact surfaces of gaskets made of inorganic heat-conducting materials and the gaskets and electronic components, which seriously affects the heat dissipation effect. [0003] In order to improve the heat transfer and heat dissipation performance of electronic components, especially the heat dissipation of components such as CPU, the commonly used technical solution is to use organic / inorganic heat-conducting compounds to realize the gap-free co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/04C08L71/08C08K7/00C08K7/18C08K3/08C08K3/22C08K3/38C08K3/04C08K7/24
CPCC08K7/00C08K3/04C08K3/08C08K3/22C08K3/38C08K7/18C08K7/24C08K2003/0812C08K2003/085C08K2003/2227C08K2003/2296C08K2003/385C08L83/04C08L71/00
Inventor 陈鹏吕洋夏茹钱家盛苗继斌杨斌曹明苏丽芬郑争志
Owner ANHUI UNIVERSITY
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