Preparation method of high-heat-conductivity diamond-copper composite
A composite material and diamond technology, which is applied in the field of diamond/copper composite material preparation, can solve the problems that diamond/copper composite materials cannot achieve near-net shape, high quality and mass production of large-scale sheet samples, and achieve low pressure , Uniform force and high forming precision
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specific Embodiment approach 1
[0045] Specific embodiment one: the preparation method of the high thermal conductivity diamond / copper matrix composite material in this embodiment is carried out according to the following steps:
[0046] Step 1: Weigh the raw diamond powder coated with a coating layer on the surface and put it into the forming mold and perform vibration treatment to make a prefabricated body. The prefabricated body is hoisted on the lower end of the lifting rod in the air pressure infiltration furnace, and the pure The crucible of copper or copper alloy is placed under the prefabricated body in the furnace; or the raw diamond powder is weighed into the forming mold and vibrated to make a prefabricated body, and the prefabricated body is hoisted on the lifting rod in the air pressure infiltration furnace At the lower end, place the crucible containing the copper alloy under the prefabricated body in the furnace;
[0047] The material of the molding die is high-purity graphite or isostatic gra...
specific Embodiment approach 2
[0063] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the mass ratio of the pure copper or copper alloy described in step one and the coated diamond raw powder after the vibration treatment is (0.85~2.07): 1. Other steps and parameters are the same as those in the first embodiment.
specific Embodiment approach 3
[0064] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that the mass ratio of the copper alloy in step 1 to the raw diamond powder after the vibration treatment is (0.85-2.07):1. Other steps and parameters are the same as those in Embodiment 1 or 2.
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