Preparation method of high-heat-conductivity diamond-copper composite

A composite material and diamond technology, which is applied in the field of diamond/copper composite material preparation, can solve the problems that diamond/copper composite materials cannot achieve near-net shape, high quality and mass production of large-scale sheet samples, and achieve low pressure , Uniform force and high forming precision

Inactive Publication Date: 2018-07-06
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the existing diamond / copper composite material preparation method cannot realize the near-net shape, high quality and large-scale preparation of large-scale thin sheet samples, and provides a high thermal conductivity diamond / copper composite material. Preparation

Method used

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  • Preparation method of high-heat-conductivity diamond-copper composite
  • Preparation method of high-heat-conductivity diamond-copper composite
  • Preparation method of high-heat-conductivity diamond-copper composite

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specific Embodiment approach 1

[0045] Specific embodiment one: the preparation method of the high thermal conductivity diamond / copper matrix composite material in this embodiment is carried out according to the following steps:

[0046] Step 1: Weigh the raw diamond powder coated with a coating layer on the surface and put it into the forming mold and perform vibration treatment to make a prefabricated body. The prefabricated body is hoisted on the lower end of the lifting rod in the air pressure infiltration furnace, and the pure The crucible of copper or copper alloy is placed under the prefabricated body in the furnace; or the raw diamond powder is weighed into the forming mold and vibrated to make a prefabricated body, and the prefabricated body is hoisted on the lifting rod in the air pressure infiltration furnace At the lower end, place the crucible containing the copper alloy under the prefabricated body in the furnace;

[0047] The material of the molding die is high-purity graphite or isostatic gra...

specific Embodiment approach 2

[0063] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the mass ratio of the pure copper or copper alloy described in step one and the coated diamond raw powder after the vibration treatment is (0.85~2.07): 1. Other steps and parameters are the same as those in the first embodiment.

specific Embodiment approach 3

[0064] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that the mass ratio of the copper alloy in step 1 to the raw diamond powder after the vibration treatment is (0.85-2.07):1. Other steps and parameters are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses a preparation method of a high-heat-conductivity diamond-copper composite, and relates to a preparation method of a composite. The problems that an existing preparation methodof diamond-copper composite cannot achieve net shape forming, high quality and large batch preparation of large-size sheet samples is solved. The preparation method comprises the steps that diamond powder is placed into a die and compacted to form a precast body, the precast body is hoisted to the lower end of a lifting rod on the upper portion inside an air pressure infiltration furnace, and a crucible containing copper alloy is placed below the precast body in the furnace; vacuumizing is carried out, heating and copper melting are carried out under protection of inert gas, the lifting rod descends, pressurization infiltration is carried out, pressure is kept for cooling, pressure is released, and finally the die is removed. The preparation method has the beneficial effects that high-efficiency mass production can be achieved, the mechanical property is high, the rate of finished products is high, large-size sheet samples can be prepared, sample heat conductivity is improved, the preparation cost is low, the content of impurities is low, and the forming die and the crucible can be repeatedly used. The preparation method is applicable to preparing the high-heat-conductivity diamond-copper composite and component.

Description

technical field [0001] The invention relates to a preparation method of a diamond / copper composite material. Background technique [0002] With the continuous improvement of chip integration, electronic packaging is developing in the direction of miniaturization, light weight and high performance, which makes the operating temperature of the circuit continue to rise, and the heating rate per unit volume of the system continues to increase, resulting in unstable system operation. In order to obtain stable performance, heat dissipation conditions must be improved, so the importance of electronic packaging in the field of microelectronics is increasing, and the demand for new electronic packaging materials is also increasing. High-quality diamond is the material with the highest thermal conductivity known in the world, which can reach 1800-2000W / (m·K), and it is an insulator at room temperature. It also has the characteristics of low dielectric constant and low thermal expansio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C26/00C22C9/00C22C1/10
CPCC22C1/101C22C1/1015C22C1/1036C22C9/00C22C26/00C22C1/1073
Inventor 武高辉芶华松张强林秀丁伟陈国钦修子杨姜龙涛熊美玲
Owner HARBIN INST OF TECH
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