Graphene composite heat-conducting gasket and preparation method thereof

A technology of graphene composite and thermal pads, which is applied in chemical instruments and methods, lamination auxiliary operations, lamination, etc., can solve problems such as delamination, affecting mechanical stability, and high hardness of thermal pads

Active Publication Date: 2021-10-19
CHANGZHOU FUXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the graphene heat conduction film used in the above two methods has a higher thermal conductivity, the densified structure of the graphene heat conduction film leads to a higher hardness of the heat conduction gasket, and a significant increase in the application thermal resistance of the gasket. Secondly, the surface of the graphene he

Method used

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  • Graphene composite heat-conducting gasket and preparation method thereof
  • Graphene composite heat-conducting gasket and preparation method thereof
  • Graphene composite heat-conducting gasket and preparation method thereof

Examples

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preparation example Construction

[0041] In one embodiment, a kind of preparation method of graphene composite thermal pad is provided, comprising:

[0042] a) The graphene thermally conductive foam film is punched into sheets of consistent size, stacked layer by layer and put into a corresponding mold, and pressurized so that the film and the film are tightly bonded;

[0043] b) Apply the adhesive evenly around the pressured foam film so that it is completely covered into a block;

[0044] c) After the block is solidified and formed, it is cut into sheets along the stacking direction, such as image 3 shown;

[0045] d) impregnating the cut sheet in the impregnating glue, taking it out, and hot pressing it;

[0046] e) Trim the edge of the formed sheet, remove the bonding adhesive area on the edge, and obtain a thermal pad prepared by compounding the graphene foam film and the adhesive, such as figure 1 and 2 shown.

[0047] In step b), the adhesive is mainly distributed on the surface of the graphene fo...

Embodiment 1

[0057] In this embodiment, the graphene foam film accounts for 50wt.%, and the adhesive accounts for 50wt.%.

[0058] Graphene foam film thermal conductivity 50W / (m K);

[0059] Graphene foam film thickness 50μm, density 0.12g / cm 3 ;

[0060] The average pore size of the internal pores of the graphene foam film is 10 μm;

[0061] The bonding adhesive is heat-curable epoxy resin with a viscosity of 5000mPa·s and a curing temperature of 80°C;

[0062] The impregnation adhesive is liquid silica gel with a viscosity of 1000mPa·s;

[0063] Hot pressing process, pressure 0.1MPa, curing temperature 150°C;

[0064] After testing, the thermal conductivity of the sample is 22W / (m K), and the applied thermal resistance of samples with different thicknesses is shown in Table 1 below:

[0065] Table 1

[0066] Thickness (mm) Applied thermal resistance (K cm 2 / W)

Embodiment 2

[0068] In this embodiment, the graphene foam film accounts for 95wt.%, and the adhesive accounts for 5wt.%.

[0069] The thermal conductivity of graphene foam film is 400W / (m K);

[0070] Graphene foam film thickness 1000μm, density 0.88g / cm 3 ;

[0071] The average pore size of the internal pores of the graphene foam film is 100 μm;

[0072] The bonding adhesive is heat-curable epoxy resin with a viscosity of 300000mPa s and a curing temperature of 80°C;

[0073] The impregnation adhesive is liquid silica gel with a viscosity of 50mPa·s;

[0074] Hot pressing process, pressure 2.0MPa, curing temperature at room temperature;

[0075] After testing, the thermal conductivity of the sample is 305W / (m K), and the applied thermal resistance of samples with different thicknesses is shown in Table 2 below:

[0076] Table 2

[0077] Thickness (mm) Applied thermal resistance (K cm 2 / W)

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Abstract

The invention provides a graphene composite heat-conducting gasket which comprises a plurality of layers of graphene foam films arranged in the thickness direction and an adhesive, and the graphene foam films account for 50 wt.%-95 wt.%. The invention also provides a preparation method of the graphene composite heat-conducting gasket, wherein the preparation method comprises the steps: stacking the graphene foam films layer by layer and putting the graphene foam films into a mold, and applying pressure to tightly fit the films; uniformly coating the periphery of the graphene heat-conducting foam films subjected to pressure application with the adhesive, so as to completely coating a plurality of layers of graphene heat-conducting foam films into a block body; after the block body is cured and formed, cutting the block body into sheets along the stacking direction; dipping the cut sheets in dipping glue, taking out the sheets, and carrying out hot press molding on the taken-out sheets; and trimming the edge of the formed sheets, and removing an adhesive bonding area on the edge to obtain the graphene composite heat-conducting gasket. The heat-conducting gasket is low in density, high in heat conductivity in the thickness direction and low in heat resistance.

Description

technical field [0001] The invention belongs to the technical field of heat conduction and heat dissipation, and in particular relates to a graphene composite heat conduction gasket and a preparation method thereof. Background technique [0002] Thermal pads, a high-performance gap-fill thermally conductive material, are mainly used for the transfer interface between electronic equipment and heat sinks or product casings. Graphene has good thermal conductivity and can be used as a reinforcement material for thermal pads. There are two main ways to prepare thermal pads using graphene thermal conductive film: one is to stack and bond the graphene thermal conductive film layer by layer with an adhesive, and then cut it into thermal conductive pads, so that the graphene thermal conductive film is aligned along the thickness direction. Arrangement, such as patent document WO2019235983A1; the second is to change the graphene heat conduction film from the plane direction to longit...

Claims

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Application Information

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IPC IPC(8): B32B9/00B32B9/04B32B7/12B32B33/00B32B37/10B32B37/12B32B38/00B32B38/08
CPCB32B5/18B32B7/12B32B5/32B32B33/00B32B37/10B32B37/12B32B38/00B32B38/0004B32B38/08B32B38/0036B32B2266/04B32B2038/0076B32B2307/72B32B2307/302
Inventor 石燕军葛翔李峰卢静李壮周步存
Owner CHANGZHOU FUXI TECH CO LTD
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