Heat-conducting composite material and preparation method thereof

A heat-conducting composite material and slurry technology, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of poor filling performance, difficulty in meeting the needs of high thermal conductivity applications, and decreased flexibility.

Active Publication Date: 2019-01-11
SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the extremely low thermal conductivity of silicone rubber itself (about 0.20W / (m*K)), in order to meet the application requirements of the device, it is often necessary to add a high-quality filler to the matrix material, usually 50%- 80% mass fraction, some even higher, and its achieved thermal conductivity is usually below 5W / (m*K), which is difficult to meet the needs of high thermal conductivity applications
And the addition of ultra-mass ratio fillers will rapidly reduce the flexibility of the system and make the filling performance worse

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0017] The invention provides a method for preparing a heat-conducting composite material, and the heat-conducting composite material is specifically a silicone rubber pad. The preparation method comprises the following steps:

[0018] (1) Adding a coupling agent to spherical fillers and flaky or fibrous fillers to obtain modified spherical fillers and modified flaky or fibrous fillers.

[0019] Preferably, the coupling agent is a silane coupling agent, specifically hexadecyltrimethoxysilyl (9116). It can be understood that the coupling agent can also be other silane coupling agents such as titanate coupling agent, aluminate coupling agent, etc., such as compound monoalkoxy titanate titanium (TC-9 ) or 3-glycidyloxypropyltrimethoxysilane (GLYMO). The surface of the filler after the coupling treatment with the coupling agent is lipophilic.

[0020] The spherical filler includes at least one of micron-sized spherical aluminum oxide, spherical magnesium oxide, spherical silico...

Embodiment 1

[0034] 2 parts by weight of silane coupling agent, 15 parts by weight of ethanol, and 1 part by weight of deionized water were stirred for 30 minutes to obtain solution A; then 100 parts by weight of filler were added to 700 parts by weight of deionized water to obtain solution B , and B was heated to 80°C in a water bath; 5 parts by weight of solution A was added to solution B, and the coupling reaction was carried out at 80°C for 3 hours, cooled, filtered and washed to obtain a lipophilic filler.

[0035] 22 parts by weight of micron carbon fiber (150um in length, 10um in diameter) and 40 parts by weight of spherical alumina (1-5um) after treatment with silane coupling agent, even if the volume ratio of carbon fiber and spherical alumina is 1 : 1, add in the mixed solution of water and ethanol (the water of 300 parts by weight and the ethanol of 200 parts by weight), and stir and mix under the situation of mechanical or magnetic stirring, make carbon fiber and aluminum oxide ...

Embodiment 2

[0038] 2 parts by weight of silane coupling agent, 15 parts by weight of ethanol, and 1 part by weight of deionized water were stirred for 30 minutes to obtain solution A; then 100 parts by weight of filler were added to 700 parts by weight of deionized water to obtain solution B , and B was heated to 80°C in a water bath; 5 parts by weight of solution A was added to solution B, and the coupling reaction was carried out at 80°C for 3 hours, cooled, filtered and washed to obtain a lipophilic filler.

[0039] 110 parts by weight of flaky boron nitride (50 um in lateral dimension, 1-3 um in thickness) and 40 parts by weight of spherical alumina (1-5 um in diameter) after being treated with a silane coupling agent, even if the flaky nitrogen The volume ratio of boron oxide and spherical alumina is 5:1, add water and ethanol to the mixed solution (350 parts by weight of water and 150 parts by weight of ethanol), and stir and mix under the condition of mechanical or magnetic stirring...

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Abstract

The invention provides a method for preparing a heat-conducting composite material. The method comprises the following steps: modifying spherical packing and flake or fiber packing; (2) fully dispersing the modified spherical packing and the modified flake or fiber packing in a mixed solution of water and ethanol, adding an adhesive, and uniformly stirring and mixing to obtain emulsion, wherein avolume ratio of the modified flake or fiber packing to the modified spherical packing is 10:1 to 1:1, and a volume ratio of the adhesive to the modified spherical packing is 1:5 to 1:2; (3) granulating the emulsion by a spray drying tester so as to obtain heat-conducting packing by virtue of continuous stirring; (4) stirring and mixing the heat-conducting packing, vinyl silicone oil, a curing agent, a catalyst and an inhibitor so as to obtain slurry, wherein the mass fraction of the curing agent is 2-5%, and the mass fraction of the catalyst is 0.02-0.05%; and (5) adding the slurry into a moldfor performing high-temperature curing, thereby obtaining the composite material. The invention further provides a heat-conducting composite material prepared by the preparation method.

Description

technical field [0001] The invention relates to the technical field of thermal interface materials, in particular to a heat-conducting composite material and a preparation method thereof. Background technique [0002] With the continuous development of science and technology, especially the rapid development of microelectronics integration technology and high-density printed circuit board assembly technology, the heat generated by electronic devices has increased rapidly. Studies have shown that for every 2°C increase in the working environment temperature of electronic components, the reliability of the components will decrease by 10%. When the working environment temperature reaches 50°C, the service life of the device is only 1 / 6 of that at 25°C. Therefore, in order to ensure the normal operation of electronic equipment, it is required that the generated heat can be conducted out quickly and efficiently. In addition, in order to meet the requirements of modern industry,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K9/06C08K7/06C08K7/18C08K7/00C08K3/38C08K3/08C09K5/14
CPCC08K2003/0806C08K2003/385C08L83/04C08L2205/025C09K5/14C08K9/06C08K7/06C08K7/18C08K7/00C08K3/38C08K3/08
Inventor 杜鸿达李海同陈威康飞宇
Owner SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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